JPS62120359U - - Google Patents

Info

Publication number
JPS62120359U
JPS62120359U JP835486U JP835486U JPS62120359U JP S62120359 U JPS62120359 U JP S62120359U JP 835486 U JP835486 U JP 835486U JP 835486 U JP835486 U JP 835486U JP S62120359 U JPS62120359 U JP S62120359U
Authority
JP
Japan
Prior art keywords
tab portion
package resin
semiconductor device
heat sink
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP835486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP835486U priority Critical patent/JPS62120359U/ja
Publication of JPS62120359U publication Critical patent/JPS62120359U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す平面図、第2
図は従来のこの種の半導体装置の一例のタブの形
状を示す平面図である。 1……パツケージ樹脂、2……タブ部、3……
タブ吊りリード、4……外部リード、5……放熱
板、51……切り欠き、52……穴。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a plan view showing the shape of a tab of an example of a conventional semiconductor device of this type. 1...Package resin, 2...Tab portion, 3...
Tab suspension lead, 4... External lead, 5... Heat sink, 51... Notch, 52... Hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] タブ部に載置したチツプから発生する熱がパツ
ケージ樹脂を介して放熱される半導体装置におい
て、前記タブ部に一体にパツケージ樹脂に覆われ
る領域内に放熱板を設けたことを特徴とする半導
体装置。
A semiconductor device in which heat generated from a chip placed on a tab portion is dissipated via a package resin, characterized in that a heat sink is provided integrally with the tab portion in a region covered with the package resin. .
JP835486U 1986-01-23 1986-01-23 Pending JPS62120359U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP835486U JPS62120359U (en) 1986-01-23 1986-01-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP835486U JPS62120359U (en) 1986-01-23 1986-01-23

Publications (1)

Publication Number Publication Date
JPS62120359U true JPS62120359U (en) 1987-07-30

Family

ID=30792651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP835486U Pending JPS62120359U (en) 1986-01-23 1986-01-23

Country Status (1)

Country Link
JP (1) JPS62120359U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135574A (en) * 1977-05-02 1978-11-27 Hitachi Ltd Lead frame
JPS6020946U (en) * 1983-07-21 1985-02-13 トヨタ自動車株式会社 car accessory case

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53135574A (en) * 1977-05-02 1978-11-27 Hitachi Ltd Lead frame
JPS6020946U (en) * 1983-07-21 1985-02-13 トヨタ自動車株式会社 car accessory case

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