JPS6211495B2 - - Google Patents
Info
- Publication number
- JPS6211495B2 JPS6211495B2 JP14497077A JP14497077A JPS6211495B2 JP S6211495 B2 JPS6211495 B2 JP S6211495B2 JP 14497077 A JP14497077 A JP 14497077A JP 14497077 A JP14497077 A JP 14497077A JP S6211495 B2 JPS6211495 B2 JP S6211495B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plate
- storage section
- wafer storage
- door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 65
- 230000007246 mechanism Effects 0.000 claims description 47
- 238000003860 storage Methods 0.000 claims description 35
- 238000001035 drying Methods 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 11
- 238000013459 approach Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 13
- 238000005530 etching Methods 0.000 description 5
- 230000005693 optoelectronics Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14497077A JPS5478079A (en) | 1977-12-05 | 1977-12-05 | Wafer washing and drying unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14497077A JPS5478079A (en) | 1977-12-05 | 1977-12-05 | Wafer washing and drying unit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5478079A JPS5478079A (en) | 1979-06-21 |
JPS6211495B2 true JPS6211495B2 (enrdf_load_stackoverflow) | 1987-03-12 |
Family
ID=15374422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14497077A Granted JPS5478079A (en) | 1977-12-05 | 1977-12-05 | Wafer washing and drying unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5478079A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55154736A (en) * | 1979-05-23 | 1980-12-02 | Sigma Gijutsu Kogyo Kk | Centrifugal drier |
JPS563424U (enrdf_load_stackoverflow) * | 1979-06-20 | 1981-01-13 | ||
JPS5954925U (ja) * | 1982-10-01 | 1984-04-10 | 東邦化成株式会社 | ウエ−ハ用回転乾燥装置 |
JPS59171337U (ja) * | 1983-04-30 | 1984-11-16 | 東京エレクトロン株式会社 | 半導体ウエハ洗浄装置 |
JPH0229720Y2 (enrdf_load_stackoverflow) * | 1987-07-08 | 1990-08-09 | ||
CN102679714A (zh) * | 2012-05-30 | 2012-09-19 | 无锡市优耐特石化装备有限公司 | 一种带连接圈的甩干机内桶 |
-
1977
- 1977-12-05 JP JP14497077A patent/JPS5478079A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5478079A (en) | 1979-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5351360A (en) | Cleaning device for a wafer mount plate | |
US6012470A (en) | Method of drying a wafer | |
EP0893819B1 (en) | Apparatus and method for washing substrate | |
US6143089A (en) | Method of cleaning semiconductor wafers and other substrates | |
KR102000019B1 (ko) | 액 공급 유닛, 기판 처리 장치, 기판 처리 방법 | |
KR19980070712A (ko) | 회전처리장치 | |
US4941489A (en) | Carrier cleaning and drying apparatus | |
WO2002004136A1 (en) | Dual cassette centrifugal processor | |
US6245156B1 (en) | Substrate transport method and apparatus, and substrate processing system | |
JPS6211495B2 (enrdf_load_stackoverflow) | ||
JPH0929189A (ja) | 洗浄装置 | |
JP2758558B2 (ja) | ウェーハハンドリング装置 | |
US20050183754A1 (en) | Apparatus for and method of cleaning substrate | |
WO2013054838A1 (ja) | 液処理装置および液処理方法 | |
JP2909432B2 (ja) | スピン洗浄処理ユニット | |
KR920010691B1 (ko) | 접촉완충장치 부착 세정장치 | |
WO2017155744A1 (en) | Multiple wafer rotary processing | |
KR20180058390A (ko) | 기판 처리 장치 및 기판 처리 방법 | |
JPH0997780A (ja) | スピン乾燥処理装置 | |
KR102303597B1 (ko) | 세정 용기 및 이를 가지는 기판 처리 장치 | |
JPH104079A (ja) | 基板処理装置 | |
JP2616899B2 (ja) | 基板処理装置および基板処理方法 | |
JP2548552B2 (ja) | 基板保持機構 | |
JPH10335279A (ja) | 洗浄装置 | |
KR20180122518A (ko) | 기판 처리 장치 |