JPS6210016B2 - - Google Patents

Info

Publication number
JPS6210016B2
JPS6210016B2 JP54050896A JP5089679A JPS6210016B2 JP S6210016 B2 JPS6210016 B2 JP S6210016B2 JP 54050896 A JP54050896 A JP 54050896A JP 5089679 A JP5089679 A JP 5089679A JP S6210016 B2 JPS6210016 B2 JP S6210016B2
Authority
JP
Japan
Prior art keywords
resin
polyimide resin
silicon substrate
coupling agent
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54050896A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55143057A (en
Inventor
Shigenori Yamaoka
Katamatsu Isozaki
Masuo Mizuno
Mitsuo Waki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP5089679A priority Critical patent/JPS55143057A/ja
Publication of JPS55143057A publication Critical patent/JPS55143057A/ja
Publication of JPS6210016B2 publication Critical patent/JPS6210016B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/476—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP5089679A 1979-04-26 1979-04-26 Manufacture of semiconductor device Granted JPS55143057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5089679A JPS55143057A (en) 1979-04-26 1979-04-26 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5089679A JPS55143057A (en) 1979-04-26 1979-04-26 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS55143057A JPS55143057A (en) 1980-11-08
JPS6210016B2 true JPS6210016B2 (enExample) 1987-03-04

Family

ID=12871496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5089679A Granted JPS55143057A (en) 1979-04-26 1979-04-26 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS55143057A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854658A (ja) * 1981-09-28 1983-03-31 Nec Corp 半導体装置
JPS61198634A (ja) * 1985-02-27 1986-09-03 Asahi Chem Ind Co Ltd 半導体装置の製造方法
JP2635933B2 (ja) * 1994-07-05 1997-07-30 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS55143057A (en) 1980-11-08

Similar Documents

Publication Publication Date Title
JP2817130B2 (ja) 多層製造物及びその製造プロセス、並びに金属状粒子の形成を最小限にするためのプロセス
US4758476A (en) Polyimide precursor resin composition and semiconductor device using the same
JPS5976451A (ja) 半導体装置
JP3427713B2 (ja) 樹脂封止型半導体装置およびその製造方法
US5059677A (en) Polyimide resin and insulating film for electric and electronic devices
US6656313B2 (en) Structure and method for improved adhesion between two polymer films
JPS6210016B2 (enExample)
JPS60177659A (ja) 半導体装置の製造方法
JP2885340B2 (ja) ポリアミック酸、ポリイミド樹脂及びポリイミド樹脂の製造方法
JPS60177660A (ja) 半導体装置の製造方法
JP2894565B2 (ja) 接着性耐熱コーティング剤
JPH0322465A (ja) 樹脂封止型半導体装置
JPH04320359A (ja) 半導体装置
JPH06345866A (ja) シロキサン変性ポリイミド樹脂
JPH0263145A (ja) 樹脂封止型半導体装置
JPS61185932A (ja) 半導体装置
JPH0455483A (ja) 耐熱性および絶縁性ワニス組成物およびそれを用いた被膜の形成方法
JPS6210015B2 (enExample)
JPH08176524A (ja) シリコーンポリイミド接着剤
JP2712549B2 (ja) Ｍｏｓ半導体装置用パッシベーション膜
JPH0456975B2 (enExample)
JPS6138853B2 (enExample)
WO1991010699A1 (fr) Resine pour proteger des semi-conducteurs
JPS63164247A (ja) 半導体装置
JPS6121131A (ja) 感光性耐熱材料