JPS62104692A - レ−ザ加工装置 - Google Patents

レ−ザ加工装置

Info

Publication number
JPS62104692A
JPS62104692A JP60245739A JP24573985A JPS62104692A JP S62104692 A JPS62104692 A JP S62104692A JP 60245739 A JP60245739 A JP 60245739A JP 24573985 A JP24573985 A JP 24573985A JP S62104692 A JPS62104692 A JP S62104692A
Authority
JP
Japan
Prior art keywords
laser
laser processing
workpiece
processing apparatus
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60245739A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0453630B2 (enrdf_load_stackoverflow
Inventor
Seiji Imamura
清治 今村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Corporate Research and Development Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Corporate Research and Development Ltd filed Critical Fuji Electric Corporate Research and Development Ltd
Priority to JP60245739A priority Critical patent/JPS62104692A/ja
Publication of JPS62104692A publication Critical patent/JPS62104692A/ja
Publication of JPH0453630B2 publication Critical patent/JPH0453630B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP60245739A 1985-11-01 1985-11-01 レ−ザ加工装置 Granted JPS62104692A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60245739A JPS62104692A (ja) 1985-11-01 1985-11-01 レ−ザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60245739A JPS62104692A (ja) 1985-11-01 1985-11-01 レ−ザ加工装置

Publications (2)

Publication Number Publication Date
JPS62104692A true JPS62104692A (ja) 1987-05-15
JPH0453630B2 JPH0453630B2 (enrdf_load_stackoverflow) 1992-08-27

Family

ID=17138080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60245739A Granted JPS62104692A (ja) 1985-11-01 1985-11-01 レ−ザ加工装置

Country Status (1)

Country Link
JP (1) JPS62104692A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306088A (ja) * 1988-06-01 1989-12-11 Nippei Toyama Corp 可変ビームレーザ加工装置
US6483074B2 (en) 2001-03-07 2002-11-19 International Business Machines Corporation Laser beam system for micro via formation
JP2005212473A (ja) * 2004-02-02 2005-08-11 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置およびこの装置を用いたスクライブ方法
JP2005212364A (ja) * 2004-01-30 2005-08-11 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
WO2009140239A3 (en) * 2008-05-14 2010-02-25 Applied Materials, Inc. In-situ monitoring for laser ablation
JP2011206797A (ja) * 2010-03-29 2011-10-20 Hitachi Via Mechanics Ltd レーザ加工方法及びレーザ加工装置
US9076860B1 (en) * 2014-04-04 2015-07-07 Applied Materials, Inc. Residue removal from singulated die sidewall
US20150287638A1 (en) * 2014-04-04 2015-10-08 Jungrae Park Hybrid wafer dicing approach using collimated laser scribing process and plasma etch
KR20160012250A (ko) * 2011-01-13 2016-02-02 타마랙 사이언티픽 컴퍼니 인코포레이티드 전도성 시드 레이어를 레이저 제거하는 방법 및 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL161794A0 (en) * 2001-11-17 2005-11-20 Insstek Inc Method and system for real-time monitoring and controlling height of deposit by using image photographing and image processing technology

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794482A (en) * 1980-12-05 1982-06-11 Hitachi Ltd Pattern forming device by laser
JPS59165787U (ja) * 1983-04-18 1984-11-07 日本電気株式会社 レ−ザ−トリミング装置の集塵用ノズル

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794482A (en) * 1980-12-05 1982-06-11 Hitachi Ltd Pattern forming device by laser
JPS59165787U (ja) * 1983-04-18 1984-11-07 日本電気株式会社 レ−ザ−トリミング装置の集塵用ノズル

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306088A (ja) * 1988-06-01 1989-12-11 Nippei Toyama Corp 可変ビームレーザ加工装置
US6483074B2 (en) 2001-03-07 2002-11-19 International Business Machines Corporation Laser beam system for micro via formation
JP2005212364A (ja) * 2004-01-30 2005-08-11 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
JP2005212473A (ja) * 2004-02-02 2005-08-11 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置およびこの装置を用いたスクライブ方法
WO2009140239A3 (en) * 2008-05-14 2010-02-25 Applied Materials, Inc. In-situ monitoring for laser ablation
JP2011206797A (ja) * 2010-03-29 2011-10-20 Hitachi Via Mechanics Ltd レーザ加工方法及びレーザ加工装置
KR20160012250A (ko) * 2011-01-13 2016-02-02 타마랙 사이언티픽 컴퍼니 인코포레이티드 전도성 시드 레이어를 레이저 제거하는 방법 및 장치
US9076860B1 (en) * 2014-04-04 2015-07-07 Applied Materials, Inc. Residue removal from singulated die sidewall
US20150287638A1 (en) * 2014-04-04 2015-10-08 Jungrae Park Hybrid wafer dicing approach using collimated laser scribing process and plasma etch

Also Published As

Publication number Publication date
JPH0453630B2 (enrdf_load_stackoverflow) 1992-08-27

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