JPS6221289A - Mounted substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to a mounting board, and in particular, it is possible to easily establish electrical continuity between each wiring that requires electrical continuity in conductor wiring on a mounting board. Regarding technology.

[Background technology]

Electronic equipment is an assembly of various parts, and each part needs to be fixed in a predetermined position. The substrate that plays this role (5
It is necessary to connect the components with each other through predetermined conductive paths and with mutual wiring patterns.

This mutual wiring pattern is often made on the above-mentioned substrate.

Generally, the main substrates are resin substrates and ceramic substrates. Resin substrates are generally referred to as printed wiring boards or printed circuit boards, and are made by applying steel foil onto a laminated board of resin such as phenol or epoxy resin, and creating a pattern by etching.

Ceramic substrates are mainly formed by molding and firing alumina powder, and patterns are created thereon by printing vapor deposition and etching.

In the case of resin substrates, in general, in the case of multilayer substrates accompanying the increase in density of AP-N, a pattern is formed on a thin resin plate, several of them are stacked, pressure is applied, and heat is applied to harden the resin. After that, holes (through-holes) are drilled in the necessary locations, and conductors are attached inside the holes to establish continuity between the patterns on each layer.

The multilayer substrate also includes a multilayer ceramic substrate.

In such a board, the wiring can be easily cut by trimming using a laser or the like, and there are various treatments, but connecting the wiring is not easy and there are few examples of such treatments. For example, there is a method of connecting using wires, etc., but the work is complicated.

In addition, “Electronic Materials JI July 981 issue P.
For 26, all pattern corrections were not done by stretching discrete wires as described above, but by screen printing insulating ink avoiding the through holes, wiring using Cu ink on top of that, and soldering in the through holes. Although a method for printing is described, it is similarly complicated.

[Object of the Invention] An object of the present invention is to provide a technique that allows electrical continuity to be easily established at any location.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, in the present invention, an insulating layer containing a shape memory alloy is formed entirely on the wiring board, and when full conductivity is required, the insulating layer is heated in spots, so that the shape memory alloy is the original material. is returned to the great memory shape of
It is possible to connect and establish continuity between the required locations.

〔Example〕

Next, the present invention will be explained based on embodiments shown in the drawings.

1Ic1 to 3 are model diagrams showing the conduction process according to the present invention. In these figures, 1 is a wiring board, 2 is a conductor, and 3 is a lower conductor. Furthermore, a conductive pattern 4 is formed on the wiring board 1.

As shown in FIG. 1, a disconnection layer 6 containing a shape memory alloy 5 is applied to the entire surface of the wiring board 1, except for the conductor pattern portion 4, to an appropriate thickness.

Infrared spot heating 7 is performed from above the insulating layer 6, as shown in FIG.

Spot heating can be performed by masking portions that do not require full conduction.

At this point, the shape memory alloy 5 in the insulation/1i16 is heated and restored to its original shape, and the conductor pattern 4.4 and the shape memory alloy 5 come into contact with each other, and these conductor patterns 4,4
There is electrical continuity between the two.

Shape memory alloys 5 can be made of various alloys that exhibit the phenomenon that if a certain shape is memorized, even if it is deformed, it will return to the memorized shape when heated above a certain temperature. , for example, Ni-T1 alloy, Au-Cd,
In-Tl, Cu-Zn.

Examples include Cu-8n and Ni-Al alloys.

As a specific example of this form, a ring-shaped shape memory alloy as shown in FIG. 4 is made into a reduced shape shape memory alloy as shown in FIG. 5, and by heating it, Examples include large ring-shaped shape memory alloys.

Although all kinds of insulating materials can be used as the insulating material constituting the insulating layer 6, it is preferable to use silicone rubber, for example.

This insulating material is preferably a material that normally insulates each conductor pattern 4, 4, and prevents the spread of the shape memory alloy 5 when continuity is required. For example,
Addition-curing silicone rubber is used, which is liquid (paste-like) and does not undergo extreme thermal curing by infrared heating.

Next, the connection technology of the present invention will be explained in detail with reference to FIGS. 6 to 9.

As shown in FIG. 6, a conductor part 9 is formed on a multilayer wiring board 8, and as shown in FIG. When the insulation layer 6 between the conductor portions 9 and 9 that requires full conduction is heated with an infrared spot, the shape memory alloy 5 expands inside the insulation layer 6 and conduction is established. (8th
figure).

FIG. 9 is an enlarged explanatory view of part A in FIG. 8, in which the conductor parts 9, 9 that require conduction are electrically connected through the shape memory alloy 5, and are formed at the bottom of each conductor part 9, 9. Continuity is also established between the conductors 10 and 10 in the through hole.

Next, other embodiments of the present invention shown in FIGS. 10 to 11 will be explained.

In this embodiment, a conductor pattern 1 as shown in FIG.
As shown in FIG. 11, an insulating layer 6 containing a shape memory alloy 5 is coated on a substrate 12 on which a shape memory alloy 5 is formed, and infrared spot heating is performed in the same manner as in the previous embodiment. FIG. 12 shows a wiring board 13 manufactured in this way.
An example is shown below.

As for the wiring board and multilayer board used in the present invention, for example, a resin-sealed board or a ceramic board can be used.

As for the method of forming the conductor in the conductor pattern and through-hole, well-known metallization (film formation technology), plating film formation technology, etc. can be used.

〔effect〕

According to the present invention, by using a shape memory alloy, υ,
Electrical continuity can be easily established at any location, and its industrial significance is great.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor.

[Application field]

The present invention can be applied to mounting boards for each building, such as printed wiring boards and hybrid boards, and can be applied to all cases where electrical continuity is required, such as between wires or between terminals, such as package bases and motherboards.

[Brief explanation of drawings]

Figures 1 to 3 are model diagrams explaining the present invention in detail.
Figure 1 shows the process of applying an insulating layer containing a shape memory alloy;
The figure shows the heating process, Figure 3 shows the conduction process, Figure 4 is an explanatory diagram of the shape of the shape memory alloy after heating, Figure 5 is an explanatory diagram of the shape before heating, and Figures 6 to 8 are the main figures. An explanatory diagram of the forming process of the mounting board according to the invention, FIG. 6 is a conductor part forming process, FIG. 7 is an insulating layer forming process, FIG. 8 is a conduction process, FIG. 9 is an enlarged sectional view of part A in FIG. 8, 10 to 11 are explanatory diagrams of other embodiments of the present invention,
FIG. 10 is an explanatory diagram of a substrate, FIG. 11 is an explanatory diagram of a step of forming an insulating layer on the substrate, and FIG. 12 is a plan view of an example of a mounting substrate according to the present invention. 1... Wiring board, 2... Conductor, 3... Lower conductor,
4... Conductor pattern, 5... Shape memory alloy, 6...
- Insulating layer, 7... Spot heating, 8... Multilayer wiring board, 9... Conductor portion, 10... Through-hole conductor, 11
...Conductor pattern, Figure 1 Figure 3 Figure 4 Figure 5 Interval 6
Figure 7 Figure 8 Figure 9

Claims (1)

[Claims] 1. A mounting board characterized in that electrical continuity between predetermined wirings or terminals on the mounting board that requires electrical continuity is provided by a shape memory alloy. . 2. The mounting board is a printed wiring board, and a conductive wiring layer is provided protrudingly on the wiring board, and an insulating layer containing a shape memory alloy is formed on the part excluding the wiring layer, and then conduction is established. 2. The mounting board according to claim 1, wherein the conductor wirings are heated and electrically connected by a shape memory alloy.