JPS62108011A - Preparation of laminated plate - Google Patents
Preparation of laminated plateInfo
- Publication number
- JPS62108011A JPS62108011A JP24758385A JP24758385A JPS62108011A JP S62108011 A JPS62108011 A JP S62108011A JP 24758385 A JP24758385 A JP 24758385A JP 24758385 A JP24758385 A JP 24758385A JP S62108011 A JPS62108011 A JP S62108011A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- laminate
- laminated plate
- water
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機器、計算機、通信機等に用い
られる積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a laminate used in electrical equipment, electronic equipment, computers, communication equipment, etc.
従来、積層板は紙、ガラヌ布等の基材を樹脂ワニスに含
浸させた後、加熱乾燥して得たプリプレグを保管室に保
管し必要に応じて取り出して用いている。保管室は通常
加〜5℃、60〜6596 湿度で通常気圧の恒温恒温
室でプリプレグの吸湿、反応進行の予防をおこなってい
るのみで、最近の積層板に要求される耐熱性向上、耐吸
水性向上には無策であった。Conventionally, laminates have been prepared by impregnating a base material such as paper or galane cloth with resin varnish and then heating and drying the resulting prepreg, which is then stored in a storage room and taken out for use as needed. The storage room is usually heated to 5℃, humidity is 60 to 6596 degrees Celsius, and the humidity is 60 to 6596 degrees Celsius, and the moisture absorption of the prepreg and prevention of reaction progress are only carried out in a constant temperature room. There was no way to improve sexuality.
本発明の目的とするところは耐熱性、耐吸水性に優れた
積層板の製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing a laminate having excellent heat resistance and water absorption resistance.
本発明は所要枚数の1リゾレグを重ね、更に必要に応じ
てその上面及び又は下面に金属箔を配設した積層体を積
層成形してなる積層板の製造方法において、プリプレグ
として雰囲気温度菊〜ω℃、真空度50 m Hg以下
で脱湿、脱気処理した プリプレグを用いることを特徴
とする積層板の製造方法のためプリプレグに内蔵又は表
面吸着している気泡、水分を除去することができ気泡、
水分の除去跡を樹脂で充填させることができるのでl1
11熱性、耐吸水性に優れた積層板を得ることができる
もので、以下本発明の詳細な説明する。The present invention relates to a method for manufacturing a laminate in which a required number of 1 Resoreg is stacked, and if necessary, metal foil is arranged on the upper and/or lower surfaces of the laminate. ℃ and a vacuum level of 50 m Hg or below ,
The traces of moisture removal can be filled with resin, so l1
11 A laminate plate having excellent heat resistance and water absorption resistance can be obtained, and the present invention will be described in detail below.
本発明に用いるプリプレグとしては、樹脂としてフェノ
−1v樹脂、クレゾール樹脂、エボキン樹脂、不飽和ポ
リエステル樹脂、メラミン樹脂、ポリイミド、ポリブタ
ジェン、ポリアミド、ポリアミドイミド、ポリ7−IL
/フオン、ポリブチレンテレフタレート、ポリエーテル
エーテルケトン、弗化樹脂等の単独、変性物、混合物等
が用いられ必要に応じて粘度調整に水、メチルアルコ−
ルトン、シクロヘキサノン、ヌチレン等の溶媒を添加し
たもので基材は、、ガラス、アスベスト等の無機繊維や
ポリエステル、ポリアミド、ポリビニルアルコール、ア
クリμ等の有機合成繊維や木綿等の天然繊維からなる織
布、不織布、マット或は紙又はこれらの組合せ基材等で
ある。金属箔としては銅、アμミニウム、鉄、ニッケル
等の単独、合金等を用い必要に応じて金属箔のプリプレ
グ対向側に接着剤層を設けることができる。積層成形に
用いるプリプレグとしては、雰囲気tX度ω〜50 、
’c、真空Ilf50 ttra Hg以下で脱湿、脱
気処理 したプリプレグであることが必要である。界囲
気温度切°C未満では脱湿、脱気処理しなく、犯°Cを
こえると反応が進み成形性が低下するためである。真空
度が50 m Hgをこえると脱湿、脱気処理しないた
めである。プリプレグの処理は好ましくは1枚づつ分離
して処理することがより脱湿、脱気処理しやすく望まし
いことである。なお脱湿、脱気処理時間については艶分
以内であることがjましい。刀分をこえると反応が進行
し成形性が低下する傾向にあるからである。The prepreg used in the present invention includes resins such as pheno-1v resin, cresol resin, Evoquin resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, and poly7-IL.
/Fon, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and water, methyl alcohol is used to adjust the viscosity as necessary.
The base material is a woven fabric made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acryl μ, and natural fibers such as cotton. , nonwoven fabric, mat, paper, or a combination thereof. The metal foil may be made of copper, aluminum, iron, nickel, etc., alone or in an alloy, and if necessary, an adhesive layer may be provided on the side of the metal foil facing the prepreg. The prepreg used for lamination molding has an atmosphere tX degree ω~50,
'c, the prepreg must be dehumidified and degassed under a vacuum Ilf50 ttra Hg or less. This is because dehumidification and degassing are not performed when the ambient temperature is below 0°C, and when it exceeds 0°C, the reaction progresses and moldability deteriorates. This is because when the degree of vacuum exceeds 50 m Hg, dehumidification and degassing are not performed. Preferably, it is preferable to separate the prepregs one by one for easier dehumidification and deaeration treatment. It is preferable that the dehumidification and deaeration treatment time be within the gloss period. This is because if the temperature is exceeded, the reaction will proceed and the moldability will tend to deteriorate.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例1
I″C,00%湿度の恒温恒温室に3日間保管した厚さ
0.2Hの7工ノール樹脂含浸紙プリプレグ8枚を重ね
、雰囲気温度狛°C,真使度″!Dtrap Hgの脱
湿、脱気室でに分間脱湿、脱気処理してから該プリプレ
グ8枚の上、下面に厚さ5ミクロンのm14Wrを夫々
配設した積層体を成形圧力100 fil/ci 、1
60 ”Cでω分間漬層成形して厚さ1.6Mの銅張積
層板を得た。Example 1 Eight sheets of paper prepreg impregnated with 0.2H 7-Kol resin, which had been stored for 3 days in a constant temperature and constant temperature room at 00% humidity, were stacked together, and the ambient temperature was 0°C. Dtrap Hg was dehumidified and degassed in a degassing chamber for a minute, and then a laminate with m14Wr with a thickness of 5 microns disposed on the upper and lower surfaces of the eight prepregs was molded at a pressure of 100 fil/ci. ,1
A copper clad laminate with a thickness of 1.6M was obtained by dip-layer molding at 60''C for ω minutes.
実施例2
20 ”C、ω%湿度の恒温恒湿室に3日間保管した厚
さ0.2’l!Iの7工ノール樹脂含浸紙プリプレグを
1枚づつ多段棚に置き、雰囲気温度の°C,真空度3)
IaIHHの脱湿、脱気室で5分間脱湿、脱気処理して
から該プリプレグ8枚を重ねた上、下面に厚さ5ミクロ
ンの鋼箔を夫々配設した積層体を成形圧力100Q/(
d 、 160°Cでω分間積層成形して厚さ1、6j
Elの銅張積層板を得た。Example 2 Paper prepregs impregnated with 7-technol resin with a thickness of 0.2'l!I, which had been stored for 3 days in a constant temperature and humidity room with a humidity of 20"C and ω%, were placed one by one on a multi-shelf shelf, and the prepregs were heated to an ambient temperature of °C. C, degree of vacuum 3)
After dehumidifying and degassing the IaIHH for 5 minutes in a degassing chamber, 8 sheets of the prepreg were stacked on top of each other, and a 5-micron-thick steel foil was placed on the bottom surface of each layer. (
d, laminated for ω minutes at 160°C to a thickness of 1,6j
A copper-clad laminate of El was obtained.
比較例
20”C,60%湿度の恒温恒湿室に3日間保管した厚
さ0.21i1のフェノ−!樹脂含浸紙プリプレグ8枚
を重ねた上、下面に厚さ5ミクロンの銅箔を夫々配設し
た積層体を成形圧力100 k%/(yll, 16
0°Cでω分間積層成形して厚さ1.6 Mの銅張積
層板を得た。Comparative Example 20"C, 8 sheets of phenol resin-impregnated paper prepreg with a thickness of 0.21i1 stored for 3 days in a constant temperature and humidity room at 60% humidity were stacked on top of each other, and a 5 micron thick copper foil was placed on the bottom of each sheet. The arranged laminate was molded under a molding pressure of 100 k%/(yll, 16
Lamination molding was performed at 0°C for ω minutes to obtain a copper-clad laminate with a thickness of 1.6 M.
実施例1と2及び比較例の積層板の財熱性、吸水−は、
第1表で明白なように本発明のものの性能はよく、本発
明の積層板の製造方法の優れていることを確認した。The thermal properties and water absorption of the laminates of Examples 1 and 2 and Comparative Example are as follows:
As is clear from Table 1, the performance of the present invention was good, confirming the superiority of the method for producing a laminate of the present invention.
第 1 表Chapter 1 Table
Claims (2)
その上面及び又は下面に金属箔を配設した積層体を積層
成形してなる積層板の製造方法において、プリプレグと
して雰囲気温度40〜50℃、真空度50mmHg以下
で脱湿、脱気処理したプリプレグを用いることを特徴と
する積層板の製造方法。(1) A method for manufacturing a laminate in which a required number of prepregs are stacked and, if necessary, metal foil is arranged on the upper and/or lower surfaces of the laminate. A method for producing a laminate, characterized in that a prepreg that has been dehumidified and deaerated at a vacuum degree of 50 mmHg or less is used.
徴とする特許請求の範囲第1項記載の積層板の製造方法
。(2) The method for manufacturing a laminate according to claim 1, wherein the prepregs are separated and processed one by one.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24758385A JPS62108011A (en) | 1985-11-05 | 1985-11-05 | Preparation of laminated plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24758385A JPS62108011A (en) | 1985-11-05 | 1985-11-05 | Preparation of laminated plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62108011A true JPS62108011A (en) | 1987-05-19 |
Family
ID=17165662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24758385A Pending JPS62108011A (en) | 1985-11-05 | 1985-11-05 | Preparation of laminated plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62108011A (en) |
-
1985
- 1985-11-05 JP JP24758385A patent/JPS62108011A/en active Pending
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