JPS62114058U - - Google Patents
Info
- Publication number
- JPS62114058U JPS62114058U JP186686U JP186686U JPS62114058U JP S62114058 U JPS62114058 U JP S62114058U JP 186686 U JP186686 U JP 186686U JP 186686 U JP186686 U JP 186686U JP S62114058 U JPS62114058 U JP S62114058U
- Authority
- JP
- Japan
- Prior art keywords
- target
- sputtering apparatus
- shield plate
- plasma
- holds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP186686U JPS62114058U (el) | 1986-01-09 | 1986-01-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP186686U JPS62114058U (el) | 1986-01-09 | 1986-01-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62114058U true JPS62114058U (el) | 1987-07-20 |
Family
ID=30780172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP186686U Pending JPS62114058U (el) | 1986-01-09 | 1986-01-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62114058U (el) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010116605A (ja) * | 2008-11-13 | 2010-05-27 | Fujikura Ltd | ターゲット保持装置、ならびにこれを用いた成膜装置および成膜方法 |
WO2014132308A1 (ja) * | 2013-02-28 | 2014-09-04 | キヤノンアネルバ株式会社 | スパッタリング装置 |
JP2016003388A (ja) * | 2014-06-19 | 2016-01-12 | 東京エレクトロン株式会社 | 板状部材の固定機構、pvd処理装置及び板状部材の固定方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS579872A (en) * | 1980-06-19 | 1982-01-19 | Oki Electric Ind Co Ltd | Evaporation source for sputtering |
-
1986
- 1986-01-09 JP JP186686U patent/JPS62114058U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS579872A (en) * | 1980-06-19 | 1982-01-19 | Oki Electric Ind Co Ltd | Evaporation source for sputtering |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010116605A (ja) * | 2008-11-13 | 2010-05-27 | Fujikura Ltd | ターゲット保持装置、ならびにこれを用いた成膜装置および成膜方法 |
WO2014132308A1 (ja) * | 2013-02-28 | 2014-09-04 | キヤノンアネルバ株式会社 | スパッタリング装置 |
US9368331B2 (en) | 2013-02-28 | 2016-06-14 | Canon Anelva Corporation | Sputtering apparatus |
JP5934427B2 (ja) * | 2013-02-28 | 2016-06-15 | キヤノンアネルバ株式会社 | スパッタリング装置 |
JP2016003388A (ja) * | 2014-06-19 | 2016-01-12 | 東京エレクトロン株式会社 | 板状部材の固定機構、pvd処理装置及び板状部材の固定方法 |
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