JPS6210311B2 - - Google Patents

Info

Publication number
JPS6210311B2
JPS6210311B2 JP57203857A JP20385782A JPS6210311B2 JP S6210311 B2 JPS6210311 B2 JP S6210311B2 JP 57203857 A JP57203857 A JP 57203857A JP 20385782 A JP20385782 A JP 20385782A JP S6210311 B2 JPS6210311 B2 JP S6210311B2
Authority
JP
Japan
Prior art keywords
etching
gas
silicon
dry etching
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57203857A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5993880A (ja
Inventor
Isamu Hijikata
Akira Uehara
Hisashi Nakane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Denshi Kagaku KK
Original Assignee
Tokyo Denshi Kagaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Denshi Kagaku KK filed Critical Tokyo Denshi Kagaku KK
Priority to JP57203857A priority Critical patent/JPS5993880A/ja
Priority to US06/551,898 priority patent/US4465553A/en
Publication of JPS5993880A publication Critical patent/JPS5993880A/ja
Publication of JPS6210311B2 publication Critical patent/JPS6210311B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P50/242—
    • H10P50/267—
    • H10P50/268—
    • H10P50/283—

Landscapes

  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
JP57203857A 1982-11-20 1982-11-20 ドライエツチング方法 Granted JPS5993880A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57203857A JPS5993880A (ja) 1982-11-20 1982-11-20 ドライエツチング方法
US06/551,898 US4465553A (en) 1982-11-20 1983-11-15 Method for dry etching of a substrate surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57203857A JPS5993880A (ja) 1982-11-20 1982-11-20 ドライエツチング方法

Publications (2)

Publication Number Publication Date
JPS5993880A JPS5993880A (ja) 1984-05-30
JPS6210311B2 true JPS6210311B2 (OSRAM) 1987-03-05

Family

ID=16480840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57203857A Granted JPS5993880A (ja) 1982-11-20 1982-11-20 ドライエツチング方法

Country Status (2)

Country Link
US (1) US4465553A (OSRAM)
JP (1) JPS5993880A (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4726879A (en) * 1986-09-08 1988-02-23 International Business Machines Corporation RIE process for etching silicon isolation trenches and polycides with vertical surfaces
US4713141A (en) * 1986-09-22 1987-12-15 Intel Corporation Anisotropic plasma etching of tungsten
US4778583A (en) * 1987-05-11 1988-10-18 Eastman Kodak Company Semiconductor etching process which produces oriented sloped walls
JP2574868B2 (ja) * 1988-04-30 1997-01-22 シャープ株式会社 積層金属の反応性イオンエッチング方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330384A (en) * 1978-10-27 1982-05-18 Hitachi, Ltd. Process for plasma etching

Also Published As

Publication number Publication date
US4465553A (en) 1984-08-14
JPS5993880A (ja) 1984-05-30

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