JPS62136564A - Sputtering target - Google Patents

Abstract

PURPOSE:To prevent solder for adhesion from being sucked up between divided target pieces and to improve the cooling efficiency for a target body by chambering the end faces of said pieces intersecting with the adhesive surfaces to a cathode electrode. CONSTITUTION:The target pieces 14 which are divided to plural pieces are arrayed on the cathode electrode 11 in such a manner that the side faces thereof contact each other. The end faces of the pieces 14 where the adhesive surfaces to the electrode 11 and side faces intersect are chamfered 15 prior to the arraying. The pieces 14 and the electrode 11 are then adhered by the solder 13 for adhesion.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a sputtering target, and more particularly to an improvement in a sputtering target having a structure in which a plurality of divided target pieces are adhered onto a cathode electrode.

[Technical background of the invention and its problems 3 Sputtering technology is known as a technology for forming alloy films. In these sputtering techniques, target pieces divided into multiple pieces are used when it is difficult to create a target body with uniform components in a composition ratio that deviates from stoichiometry, such as molybdenum and silicon. .

Conventionally, as a target having a target body made of a combination of the target pieces, for example, as shown in the seventh factor, a plurality of wedge-shaped silicon pieces 1a and molybdenum pieces 1b are alternately combined to form a disk shape. A so-called mosaic target body 2 is used, and this target body 2 is
As shown in the figure, a structure is known in which the electrode is placed on the cathode electrode 3 and fixed at the center and outer periphery with fasteners 5a and 5b having screws 4a and 4b. Also known is a target in which rectangular parallelepiped silicon pieces and molybdenum pieces are alternately combined to form a mosaic target body, and this target body is similarly fixed onto the cathode N pole using a jig. However, in the target having the structure shown in FIG. 8, the target body 2 and the cathode electrode 3 are fixed using screws 3a, 3b and fasteners 4a, 4b, so the cooling efficiency of the target body 2 is reduced. Low and each silicon piece 1a and molybdenum piece 1b
The contact impedance with respect to the cathode electrode 3 becomes uneven, resulting in non-uniform sputtering and variations in composition ratio.

For this reason, it has been considered to fix a target body 2 made up of a plurality of divided target pieces 1 onto a cathode electrode 3 via solder 6, as shown in FIG. However, since each target piece 1 is made very smoothly, when the target body 2 and the cathode electrode 3 are bonded together with molten solder 6, the solder 6 becomes adjacent due to surface tension as shown in FIG. Target piece 1.
It is sucked up from the side of the room to the surface. When film deposition is performed using such a target, the solder 6 sucked up to the surface of the target body 2 is also sputtered at the same time, resulting in the problem that the solder is mixed into the film as an impurity and the purity of the film is significantly reduced.

[Purpose of the invention]

In the present invention, when a target body is bonded and fixed onto a cathode electrode with molten metal such as solder or molten alloy, the solder etc. is sucked up to the surface side of the body from between adjacent target pieces constituting the body due to surface tension. The purpose of the present invention is to provide a sputtering target that is prevented from being damaged.

(Summary of the Invention) The present invention has a structure in which target pieces divided into a plurality of pieces are arranged on a cathode electrode so that their side surfaces are in contact with each other, and each target piece and the cathode electrode are bonded with molten metal or molten alloy. The sputtering target is characterized in that at least one of the ends of each of the target pieces where the adhesive surface with the cathode electrode intersects with the side surface is chamfered.According to the present invention, as described above, When bonding and fixing the target body onto the cathode electrode with molten metal such as solder or molten alloy, as in
To obtain a sputtering target which can prevent solder etc. from being sucked up to the surface side of the main body due to surface tension between adjacent target pieces constituting the main body, and can deposit a high-purity film without contamination with impurities such as solder. be able to.

[Embodiments of the invention]

Embodiments of the present invention will be described in detail below with reference to FIGS. 1 to 3.

11 in the figure is a disk-shaped cathode electrode, and on this cathode electrode 11, as shown in FIG.
Fixed. The target main body 12 is constructed by alternately arranging horizontal silicon pieces 14a and molybdenum pieces 14b, each having a fan-shaped plane as shown in FIG. 2, so that their adjacent side surfaces are in contact with each other. Further, as shown in FIG. 2, each of the silicon pieces 14a and the molybdenum pieces 14b has planar chamfered portions 15.15 formed at both ends where the adhesive surface with the cathode electrode 11 intersects with the side surface.

As shown in FIG. 2, each silicon piece 14a1 and molybdenum piece 14b constituting the target body 12 is formed with planar chamfered portions 15.15 at both ends where the adhesive surface with the cathode electrode 11 and the side surface intersect. With this structure, when the target body 12 is bonded onto the cathode electrode 11 via the solder 13, the solder 13 accumulates in the space formed by the chamfered portion 15.15, as shown in FIG. It is possible to prevent the particles from passing between the silicon pieces 14a and the molybdenum pieces 14b and being sucked up onto the target body 12. Therefore, when film deposition is performed using such a target, the solder 13 does not wick up onto the surface of the target body 12, so that a high purity molybdenum silicide film can be deposited without solder being mixed into the film as an impurity. .

Further, since the target body 12 is bonded and fixed to the cathode electrode 11 with solder 13, the cooling efficiency of the target body 12 can be improved, and each silicon piece 14a
The contact impedance of each molybdenum piece 14b to the cathode electrode 11 becomes uniform, and a molybdenum silicide film having a predetermined composition ratio can be deposited by uniform sputtering.

In the above embodiment, the target piece was chamfered at both ends where the side surface and the surface to be bonded to the cathode electrode intersect, but as shown in FIG. A flat chamfered portion 15 at one end where it intersects.
Silicon piece 14a1 formed with molybdenum piece 14b (chamfered portion to silicon piece 14a is not shown here)
It is also possible to achieve the same effect as in the embodiment by using . Further, as shown in FIG. 5, a silicon piece 14a, a molybdenum piece 14
A rounded chamfered portion 15' may be formed at b.

In the above embodiment, a horizontal target piece with a fan-shaped plane was used, but a rectangular parallelepiped target piece 14 may also be used as shown in FIG.

In the above embodiment, two kinds of target pieces made of silicon and molybdenum were used, but other combinations of target pieces, such as silicon and tungsten, silicon and tantalum, etc., may be used.

In the above embodiments, the cathode electrode and the target body are bonded by solder, but they may be bonded by other molten alloys or molten metals.

〔Effect of the invention〕

As described in detail above, according to the present invention, when a target body is bonded and fixed onto a cathode electrode with molten metal such as solder or molten alloy, the solder or the like is applied between adjacent target pieces constituting the body due to surface tension. This prevents the target from being sucked up to the surface of the main body, which in turn improves the cooling efficiency of the target main body, improves the contact impedance between each target piece and the cathode electrode, and achieves high-purity film deposition without contamination with adhesive alloys, etc. A sputtering target that can be used can be provided.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a target showing another embodiment of the present invention, and FIG. 6 is a perspective view of a target piece showing still another embodiment of the present invention. FIG. 7 is a perspective view showing a disk-shaped mosaic target body, FIG. 8 is a perspective view showing a target in which the target body shown in FIG. 7 is fixed to a cathode electrode using a conventional screw fastening method, and FIG. FIG. 2 is a cross-sectional view showing a target in which a target body and a cathode electrode are bonded and fixed using conventional solder. 11... Cathode electrode, 12... Mosaic target body, 13... Solder, 14a... Silicon piece,
14b...Molybdenum piece, 14...Target piece,
15.15'... Chamfered part. Applicant's Representative Patent Attorney Takehiko Suzue Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 9

Claims (1)

[Claims] In a sputtering target having a structure in which target pieces divided into a plurality of pieces are arranged on a cathode electrode so that their side surfaces are in contact with each other, and each target piece and the cathode electrode are bonded to each other with molten metal or molten alloy, in each target piece. A sputtering target characterized by chamfering at least one of the ends where the side surface intersects with the surface to be bonded to the cathode electrode.