JPS62131551A - ヒ−トシンク着脱方法 - Google Patents
ヒ−トシンク着脱方法Info
- Publication number
- JPS62131551A JPS62131551A JP27307285A JP27307285A JPS62131551A JP S62131551 A JPS62131551 A JP S62131551A JP 27307285 A JP27307285 A JP 27307285A JP 27307285 A JP27307285 A JP 27307285A JP S62131551 A JPS62131551 A JP S62131551A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- solder
- heat
- semiconductor element
- detaching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27307285A JPS62131551A (ja) | 1985-12-03 | 1985-12-03 | ヒ−トシンク着脱方法 |
| US06/914,942 US4879632A (en) | 1985-10-04 | 1986-10-03 | Cooling system for an electronic circuit device |
| DE86307669T DE3688962T2 (de) | 1985-10-04 | 1986-10-03 | Kühlsystem für eine elektronische Schaltungsanordnung. |
| EP86307669A EP0217676B1 (en) | 1985-10-04 | 1986-10-03 | Cooling system for electronic circuit device |
| US07/079,877 US4783721A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/079,876 US4920574A (en) | 1985-10-04 | 1987-07-30 | Cooling system for an electronic circuit device |
| US07/261,904 US5126919A (en) | 1985-10-04 | 1988-10-25 | Cooling system for an electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27307285A JPS62131551A (ja) | 1985-12-03 | 1985-12-03 | ヒ−トシンク着脱方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62131551A true JPS62131551A (ja) | 1987-06-13 |
| JPH0334865B2 JPH0334865B2 (enExample) | 1991-05-24 |
Family
ID=17522751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27307285A Granted JPS62131551A (ja) | 1985-10-04 | 1985-12-03 | ヒ−トシンク着脱方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62131551A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180458A (ja) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置 |
| CN115992968A (zh) * | 2023-03-10 | 2023-04-21 | 上海瞳亮科技有限责任公司 | 一种相变储热式取暖器及使用方法 |
-
1985
- 1985-12-03 JP JP27307285A patent/JPS62131551A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180458A (ja) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置 |
| CN115992968A (zh) * | 2023-03-10 | 2023-04-21 | 上海瞳亮科技有限责任公司 | 一种相变储热式取暖器及使用方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334865B2 (enExample) | 1991-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1307715C (zh) | 使用波动焊接工艺固定母板芯片组散热器 | |
| US6374616B2 (en) | Heat exchanger | |
| US8791564B2 (en) | Method of Manufacturing a semiconductor module and device for the same | |
| CN106856180B (zh) | 一种焊接igbt模块的方法 | |
| JPS62131551A (ja) | ヒ−トシンク着脱方法 | |
| CN101465330A (zh) | 金属热界面材料及含有该材料的散热模块与封装微电子 | |
| US7199329B2 (en) | Method of soldering semiconductor part and mounted structure of semiconductor part | |
| JPH0423456A (ja) | 部品冷却装置 | |
| JP6710155B2 (ja) | パワー半導体モジュール及びパワー半導体モジュールの製造方法 | |
| JPH07335798A (ja) | Lsi冷却構造 | |
| JPH0335832B2 (enExample) | ||
| JPS6228069A (ja) | レ−ザはんだ付け方法 | |
| CN101546020B (zh) | 光学器件组装系统及固定光学元件的方法 | |
| JP2870506B2 (ja) | バンプ付きワークの半田付け方法 | |
| JPH08264929A (ja) | バンプ溶融接続構造 | |
| JPS62216349A (ja) | 伝導冷却機構の脱着方法 | |
| JPH0354030B2 (enExample) | ||
| JPH09223847A (ja) | 光半導体素子モジュール | |
| JPS6245155A (ja) | 冷却された半導体装置 | |
| JPH0617313Y2 (ja) | 液冷形半導体パッケージ | |
| JPS62290886A (ja) | イオンミリング装置 | |
| JPH04343254A (ja) | ヒートパイプ式冷却器 | |
| JPH0323061A (ja) | ヒートシンクの接合方法 | |
| JPH1070361A (ja) | 半田付け方法及び装置 | |
| JPH0411757A (ja) | 混成集積回路装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |