JPS6210016B2 - - Google Patents
Info
- Publication number
- JPS6210016B2 JPS6210016B2 JP54050896A JP5089679A JPS6210016B2 JP S6210016 B2 JPS6210016 B2 JP S6210016B2 JP 54050896 A JP54050896 A JP 54050896A JP 5089679 A JP5089679 A JP 5089679A JP S6210016 B2 JPS6210016 B2 JP S6210016B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- polyimide resin
- silicon substrate
- coupling agent
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5089679A JPS55143057A (en) | 1979-04-26 | 1979-04-26 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5089679A JPS55143057A (en) | 1979-04-26 | 1979-04-26 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55143057A JPS55143057A (en) | 1980-11-08 |
| JPS6210016B2 true JPS6210016B2 (enExample) | 1987-03-04 |
Family
ID=12871496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5089679A Granted JPS55143057A (en) | 1979-04-26 | 1979-04-26 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55143057A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5854658A (ja) * | 1981-09-28 | 1983-03-31 | Nec Corp | 半導体装置 |
| JPS61198634A (ja) * | 1985-02-27 | 1986-09-03 | Asahi Chem Ind Co Ltd | 半導体装置の製造方法 |
| JP2635933B2 (ja) * | 1994-07-05 | 1997-07-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 半導体装置の製造方法 |
-
1979
- 1979-04-26 JP JP5089679A patent/JPS55143057A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55143057A (en) | 1980-11-08 |
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