JPS62108595A - Wiring substrate - Google Patents
Wiring substrateInfo
- Publication number
- JPS62108595A JPS62108595A JP24707685A JP24707685A JPS62108595A JP S62108595 A JPS62108595 A JP S62108595A JP 24707685 A JP24707685 A JP 24707685A JP 24707685 A JP24707685 A JP 24707685A JP S62108595 A JPS62108595 A JP S62108595A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- pattern
- wiring substrate
- conductive metal
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、配線基板に係り、特に、大電流回路が可能な
、導体の幅、厚さの大きい配線基板に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a wiring board, and particularly to a wiring board with large conductor width and thickness, which is capable of a large current circuit.
従来の厚板利用による配線基板は、特開昭５７−１７８
３９８号に記載の様に、所要の配線パターンと、これら
を連結する如く形成した付加パターンとからなる形状に
打抜いた接着剤付導体板を基板に接着し、しかる後に付
加パターン部を基板とともに穿孔により切断し、所要の
配線パターンを得る方式が提案されている。The conventional wiring board using a thick board is disclosed in Japanese Patent Application Laid-open No. 57-178.
As described in No. 398, an adhesive-backed conductor plate punched into a shape consisting of a required wiring pattern and an additional pattern formed to connect these is adhered to a substrate, and then the additional pattern portion is attached to the substrate. A method has been proposed in which the required wiring pattern is obtained by cutting by drilling.
この方法では、あらかじめパターン加工された導体板を
基板に接着するため、複雑形状で、剛性のない導体板の
ハンドリング動作が必要となるとともに、不要の付加パ
ターン部を接着後、削除する工程が必要とするという欠
点があった。In this method, a pre-patterned conductor plate is bonded to the board, so it is necessary to handle the conductor plate, which has a complex shape and lacks rigidity, and also requires a process to delete unnecessary additional pattern parts after bonding. There was a drawback that.
本発明の目的は、配線基板に関して、特に、大電流回路
が可能な、導体幅、厚さの大きい配線基板を提供するこ
とにある。An object of the present invention is to provide a wiring board, in particular, a wiring board with large conductor width and thickness, which is capable of large current circuits.
ＴＬ（−’ｌ：ｌ’、、 ニ
ー〔Ａ明の概要〕
本発明は、絶縁板の片面あるいは、両面に導電性金属を
溶射することにより、指定のパターン回路を形成させる
ことにより配線基板とする方式とすることにより、流す
回路電流・電圧にあわせた導体部幅及び厚さが選択可能
としたものである。TL (-'l:l',, nee [Summary of A Ming]) The present invention forms a specified pattern circuit by thermally spraying a conductive metal on one or both sides of an insulating plate, thereby forming a wiring board. By using this method, the width and thickness of the conductor part can be selected according to the circuit current and voltage flowing.
以下、本発明の実施例を第１〜３図により説明する。絶
縁板２を固定するテーブル４と、制御盤７により各軸が
制御されるロボット８、このロボット８のハンド部９に
溶射ノズル５が固定され、溶射制御装置６により溶射ノ
ズル５の溶射条件が制御される構成の装置において、絶
縁板２が、テーブル４上の所定の位置に固定される。こ
の絶縁板２上に、溶射ノズル５より、導電性金属３が溶
射される。この時、溶射ノズル５がロボット８の動きに
より、自由に位置制御されるため、あらかじめ希望のパ
ターンを制御盤７に入力しておくことによって、導電性
金属３は、所定の回路パターンを形成する。これにより
配線基板１が製作される。また、回路パターンに流れる
電流、電圧により、導電性金属３の幅Ｗ、厚さＴは、決
定され、これは、溶射制御装置６の溶射条件設定と、ロ
ボット８の動作速度、動作回数等の制御によりフレキシ
ブルに加工可能となる。Embodiments of the present invention will be described below with reference to FIGS. 1 to 3. A table 4 for fixing the insulating plate 2, a robot 8 whose respective axes are controlled by a control panel 7, a thermal spray nozzle 5 fixed to a hand portion 9 of the robot 8, and a thermal spraying control device 6 to control the thermal spraying conditions of the thermal spraying nozzle 5. In the controlled configuration of the device, an insulating plate 2 is fixed in place on a table 4. A conductive metal 3 is thermally sprayed onto this insulating plate 2 from a thermal spray nozzle 5 . At this time, since the position of the spray nozzle 5 is freely controlled by the movement of the robot 8, by inputting a desired pattern into the control panel 7 in advance, the conductive metal 3 forms a predetermined circuit pattern. . In this way, the wiring board 1 is manufactured. In addition, the width W and thickness T of the conductive metal 3 are determined by the current and voltage flowing through the circuit pattern. Control allows for flexible processing.
本実施例によれば、溶射ノズル５の位置決めにロボット
８を用いているため、絶縁板２の大きさや、回路パター
ンの変化にもフレキシブルに対応できるという効果があ
る。According to this embodiment, since the robot 8 is used for positioning the thermal spray nozzle 5, it is possible to flexibly respond to changes in the size of the insulating plate 2 and the circuit pattern.
本発明によれば、導電性金属の溶射条件の選定により溶
射金属幅及び厚さを自由に選択可能となるため、大電流
を流すことが出来る回路パターンが自在に製作できると
いう効果がある。According to the present invention, since the width and thickness of the sprayed metal can be freely selected by selecting the thermal spraying conditions for the conductive metal, there is an effect that a circuit pattern that can flow a large current can be freely manufactured.
Claims (1)
し、指定の回路パターンが形成されてなることを特徴と
する配線基板。1. A wiring board characterized in that a conductive metal is thermally sprayed on one or both sides of an insulating plate to form a designated circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24707685A JPS62108595A (en) | 1985-11-06 | 1985-11-06 | Wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24707685A JPS62108595A (en) | 1985-11-06 | 1985-11-06 | Wiring substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62108595A true JPS62108595A (en) | 1987-05-19 |
Family
ID=17158070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24707685A Pending JPS62108595A (en) | 1985-11-06 | 1985-11-06 | Wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62108595A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7833567B2 (en) * | 2001-01-19 | 2010-11-16 | Yazaki Corporation | Method for forming electrical circuit by jetting molten metal |
-
1985
- 1985-11-06 JP JP24707685A patent/JPS62108595A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7833567B2 (en) * | 2001-01-19 | 2010-11-16 | Yazaki Corporation | Method for forming electrical circuit by jetting molten metal |
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