JPS62114450U - - Google Patents
Info
- Publication number
- JPS62114450U JPS62114450U JP1986001467U JP146786U JPS62114450U JP S62114450 U JPS62114450 U JP S62114450U JP 1986001467 U JP1986001467 U JP 1986001467U JP 146786 U JP146786 U JP 146786U JP S62114450 U JPS62114450 U JP S62114450U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor device
- transfer molding
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986001467U JPS62114450U (enExample) | 1986-01-09 | 1986-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986001467U JPS62114450U (enExample) | 1986-01-09 | 1986-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62114450U true JPS62114450U (enExample) | 1987-07-21 |
Family
ID=30779403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986001467U Pending JPS62114450U (enExample) | 1986-01-09 | 1986-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62114450U (enExample) |
-
1986
- 1986-01-09 JP JP1986001467U patent/JPS62114450U/ja active Pending
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