JPS6157530U - - Google Patents
Info
- Publication number
- JPS6157530U JPS6157530U JP1984141306U JP14130684U JPS6157530U JP S6157530 U JPS6157530 U JP S6157530U JP 1984141306 U JP1984141306 U JP 1984141306U JP 14130684 U JP14130684 U JP 14130684U JP S6157530 U JPS6157530 U JP S6157530U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- lead frame
- semiconductor
- molded block
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W74/00—
-
- H10W74/10—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984141306U JPS6157530U (enExample) | 1984-09-18 | 1984-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984141306U JPS6157530U (enExample) | 1984-09-18 | 1984-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6157530U true JPS6157530U (enExample) | 1986-04-17 |
Family
ID=30699649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984141306U Pending JPS6157530U (enExample) | 1984-09-18 | 1984-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6157530U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5460564A (en) * | 1977-10-24 | 1979-05-16 | Hitachi Ltd | Resin mold semiconductor device |
-
1984
- 1984-09-18 JP JP1984141306U patent/JPS6157530U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5460564A (en) * | 1977-10-24 | 1979-05-16 | Hitachi Ltd | Resin mold semiconductor device |