JPS619590A - Electroforming apparatus - Google Patents

Electroforming apparatus

Info

Publication number
JPS619590A
JPS619590A JP13010784A JP13010784A JPS619590A JP S619590 A JPS619590 A JP S619590A JP 13010784 A JP13010784 A JP 13010784A JP 13010784 A JP13010784 A JP 13010784A JP S619590 A JPS619590 A JP S619590A
Authority
JP
Japan
Prior art keywords
anode
matrix
master
plating
anode part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13010784A
Other languages
Japanese (ja)
Other versions
JPH0144794B2 (en
Inventor
Osamu Sasaki
修 佐々木
Takashi Koizumi
隆 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP13010784A priority Critical patent/JPS619590A/en
Publication of JPS619590A publication Critical patent/JPS619590A/en
Publication of JPH0144794B2 publication Critical patent/JPH0144794B2/ja
Granted legal-status Critical Current

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  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To form a pattern which is excellent in transferring characteristics and has uniform film thickness by constituting an anode of plural electrodes having difference in level in case of performing the electro-forming by using an insoluble anode while rotating a matrix formed with fine patterns. CONSTITUTION:A matrix 1 of record is fitted to a rotating cathode 2 and immersed into a nickel plating soln. 5 incorporated in an electrodeposition cell 4 and an Ni-plated film is electroformed on the surface of the matrix 1 having fine patterns by providing an insiluble anode to the position opposite thereto and conducting electricity with a power source 6. In this case, the anode 3 is constituted of both the first anode 3a which is positioned in the center part for the matrix 1 and the second plural anodes 3b-3f which have differences in level for the first anode 3 a and are fitted in the elliptical state or mutually eccentric state around the first anode 3a. The pattern having uniform thickness is electroformed on all the surface of the matrix 1 by providing the parts which have at least two or more kinds of different interpole distances on the concentrical circles that are formed in the direction parallel to the matrix 1 and in the equidistance from the position for the center of rotation of the matrix 1 in the first and the second anodes.

Description

【発明の詳細な説明】 (発明の技術分野) 本発明は電鋳装置に関し、さらに詳しくはその電鋳用陽
極C二関する。
DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to an electroforming apparatus, and more particularly to an anode C2 for electroforming.

(発明の技術的背景とその問題点〕 レコード盤の製造工程(二おいて、スタンパ−と呼ばれ
る薄型円盤状金属板が用いられることは良く知られてい
る。このスタンパ−は次の工程で作らnでいる。
(Technical background of the invention and its problems) It is well known that a thin disk-shaped metal plate called a stamper is used in the record manufacturing process (2). I'm n.

すなわちラッカー板に針を用いて溝状にパターンを刻設
して、まず原盤を作る。
In other words, a master disk is first created by carving a pattern in the form of grooves on a lacquer plate using a needle.

次にこの原盤に銀鏡反応等(二より、4電層な設けた後
、厚さ200〜30咽mのニッケルめっきを施し、剥離
したニッケル膜をマスターとした。次にマスター表面を
剥離処理した後、ニッケルめっきを施し、剥離したニッ
ケル膜なマザーとした。更にマザー表面を剥離処理した
後、ニッケルめっきを施し、剥離処理したニッケ/l’
lBf’をスタンパ−として使用するのである。
Next, this master was coated with silver mirror reaction (two to four electrical layers), and then nickel plating was applied to a thickness of 200 to 30 mm, and the peeled nickel film was used as a master. Next, the master surface was peeled off. After that, nickel plating was applied to obtain a peeled nickel film mother.Furthermore, after the mother surface was peeled, nickel plating was applied and the peeled nickel film was formed.
lBf' is used as a stamper.

これに対し、記録をより高密度にさせる目的で、例えば
硝子板に塗布した感光性樹脂膜に光学的エツチングを施
して、微細パターンを刻設した原盤が知られている。こ
の原盤からも、上記と同様にしてスタンパ−が得られる
On the other hand, master discs are known in which fine patterns are engraved by optically etching a photosensitive resin film coated on a glass plate, for example, in order to increase recording density. A stamper can also be obtained from this master in the same manner as described above.

このような微細パターンを持つ原盤よりスタンパ−を作
る際に、陽極として溶解性ニッケル陽極を使用した場合
、溶解させる金属が@極近傍で酸化して不溶解性沈澱物
のスライムを形成したり、あるいは陽極表面に酸化物の
スマットを生成したりする。これらは電鋳ニッケル膜内
にとり込まれ微細パターンを損なうという問題点があっ
た。さら(二、ニッケル陽aが溶(するC二したがって
その陽極と陰極との間の極間距離が変化してつ(られる
ニッケル膜の膜厚を不均一にする等の問題点もあった。
If a soluble nickel anode is used as an anode when making a stamper from a master disk with such a fine pattern, the metal to be dissolved may oxidize near the pole and form a slime of insoluble precipitates. Alternatively, oxide smut may be generated on the anode surface. There was a problem that these were incorporated into the electroformed nickel film and damaged the fine pattern. In addition, there were other problems such as the fact that the nickel anode (a) was dissolved (C2), which caused the distance between the anode and the cathode to change, making the thickness of the nickel film formed uneven.

これらの問題点は、特開昭58−157984に開示さ
れているように、陽極として不溶解陽極を使用するとと
ζ;より解決できる。
These problems can be better solved by using an insoluble anode as the anode, as disclosed in JP-A-58-157984.

しかしながら、従来使用されていた不溶解陽極は平板状
であったため、めっきする原盤を回転させても得られた
スタンパ−の中心部あるいは周辺部の膜厚が他の部分に
比べて厚くあるいは薄くなって不均一になりこれを使用
して複製したディスクの膜厚が不均一(二なるという間
匙点があった。
However, since the insoluble anodes conventionally used were in the form of a flat plate, the film thickness at the center or periphery of the stamper obtained could be thicker or thinner than other parts even if the master plate to be plated was rotated. The film thickness of the disks reproduced using this product was uneven (there was a point between two points).

〔発明の目的〕[Purpose of the invention]

この発明の目的は、微細パターンの転写性が良好で、か
つ均一な膜厚のスタンパ−が得られる電鋳装置を提供す
ることシニある。
It is an object of the present invention to provide an electroforming apparatus which has good transferability of fine patterns and can obtain a stamper having a uniform film thickness.

〔発明の概要〕[Summary of the invention]

本発明は、微細パターンが形成されている原盤を回転さ
せながら、不溶解陽極を用いて電鋳する電鋳装置におい
て、前記陽極が、中心部(二位置する第1の陽a部と、
前記WIlの陽極部のまわりに前記第1の陽極部と段差
を有して設けられた単数あるいは複数の第2の陽極部と
の組み合わせからなり、かつ前記第1の陽極部あるいは
第2の陽極部における前記原盤の回転の中心に対する位
置から、前記原盤と平行な方向で等距離にある同心円上
では少くども二種以上の異った極間距離を有している部
分があるとと゛を特徴としている。
The present invention provides an electroforming apparatus that performs electroforming using an insoluble anode while rotating a master disk on which a fine pattern is formed.
It consists of a combination of the first anode part and one or more second anode parts provided with a step around the anode part of the WIl, and the first anode part or the second anode part characterized in that there are parts having at least two or more different interpolar distances on concentric circles that are equidistant in a direction parallel to the master disc from the position with respect to the center of rotation of the master disc in the part. It is said that

第1図は1本発明に係る電鋳装置の一例を示した縦断面
模式図である。図で、原盤lはパターン面を露出面とし
たようにして回転陰極2に取付けられている。陽極部は
不溶解溶極で中心部(二位置する第1の陽極部(3り及
びそのまわりに段差を有シテ配置された第2の陽極部(
3b、3c、3d、3e、3りの組み合わせからなって
いる。そして、11!析槽゛4;′内に設けられためつ
き浴5中で電源6によりめっきが行なわれる。又、回転
陰極2はモーター7(二より所定の速度で回転する。一
方めっき浴5は循環用ポンプ8により溶解槽9から濾過
フィルター10を通して清浄にした後電析槽4(二供給
されまた溶解第19+二戻る。
FIG. 1 is a schematic vertical cross-sectional view showing an example of an electroforming apparatus according to the present invention. In the figure, a master disk 1 is attached to a rotating cathode 2 with its patterned surface exposed. The anode part is made of an insoluble melt electrode and consists of a first anode part located in the center (two corners) and a second anode part arranged around it with a step.
It consists of a combination of 3b, 3c, 3d, 3e, and 3ri. And 11! Plating is carried out by a power source 6 in a plating bath 5 provided in an analysis tank 4;'. The rotating cathode 2 is rotated at a predetermined speed by a motor 7 (2). On the other hand, the plating bath 5 is cleaned by a circulation pump 8 from a dissolution tank 9 through a filtration filter 10 and then supplied to an electrodeposition tank 4 (2). 19th+2 back.

ここで用いられる不溶解陽極の一例としてはニッケル板
に金又は白金を被覆したものあるいはチタン板1;金又
は白金を被覆したもの等があげられスー、$−L″f″
gM1□□□で云17かように段差を有して設けたこと
により半径方向において異なった極間距離ができ、これ
によってたとえば従来のような一枚の平板よりなる陽極
を用いた場合喀:めっき膜が厚くなってしまう周辺部の
ような位置では、極間距離を大きくすることができるの
で、所定の厚さにまで前記めっき膜の厚さを薄(するこ
とができる。そして前記第1のra&部あるいは第2の
陽極部における前記原板の回転の中心に対する位置から
、前記原盤と平行な方向で等距離にある同心円上におい
ては、少くとも二種以上の異なった極間距離を有してい
る部分があることから、より均一なめつき膜を形成する
ことが可能になる。これは、たとえば本発明に係る電鋳
装置の陽a部を例示した模式図である!2図のように第
1の陽極部(3Jl)及び第2の陽極部を楕円形状にす
ることによって、回転する原盤のある部分では第1の陽
極部(3a知1らだけよりめっきが施されるが、その外
側の部分では回転するに従って前記N&1の陽極部(3
り及び前記第1の陽極部(3a)とは極間距離の異なる
第2の陽極部(3b)から交互にめっきを施されさらに
その外側では第2の陽極部(3b)からだけによりめっ
きが施される。こうして、たとえば同心円状からなる段
差を有した第11i#1極部及び第2陽極部の組み合わ
せよりなる陽極を用いた場合に生じる段差に対応する部
分に起きやすいめっき膜の段差の生成を妨げて、より均
一な厚さのめつき膜をつくることができる。又、本発明
の電鋳装置と同様な効果を生む他の陽極としては、第3
図の模式図に示すようC;偏心した円の組み合わせ等が
あげられる。
Examples of insoluble anodes used here include a nickel plate coated with gold or platinum, or a titanium plate coated with gold or platinum.
gM1□□□ is provided with a step as shown in 17, which creates different distances between the poles in the radial direction.For example, when using a conventional anode made of a single flat plate: In a position such as the peripheral area where the plating film becomes thick, the distance between the electrodes can be increased, so that the thickness of the plating film can be reduced to a predetermined thickness. At least two or more different interpolar distances are provided on concentric circles that are equidistant from the center of rotation of the original plate in the ra& portion or the second anode portion in a direction parallel to the original plate. This is a schematic diagram illustrating the positive part of the electroforming apparatus according to the present invention!2, for example, as shown in Figure 2. By making the first anode part (3Jl) and the second anode part elliptical, plating is applied only to the first anode part (3A and 1) in a certain part of the rotating master, but the outside As the part rotates, the N&1 anode part (3
Plating is applied alternately from the second anode part (3b) having a different inter-electrode distance from the first anode part (3a), and plating is applied only from the second anode part (3b) on the outside thereof. administered. In this way, for example, the formation of a step in the plating film that is likely to occur in a portion corresponding to the step that occurs when using an anode consisting of a combination of the 11i #1 pole part and the second anode part having a concentric step is prevented. , it is possible to create a plated film with a more uniform thickness. In addition, as another anode that produces the same effect as the electroforming device of the present invention, the third anode
As shown in the schematic diagram, C: a combination of eccentric circles, etc.

これらの陽&はたとえば板状をした原材料を打ちぬいて
作製する他にも、1枚の原1材料をプレス等によりつな
げたまま加工して作製したり、複数の板な積み重ねて作
製することも可能である。
For example, in addition to making these plates by punching out a plate-shaped raw material, they can also be made by processing a single piece of raw material while being connected using a press, or by stacking multiple plates. is also possible.

以下に実施例を示す。Examples are shown below.

〔発明の実施例〕[Embodiments of the invention]

実施例1 第1図に示した構造を有する電鋳装置を用いて以下の条
件でめっきを行なった。
Example 1 Plating was carried out under the following conditions using an electroforming apparatus having the structure shown in FIG.

硝子板C:塗布した感光性樹脂膜に光学的エツチングを
施して微細パターンを刻設した原盤I:金を3001−
10001蒸看し、原盤のパターン面、に導電性を付与
した。ついでこの原盤lを回転陰極2にパターン面を露
出面としたように取付けた。陽極3としてはチタン板に
白金を被覆したものを用いた。その形状は第2図に示す
ような楕円状の6つのリングから構成されている。モー
タ7により約IQQRPMで回転している原盤lを電析
槽4のスルファミン酸ニッケルめっき浴5中で電源6に
より0.25.餡の厚さまでニッケルめっきした後、原
盤から電鋳膜を剥離すると、表面に金を付看した電鋳ニ
ッケル膜が光学ディスク形成用マスタースタンパ−とし
て得られた。ここで、めっき浴5は、スルファミン酸ニ
ッケル600.9/j、ホウ酸409/1とピット防止
剤ナイスター806(上材工業(株)商品名) l a
lll  とから構成した。
Glass plate C: Master plate I: Gold 3001-, with fine patterns engraved by optically etching the coated photosensitive resin film.
10001 to impart conductivity to the patterned surface of the master. Next, this master disk 1 was attached to the rotating cathode 2 so that the patterned surface was the exposed surface. As the anode 3, a titanium plate coated with platinum was used. Its shape consists of six elliptical rings as shown in FIG. The master l, which is being rotated by a motor 7 at approximately IQQRPM, is placed in a nickel sulfamate plating bath 5 in an electrodeposition bath 4 by a power source 6 at a rate of 0.25. After nickel plating to the thickness of the bean paste, the electroformed film was peeled off from the master disk, and an electroformed nickel film with gold on the surface was obtained as a master stamper for forming an optical disk. Here, the plating bath 5 contains nickel sulfamate 600.9/j, boric acid 409/1, and pit preventive agent Nystar 806 (product name of Uezai Kogyo Co., Ltd.) la
It was composed of llll.

又、めっきは浴温45℃、電流密度12A/do?浴の
pH4,2±0.2の条件で行なった。この電鋳装置で
は、陽極として不溶解陽極を使用するためζ二、めっき
中にニッケル濃度が減少し、浴のpHは低下する。その
ため、溶解種口炭酸ニッケル(NIC0,・2Ni(O
H)、・4H,0)を添加し、ニッケル濃度及び浴のp
Hf&:M潜時の値に保つようにした。
In addition, plating is performed at a bath temperature of 45°C and a current density of 12A/do? The test was carried out under the condition that the pH of the bath was 4.2±0.2. In this electroforming apparatus, since an insoluble anode is used as an anode, the nickel concentration decreases during plating, and the pH of the bath decreases. Therefore, dissolved seed nickel carbonate (NIC0,.2Ni(O
H), 4H,0), and the nickel concentration and bath p
The Hf&:M latency value was maintained.

第2図に例示したような陽極を構成する第1のMA極部
(3り及び第2の陽極部(3b)、(3C) 、 (3
d) 。
The first MA electrode part (3) and the second anode part (3b), (3C), (3
d).

(3e)、(3f)の各々と陰極との極間距離はそれぞ
れ20 、21 、22 、23 、24 、5011
1とした場合に、スタツフ、(−膜厚の半径方向の変化
は第4図の曲線(alに示したように半径145 al
lまでは250±2μmと非常に均一なものになった。
The distances between each of (3e) and (3f) and the cathode are 20, 21, 22, 23, 24, and 5011, respectively.
1, the change in the radial direction of the film thickness is given by the radius 145 al as shown in the curve (al) in Figure 4.
The thickness up to l was 250±2 μm, which was very uniform.

比較例として従来の平板陽極を使用し、極間距離を40
1111とした場合、スタンパ−膜厚の半径方向の変化
は第4図の曲線(b)に示したように半径145葬まで
で250士四μm と不均一なもの(二なった。
As a comparative example, a conventional flat plate anode was used, and the distance between the electrodes was set to 40.
1111, the change in the stamper film thickness in the radial direction is non-uniform (250 μm) up to a radius of 145 μm, as shown by curve (b) in FIG.

実施例2 第3図に示したような偏心した円からなる陽aを用いて
実施例1と同様の条件でめっきを行なった。この陽極は
第1の陽極部(3a)及び第2の陽極部(3b)、C3
C) 、(3d)、 (36)からなり、それぞれの陽
極部の外周は円形を有しているが内側に設けられた白状
の陽極部は偏心した位置に設けられている。
Example 2 Plating was carried out under the same conditions as in Example 1 using positive a made of an eccentric circle as shown in FIG. This anode includes a first anode part (3a) and a second anode part (3b), C3
C), (3d), and (36), and the outer periphery of each anode part is circular, but the white anode part provided inside is provided at an eccentric position.

又S第1の陽極部(3り及び第2の陽極部(3b)。Also, the S first anode part (3) and the second anode part (3b).

(3C)、(3d)、(3e)の各々は陰極との極間距
離を各々2211M 、 20fi 、 221111
 、2411m 、 50811としてめっきを行なっ
た。その結果、第5図の曲線(alに示すようにスタン
パ−膜厚の半径方向の変化は半径1451111までは
、250±2μmと非常に均一なもの(二なった。
For each of (3C), (3d), and (3e), the distance between the electrodes and the cathode is 2211M, 20fi, and 221111, respectively.
, 2411m, and 50811. As a result, as shown in the curve (al) of FIG. 5, the change in the stamper film thickness in the radial direction was very uniform (250±2 μm) up to the radius 1451111 (2).

また、比較例として従来の平板陽極を使用し、楢間距離
を40111とした場合、スタンパ−膜厚の半径方向の
変化は第5図の曲線(b)のように半径145m11+
までで250±20/xn と不均一なもの(=なった
In addition, as a comparative example, when a conventional flat plate anode is used and the distance between the rows is 40111, the change in the stamper film thickness in the radial direction is 145 m11+ as shown by the curve (b) in Figure 5.
Up to 250±20/xn, it was non-uniform (=).

〔発明の効果〕〔Effect of the invention〕

上述したようC二、本発明による電鋳装置では従来の平
板状の陽極を用いる場合に比べて極間距離に段差をもた
せたことにより、さら(二同心円状に配された陽&によ
るめっきを行なう時に生じやすい半径方向の段差も、め
っきされる部分によっては1段差を有する第1の陽極部
と第2の陽極部又は第2の陽極部の複数の陽極部から又
互にめっきされることにより、スタンパ−の膜厚を均一
にすることができる。
As mentioned above, in the electroforming apparatus according to the present invention, the distance between the electrodes is stepped compared to the case where conventional flat plate anodes are used. Depending on the part to be plated, the step in the radial direction that tends to occur when plating may be plated from the first anode part and the second anode part, or from a plurality of anode parts of the second anode part, which have one step difference depending on the part to be plated. This allows the thickness of the stamper to be made uniform.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る電鋳装置の模式縦断11i111
゜第を第3図は、本発明に係る電鋳装置に用いる陽極の
1例を上からみた形状を表わした模式図。 第4図、第5図は実施例シニおけるスタンバ−の膜厚及
び比較例におけるスタンバ−の半径方向に関する膜厚の
変化を示した特性因。 1・・・原l        2・・・回転陰極3・・
・陽極       3a・・・第1の陽極部(3b)
、(3C) 、(3d) 、(3e)、(3f)−・・
第2の陽極部4・・・電析槽      5・・・めっ
き浴6・・・電源       7・・・モーター8・
・・循環用ポンプ   9・・・溶解槽lO・・・濾過
フィルター 代理人 弁理士 則 近 憲 佑 (ほか1名) 第  1 図 第  2 図
FIG. 1 is a schematic longitudinal section 11i111 of the electroforming apparatus according to the present invention.
FIG. 3 is a schematic diagram showing the shape of an example of an anode used in the electroforming apparatus according to the present invention, viewed from above. FIGS. 4 and 5 are characteristic factors showing changes in the film thickness of the stub bar in the example and the comparative example in the radial direction. 1... Original l 2... Rotating cathode 3...
・Anode 3a...first anode part (3b)
, (3C) , (3d) , (3e), (3f) ---
Second anode part 4...Electrodeposition tank 5...Plating bath 6...Power supply 7...Motor 8.
...Circulation pump 9...Dissolution tank lO...Filtration filter representative Patent attorney Noriyuki Chika (and one other person) Figure 1 Figure 2

Claims (3)

【特許請求の範囲】[Claims] (1)微細パターンが形成されている原盤を回転させな
がら不溶解陽極を用いて電鋳する電鋳装置において、 前記陽極が、中心部に位置する第1の陽極部と、前記第
1の陽極部のまわりに前記第一の陽極部と段差を有して
設けられた単数あるいは複数の第2の陽極部との組み合
わせからなり、かつ前記第1の陽極部あるいは第2の陽
極部における前記原盤の回転の中心に対する位置から、
前記原盤と平行な方向で等距離にある同心円上では少く
とも二種以上の異つた極間距離を有している部分がある
ことを特徴とした電鋳装置。
(1) In an electroforming device that electroforms using an insoluble anode while rotating a master disk on which a fine pattern is formed, the anode includes a first anode portion located in the center, and a first anode the first anode part and one or more second anode parts provided with a step around the first anode part, and the master disc in the first anode part or the second anode part. From the position relative to the center of rotation of
An electroforming apparatus characterized in that there are parts having at least two or more different distances between poles on concentric circles that are equidistant in a direction parallel to the master disc.
(2)前記第1の陽極部あるいは第2の陽極部の少くと
も一方が楕円形状であることを特徴とした特許請求の範
囲第1項記載の電鋳装置。
(2) The electroforming apparatus according to claim 1, wherein at least one of the first anode portion and the second anode portion has an elliptical shape.
(3)前記第1の陽極部あるいは第2の陽極部の少くと
も一方が円形状を有し、かつ偏心した組み合わせである
ことを特徴とした特許請求の範囲第1項記載の電鋳装置
(3) The electroforming apparatus according to claim 1, wherein at least one of the first anode portion and the second anode portion has a circular shape and is an eccentric combination.
JP13010784A 1984-06-26 1984-06-26 Electroforming apparatus Granted JPS619590A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13010784A JPS619590A (en) 1984-06-26 1984-06-26 Electroforming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13010784A JPS619590A (en) 1984-06-26 1984-06-26 Electroforming apparatus

Publications (2)

Publication Number Publication Date
JPS619590A true JPS619590A (en) 1986-01-17
JPH0144794B2 JPH0144794B2 (en) 1989-09-29

Family

ID=15026116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13010784A Granted JPS619590A (en) 1984-06-26 1984-06-26 Electroforming apparatus

Country Status (1)

Country Link
JP (1) JPS619590A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104372385A (en) * 2013-08-13 2015-02-25 赛特莱特(佛山)塑胶制品有限公司 Electroforming tank

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104372385A (en) * 2013-08-13 2015-02-25 赛特莱特(佛山)塑胶制品有限公司 Electroforming tank

Also Published As

Publication number Publication date
JPH0144794B2 (en) 1989-09-29

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