JP3025340U - Controller board for DC brushless motor - Google Patents

Abstract

Provided is a controller board for a DC brushless motor, which is a type in which a solder plating layer is provided on the surface of a power line and which can prevent formation of a solder bridge and movement of surface-mounted electronic components during soldering. . SOLUTION: A power line 2 is located at positions 2a and 2b where electronic components 6 and 7a cross the power line 2 and a lead line clinch portion 6b of the electronic component 6 is adjacent to the power line 2.
b, a portion 2d around the electrode portion 2a of the power line 2
Solder resist 9 is applied without passing through the solder plating layer 3,
The solder plating layer 3 is provided on the other surface of the power line portion.

Description

[Detailed description of the device]

[0001]

[Technical field to which the device belongs]

 The present invention relates to a DC brushless motor controller board for controlling a DC brushless motor.

[0002]

[Prior art]

 When a DC brushless motor controller board on which surface-mounted electronic components are mounted is designed to have a large output, a large current usually flows into the power line composed of the printed wiring layer of the board, and the power line generates heat. It is necessary to reduce the resistance of the power line.

There are the following means for reducing the resistance of the power line.

(A) The pattern width of the power line on the substrate body is widened.

(B) The thickness of the power line on the substrate body is increased.

(C) Solder plating is performed on the entire surface of the power line on the substrate body.

FIG. 4A shows a state in which a solder plating layer (hatched portion) 3 is provided on the entire surface of each power line 2 on the surface of the substrate body 1, and FIG. The solder plating layer 3 is provided on the entire surface of each power line 2 on the back surface of the. In this example, a signal line 4 made of a printed wiring layer is provided on the back surface of the substrate body 1. The signal line 4 is not provided with the solder plating layer 3.

In these FIGS. 4A and 4B, 5 is a power electronic component such as a MOS FET or a bipolar transistor connected to the power line 2, and 6 is provided across the power line 2 because of space. An electronic component with a lead wire such as a resistor with a lead wire, 7a is a surface mount such as a chip resistor that is arranged across the vertical power line 2 and is connected to the horizontal power line 2 on both sides. The electronic component 7b is a surface-mounted electronic component such as a chip resistor connected between the vertically oriented power lines 2.

When the solder plating layer 3 is provided on the surface of the power line 2, a solder resist 9 for preventing solder adhesion is provided on the surface of the solder plating layer 3 for electrical insulation from other components. There is.

[0010]

[Problems to be solved by the device]

 However, each of the above-mentioned means has the following problems.

The means (a) increases the size of the substrate.

The unit (B) increases the unit price of the substrate.

When there is no solder resist on the solder plating layer 3 by the means of (c), as shown in FIG. 5 (A), the clinch portion of the power line 2 and the lead wire 6a in the electronic component 6 with the lead wire is formed. 6b, a solder bridge 8a is generated during soldering, or as shown in FIG. 5B, at a position of the surface mount electronic component 7a which crosses the vertically oriented power line 2, the surface mount electronic component 7a is disposed horizontally. A solder bridge 8b may occur when connecting the power lines 2 by soldering.

When the solder resist 9 is provided on the solder plating layer 3 as shown in FIGS. 4 (B) and 6, by means of (C), as shown in FIGS. 6 (A) and 6 (B), When soldering the surface mount electronic component 7b, the solder plating layer 3 under the solder resist 9 is melted, and the surface mount electronic component 7b also moves because the solder resist 9 on the surface moves.

An object of the present invention is to provide a controller board for a DC brushless motor, which is a type in which a solder plating layer is provided on the surface of a power line and which can prevent the formation of a solder bridge and the movement of surface mount electronic components during soldering. Especially.

[0016]

[Means for Solving the Problems]

 The present invention is a DC brushless device having a structure in which a plurality of electronic components are mounted on a substrate body for controlling a brushless motor, and these electronic components are connected to a substrate body by a power line and a signal line provided by printed wiring. This is to improve the motor controller board.

In the controller board for a DC brushless motor according to the present invention, the power line includes a portion where the electronic component crosses the power line, a portion where the lead wire clinch portion of the electronic component is adjacent, and the power line. Solder resist is applied to the periphery of the electrode part without using the solder plating layer, and the solder plating layer is provided on the other surface of the power line part.

In this way, when the solder resist is applied to the surface of the power line portion where the electronic component crosses the power line without interposing the solder plating layer, when the electronic component is a surface mount electronic component, it intersects. Prevents the formation of solder bridges between facing power lines. Further, when the electronic component is an electronic component with a lead wire, it is possible to prevent a solder bridge from occurring between the lead wire and the power line.

In addition, when a solder resist is applied to the surface of the power line portion of the electronic component with a lead wire adjacent to the lead wire clinch portion without a solder plating layer, the power line and the lead wire clinch are soldered. It is possible to prevent a solder bridge from forming between the parts.

Further, if solder resist is applied to a portion around the electrode portion of the power line without a solder plating layer, the solder plating layer under the solder resist is melted when the surface mount component is soldered, and the solder on the surface is soldered. You can move the resist and prevent the surface mount components from moving.

[0021]

[Embodiment of device]

 1 (A) (B) to FIG. 3 (A) (B) show an example of an embodiment of a controller board for a DC brushless motor according to the present invention.

In the controller board for the DC brushless motor of the present example, the power line 2 has a portion 2 a where the leaded electronic component 6 crosses the power line 2 as shown in FIG. (B) and FIGS. 2 to 3 (A) and (B), the vertical power line 2 is crossed by the surface mount electronic component 7a at a portion 2b, and as shown in FIG. 6 lead wire clinch portion 6b is adjacent to the portion 2c, as shown in FIGS. 1 (A) (B) to 3 (A) (B), solder to the power line 2 around the electrode portion 2d. Solder resist 9 is applied without a plating layer, and the solder plating layer 3 is provided on the surface of the power line portion other than the solder resist 9.

In this way, as shown in FIG. 1 (A), the position 2 a across which the electronic component 6 with a lead wire crosses on the power line 2 and FIG. 1 (B) and FIGS. As shown in the drawing, when the solder resist 9 is applied to the surface of the portion of the power line 2 at the portion 2b where the surface-mounted electronic component 7a crosses the vertical power line 2 without the solder plating layer 3, the electronic component becomes a surface-mounted electronic component. In the case of 7a, it is possible to prevent a solder bridge from occurring between the power lines 2 and 2 in the intersecting directions. In addition, when the electronic component is the electronic component 6 with a lead wire, it is possible to prevent a solder bridge from occurring between the lead wire 6a and the power line 2.

Further, as shown in FIG. 1B, the solder resist 9 is provided on the surface of the power line portion 2c where the lead wire clinch portion 6b of the electronic component 6 with a lead wire is adjacent, without the solder plating layer 3 interposed therebetween. By applying, it is possible to prevent a solder bridge from occurring between the power line 2 and the lead wire clinch portion 6b during soldering.

Further, as shown in FIGS. 2 and 3A and 3B, when a solder resist 9 is applied to a portion 2d around the electrode portion 2a of the power line 2 without the solder plating layer 3, the surface mounting is performed. It is possible to prevent the solder plating layer 3 under the solder resist 9 from being melted during the soldering of the component 7a to move the solder resist 9 on the surface and to move the surface mount component 7a.

[0026]

[Effect of device]

 In the controller board for a DC brushless motor according to the present invention, the solder resist is applied to the surface of the power line portion where the electronic component crosses over the power line without using the solder plating layer. In this case, it is possible to prevent a solder bridge from occurring between the power lines in the intersecting directions. Further, when the electronic component is an electronic component with a lead wire, it is possible to prevent a solder bridge from occurring between the lead wire and the power line.

Further, since the solder resist is applied to the surface of the power line portion where the clinch portion of the lead wire of the electronic component with the lead wire is adjacent, without using the solder plating layer, the power line and the lead are attached at the time of soldering. It is possible to prevent a solder bridge from forming between the wire clinch part.

Furthermore, since the solder resist is applied to the area around the electrode portion of the power line without interposing the solder plating layer, the solder plating layer under the solder resist is melted when the surface mount component is soldered, It is possible to prevent the surface mount component from being moved by moving the solder resist of.

[Brief description of drawings]

1A and 1B are a front view and a bottom view of an example of an embodiment of a controller board for a DC brushless motor according to the present invention.

FIG. 2 is a partially enlarged view of FIG.

3A is a sectional view taken along line XX of FIG. 2, and FIG.
3 is a sectional view taken along line YY of FIG.

4A and 4B are a front view and a bottom view of a conventional controller board for a DC brushless motor.

FIG. 5A is an explanatory view showing a state of forming a solder bridge between a power line and a lead wire clinch portion in a conventional controller board for a DC brushless motor, and FIG.
FIG. 3 is an explanatory diagram showing a formation state of a solder bridge between an electrode portion of a signal line and an adjacent power line.

6 is a sectional view taken along line ZZ of FIG. 4 (B).

[Explanation of symbols]

 1 board body 2 power line 2a location where electronic component with lead wire crosses 2b location where electronic component with surface mount crosses 2c location where lead wire clinch part is adjacent 2d location around electrode part of power line 3 solder plating layer 4 signal Line 4a Electrode part 5 Power electronic part 6 Electronic part with lead wire 6a Lead wire 6b Clinch part 7 Surface mount electronic part 8a, 8b Solder bridge 9 Solder resist

Claims (1)

[Scope of utility model registration request] 1. A DC brushless in which a plurality of electronic components are mounted on a substrate body for controlling a brushless motor, and these electronic components are connected to the substrate body by a power line and a signal line provided by printed wiring. In the motor controller board, the power line has a position where the electronic component crosses the power line, a position where the lead wire clinch portion of the electronic component is adjacent, and a position around the electrode portion of the power line. Solder resist is applied without going through the solder plating layer,
A controller board for a DC brushless motor, characterized in that a solder plating layer is provided on the surface of the other power line portion.