JPS62106651A - 電子部品の実装構造 - Google Patents

電子部品の実装構造

Info

Publication number
JPS62106651A
JPS62106651A JP60247619A JP24761985A JPS62106651A JP S62106651 A JPS62106651 A JP S62106651A JP 60247619 A JP60247619 A JP 60247619A JP 24761985 A JP24761985 A JP 24761985A JP S62106651 A JPS62106651 A JP S62106651A
Authority
JP
Japan
Prior art keywords
heat sink
heat
tab
connection terminal
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60247619A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426785B2 (enExample
Inventor
Fumio Mori
森　史男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60247619A priority Critical patent/JPS62106651A/ja
Publication of JPS62106651A publication Critical patent/JPS62106651A/ja
Publication of JPH0426785B2 publication Critical patent/JPH0426785B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60—
    • H10W76/157—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H10W70/63—
    • H10W72/07337—
    • H10W72/07653—
    • H10W90/734—
    • H10W90/736—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60247619A 1985-11-05 1985-11-05 電子部品の実装構造 Granted JPS62106651A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60247619A JPS62106651A (ja) 1985-11-05 1985-11-05 電子部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60247619A JPS62106651A (ja) 1985-11-05 1985-11-05 電子部品の実装構造

Publications (2)

Publication Number Publication Date
JPS62106651A true JPS62106651A (ja) 1987-05-18
JPH0426785B2 JPH0426785B2 (enExample) 1992-05-08

Family

ID=17166201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60247619A Granted JPS62106651A (ja) 1985-11-05 1985-11-05 電子部品の実装構造

Country Status (1)

Country Link
JP (1) JPS62106651A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0524763A3 (enExample) * 1991-07-22 1994-02-16 Motorola Inc
JP2007234886A (ja) * 2006-03-01 2007-09-13 Compal Communications Inc 散熱構成を有する電子素子アセンブリ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0524763A3 (enExample) * 1991-07-22 1994-02-16 Motorola Inc
JP2007234886A (ja) * 2006-03-01 2007-09-13 Compal Communications Inc 散熱構成を有する電子素子アセンブリ

Also Published As

Publication number Publication date
JPH0426785B2 (enExample) 1992-05-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees