JPS621240Y2 - - Google Patents
Info
- Publication number
- JPS621240Y2 JPS621240Y2 JP1982054407U JP5440782U JPS621240Y2 JP S621240 Y2 JPS621240 Y2 JP S621240Y2 JP 1982054407 U JP1982054407 U JP 1982054407U JP 5440782 U JP5440782 U JP 5440782U JP S621240 Y2 JPS621240 Y2 JP S621240Y2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plating liquid
- printed wiring
- wiring board
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5440782U JPS58160271U (ja) | 1982-04-16 | 1982-04-16 | 微小孔を有するプリント配線基板のメッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5440782U JPS58160271U (ja) | 1982-04-16 | 1982-04-16 | 微小孔を有するプリント配線基板のメッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58160271U JPS58160271U (ja) | 1983-10-25 |
| JPS621240Y2 true JPS621240Y2 (enExample) | 1987-01-13 |
Family
ID=30065030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5440782U Granted JPS58160271U (ja) | 1982-04-16 | 1982-04-16 | 微小孔を有するプリント配線基板のメッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58160271U (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0680199B2 (ja) * | 1987-12-21 | 1994-10-12 | イビデン株式会社 | プリント配線基板用のめっき処理装置 |
| KR101122793B1 (ko) | 2009-11-09 | 2012-03-21 | 주식회사 케이씨텍 | 기판도금장치 |
-
1982
- 1982-04-16 JP JP5440782U patent/JPS58160271U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58160271U (ja) | 1983-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8329006B2 (en) | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating | |
| US7947161B2 (en) | Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes | |
| KR19990036494A (ko) | 도금방법 | |
| EP1438446B1 (en) | System and method for electrolytic plating | |
| JPS621240Y2 (enExample) | ||
| CA1097823A (en) | Cleaning of high aspect ratio through holes in multilayer printed circuit boards | |
| US6265020B1 (en) | Fluid delivery systems for electronic device manufacture | |
| JPH0354887A (ja) | プリント基板の微小孔処理方法及びその装置 | |
| AT396311B (de) | Vorrichtung zur kontinuierlichen oberflaechenbehandlung und durchkontaktierung von leiterplatten | |
| JPS6147918B2 (enExample) | ||
| JPS6347794B2 (enExample) | ||
| JP3880704B2 (ja) | バンプ接点を有する回路基板の製造方法およびそれに用いる噴流式めっき装置 | |
| JPH0458196B2 (enExample) | ||
| JPS62202099A (ja) | プリント基板のメツキ装置 | |
| JP2541481B2 (ja) | 噴流めっき装置 | |
| JPS639035B2 (enExample) | ||
| JPH0243399A (ja) | 電気めっき槽 | |
| JPH0241873Y2 (enExample) | ||
| JPS5858293A (ja) | 微小孔を有するメツキ物のメツキ装置 | |
| JPS63238283A (ja) | セラミツクパツケ−ジの部分メツキ方法及びその装置 | |
| JP2526163B2 (ja) | 両面部分メッキ装置 | |
| JPH0748587B2 (ja) | プリント配線板の電気メッキ方法及びその装置 | |
| JP2003247099A (ja) | 回路基板のめっき方法 | |
| JPS5858292A (ja) | 微小孔を有するメツキ物のメツキ装置 | |
| JPH049500A (ja) | 電気めっき装置 |