JPS6254490A - Power source supply for bias circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] A method for supplying power to a bias circuit attached to a strip line connecting transistor amplifiers, in which the connection between the power supply and the bias circuit is made using a pattern formed on a printed wiring board. , enabling effective use of space on the board.

[Industrial application field]

The present invention relates to a method of supplying power to a bias circuit attached to a stripline, and particularly to a method of supplying power to a bias circuit using a pattern formed on a substrate.

Ceramic circuit boards with low high-frequency loss are generally used in wireless communication devices that use high frequencies ranging from several 100 MHz to millimeter wave bands. However, since these ceramic circuit boards have difficulties in processing, it is difficult to supply power to the bias circuit. The supply was done by strump wiring. However, in recent years, as flow glass substrates that are easy to process and have relatively little loss of high frequency ti have come into use, there is a strong demand for the development of a method for forming patterns on the substrate and supplying power.

[Conventional technology]

A conventional method of supplying power to a bias circuit uses strap wiring in which a power supply and a bias circuit are connected by a lead wire across a strip line.

[Problem that the invention seeks to solve]

In the above conventional method of supplying power to the bias circuit,
Strap wiring is used to connect the power supply and bias circuits across strip lines using lead wires, which increases assembly man-hours, reduces reliability due to wire breakage, and has problems with poor space factors. There was a point.

[Means for Solving the Problems] The present invention solves the above problems and provides a method of supplying power to a bias circuit with a good space factor without impairing the aesthetic appearance.

In other words, the transistor amplifiers are connected by a strip line, and power is supplied to the bias circuit attached to the strip line by either connecting a power supply line pattern on the substrate and installing it on the back side of the substrate via a through hole, or using a strip line. This problem can be solved by cutting out a predetermined length of the line, forming the strip line so that it is perpendicular to the cut part, and connecting the cut strip line with a chip capacitor.

[Effect]

The method for supplying power to the bias circuit is to provide a pattern for forming the power supply and bias circuit on the back side of the board via through holes, or to cut out the strip line and form it perpendicular to the strip line. This improves reliability and makes effective use of space.

〔Example〕

FIG. 1 is a diagram illustrating an embodiment of the present invention.
1 is a plan view of the main part, and (b) is a back view of the main part.

In the figure, a transistor amplifier 1 such as an FET is mounted on one side (surface) of a flow glass substrate 2 made of a highly insulating material such as Teflon, and a strip line 3 connecting the transistor amplifiers 1 is connected to the strip line 3. A bias circuit 4 is formed to be attached to the bias circuit 3, and a through hole 6 is formed at a position where the bias circuit 4 is connected to a power source.

A power supply pattern 5 including the through holes 6 is provided between the through holes 6 on the other surface (back surface).

Bias power is supplied to the other through holes 6 of the through holes 6 connected to the bias circuit 4 from a control system board (not shown). Then, a ground pattern 8 is formed on the entire surface except for the power supply pattern 5, and the cut out part of the ground pattern 8 (the part where the power supply pattern 5 is formed) is connected with a chip capacitor 7 for high frequency connection. be.

FIG. 2 is a plan view of essential parts for explaining another embodiment of the present invention, in which the same parts as in FIG. 1 are given the same reference numerals.

In the figure, a transistor amplifier 1 such as an FET is mounted on one side (surface) of a flow glass substrate 2 made of a highly insulating material such as Teflon, and a strip line 3 connecting the transistor amplifiers 1 is connected to the strip line 3. A pattern for a bias circuit 4 attached to 3 is formed. Then, a power supply pattern 5 for connecting the power source and the bias circuit 4 is formed by cutting out a predetermined length of this strip line 3 so as to be perpendicular to the cut part of the strip line 3, and the cut strip line 3 is connected to the chip capacitor 4.
Combine with . The other surface (back surface) of the flow glass substrate 2 has a structure in which a ground pattern (not shown) is formed on the entire surface.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, since the power supply line to the bias circuit is formed by a pattern, the number of assembly steps is reduced, and this invention is extremely effective in improving reliability and effectively utilizing space.

[Brief explanation of drawings]

FIG. 1 is a diagram illustrating an embodiment of the present invention.
) is a plan view of the main part, (b) is a back view of the main part, and FIG. 2 is a plan view of the main part explaining another embodiment of the present invention. In the figure, 1 is a transistor amplifier, 2 is a flow glass substrate, 3 is a strip line, 4 is a bias circuit, and 5
6 shows a power supply pattern, 6 shows a through hole, 7 shows a chip capacitor, and 8 shows a ground pattern. Figure 2

Claims (3)

[Claims] (1) In a method of connecting transistor amplifiers (1) with a strip line (3) and supplying power to a bias circuit (4) attached to the strip line (3), the power supply line is connected to the strip line (3). The substrate (2
) A method for supplying power to a bias circuit, characterized in that power is supplied by a pattern (5) formed in a bias circuit. (2) The method for supplying power to a bias circuit according to claim (1), characterized in that the pattern (5) is provided on the back surface of the substrate (1) via a through hole (6). (3) The pattern (5) is formed by cutting out a predetermined length of the strip line (3) so as to be perpendicular to the cut out part of the strip line (3), and
) is coupled by a chip capacitor (7).