JPS59150094A - Disc type rotary plating device - Google Patents

Abstract

PURPOSE:To enable uniform control of current density in the stage of plating in a disc type rotary plating device for producing a matrix for a disc record by forming an anode which is a plating metal with respect to a cathode which is the matrix into plural ring shapes and using respectively independent power sources for the same. CONSTITUTION:A matrix 13 is attached freely rotatably in a cathode chamber 23 and is connected via a fabric diaphragm 22 to an anode chamber 24 in the stage of plating Ni at a uniform thickness on the surface of a cathode disc 13 as a matrix for a disc record. Three pieces of annular anodes 41, 42, 43 contg. pellet-shaped Ni 50 in a Ti vessel are provided concentrically in an anode chamber 24 and the parts between the same are electrically insulated by means of partition plates 44, 45. The respective anodes are connected to the positive poles of respectively independent power sources 38, 39, 40, and the negative electrodes of the power sources are connected to the matrix 13 by means of a power feed brush 18. An Ni plating soln. is put in the device and while the matrix 13 is rotated with a motor 19, the voltages of the respective anodes are controlled, whereby the current for plating is conducted at uniform current density over the entire surface of the matrix 13 and the uniform Ni plating film is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an improvement in a disc-shaped rotary plating apparatus used for manufacturing Tisfle record circumferential types.

Conventional structure and problems Conventional disc-shaped rotary plating has been performed by using a disc-shaped object to be plated as a cathode in an electrolytic bath containing an electrolytic solution, and setting an anode at a position corresponding to the broken plating area. It is customary to apply a voltage between the cathode and anode while rotating the plate to deposit the desired metal onto the disc-shaped object to be plated. In this case, unless an insoluble anode is used, the anode corresponding to the disc-shaped rotating cathode has a special shape so that the current density in each part of the disc-shaped rotating cathode is high. In the case of disc-shaped rotary plating, differences occur in the electrical current density of each part of the disc-shaped object to be plated, resulting in differences in the amount of precipitation and the internal stress of the precipitates in each part of the disc-shaped plated object. In particular, in order to make the amount of precipitation, internal ratio of precipitates, and force uniform in each part where a large current is passed per unit area by placing the cathode or anode close to each other,
Attempts have been made to mask both the positive and negative poles and to use auxiliary yin-so, but even in the case of collapse, the negative and anode l
i4], which is contrary to the high-speed rotary plating method in which the anode and anode are brought close to each other, resulting in an increase in power consumption, an increase in the size of the equipment, and the need for additional voltage strips! Currently, this method is not generally implemented because it causes various problems, such as measures against electric shock to the human body that are inevitably caused by dogs.

On the other hand, the anode that corresponds to the disc-shaped rotating cathode seems to have the same current curvature in each part of the disc-shaped rotating cathode.

When a specially shaped and insoluble anode is used, it is possible to make the amount of precipitation and the internal stress of the precipitate uniform in each part of the disc-shaped object to be plated. However, since the anode is non-bath dissolvable, it is necessary to replenish the electrolyte with modern ions using metal salts. Currently, this method is not generally implemented due to restrictions imposed on it.

DESCRIPTION OF THE PREFERRED EMBODIMENTS As a conventional example, a disc-shaped rotary plating apparatus that is currently commonly used for manufacturing disk record master dies will be described below with reference to the drawings.

To manufacture a master mold for a disc record, an audio signal is recorded on a base material made of an aluminum disc coated with a resin using a disc recorder (cutting machine) to obtain a master disc 1 on which audio signals have been recorded. 300~3000 nickel, silver, copper, etc. metals are applied to this master disc 1 on which audio signals have been recorded by electroless plating, vacuum deposition, sputtering, etc.
The conductive coating 2 is coated to a thickness similar to that of the average thickness. Next, the audio signal-recorded master 1 to which the conductive film 2 has been applied is nickel plated (electroformed) with a thickness of 0.2 to ○, Bmm.
As shown in FIG. 2, the conductive film 2 is peeled off from the boundary between the master disc 1 on which audio signals have been recorded and the conductive film 2, and the conductive film 2 is coated with nickel with a thickness of 0.2 to 0.8 am. Obtain the master disc, that is, the metal master 3. Disc records use this metal master 3, and are usually of the aliphatic type, as shown in FIG. soaking,
Thermal 4) is deposited by dipping in an organic solution such as albumin or by forming an oxide film by anodic electrolytic strike, from the boundary between the coating 2' of the metal master 3 and the metal master 4, as shown in Figure 4. i! lJ rl to obtain metal mother 4. Furthermore, as shown in FIG. 5, the surface of the metal mother 4 is subjected to the same dehydration treatment as described above, and this treated surface 4'
0.2~0,3rrrm by nickel plating on top
Nickel 5 of J9- is precipitated and peeled off from the boundary of the metal mother 4 as shown in FIG. 6 to obtain Ninokel Skumper 5.

As described above, nickel plating (electroforming) forms the backbone of the manufacturing process in the manufacture of disk record master molds, and FIG. 7 shows a typical conventional disk-shaped rotary plating apparatus.

This disc-shaped rotary plating apparatus includes an electrolytic cell 10, a DC power source 11, an anode 12, a disc-shaped rotating cathode 13° partition wall 14, an electrolyte inlet 15, and an electrolyte outlet 16. The electrolytic cell 10 is a stainless steel container with a rubber lining 17 on the inner surface. The disc-shaped rotating cathode 13 is connected to the anode 12 via the DC power source 11 by a power supply brush 18, rotated by a motor 19, and connected to the pole 20 at the center of the disc rotation axis.
is a disk recorder 1, a master mold with audio signals recorded on it, and a metal master 3. Metal mother 4 to nut 21
It is shown so that it can be maintained by Disc-shaped rotating cathode 1
3 is a cathode chamber 23 formed by a synthetic resin partition wall 14 having a circular cloth partition 22 at the center of the bottom, and an anode 1
2 are respectively set in the anode chamber 24 formed by the electrolytic cell 10 and the synthetic resin partition wall 14, and the electrolyte (1 PLj
The WNk population 15 enters the cathode chamber 23 and after overflow enters the anode chamber 24. The electrolyte level in the anode chamber 24 is of A'tiE construction, which is lower than the electrolyte level in the cathode chamber 23.
It does not have 9 chambers between the cathode chamber and the anode chamber. Therefore, the anode 12 and disk-shaped rotating cathode 13 in the electrolytic cell can be energized via the electrolyte. The anode 12 is provided with a titanium container 26 filled with nickel pellets 25 .

27 is a pump that circulates the electrolyte, 28 is a 7L storage tank, and 29 is a ring that holds the area around the mold that is attached to the shade and shun 13. 30 is a motor support fitting, 31 is a top cover, 32 is a rotation shaft of the motor 19 and a cathode 130 rotation shaft 3
3, and 34 is an insulating layer. 3
5 is rotation Il! This is a spring that supports the power supply brush 18 in contact with the insulating material 36. 37 is an anode support stand.

It is composed of 74iH nickel sulfaminate, 11 fluoric acid, a small amount of surfactant (anti-pitting agent), nickel chloride, etc. An example of its formulation is shown below.

Nickel sulfamate 3501/β nickel sulfamate
30/β nickel chloride
6-/β-world m1 activator
2QC, /2 Next, as a specific example of nickel plating (electroplating) in the manufacture of disk record mother molds, metal mother 4
A method for manufacturing the nickel stamper 5 will now be described.

Prior to nickel plating, p of the electrolyte according to the above formulation example is
Adjust H to 42±0.1 with acid or alkali, and set a temperature to 53°C±2°C. The circulation pump 27 supplies the stain decomposition solution from the electrolyte solution 15 to the cathode chamber 23 L''PtPt
The electrolytic solution flowing into the electrode chamber enters the anode chamber 24, and the excess electrolyte in the anode chamber returns to the circulation pump 27 via the storage tank 28. In this way, preparation for nickel plating is completed.

After cleaning, the metal mother 4 was passivated by immersion in a potassium dichromate solution and thoroughly washed with water. 20 into the center hole of the metal motherboard 4, and fix it with two nuts 21, and fix it even more firmly with the peripheral part holding ring 29. Next, start the motor 19, rotate the disc-shaped rotating shade @13, and immediately turn on the DC% source 11 to
Apply voltage and conduct current. This current has a diameter of 350m1
In the case of li matrix, the current is 30A for 5 minutes after turning on, and then 1
Applying 40A current, the nickel plating is completed with a total current of 140 amperes/hour. The fixation of the modern mother 4 is released from the disk-shaped rotating cathode 13, and the disk on which the Ninokel Skumper 5 is deposited on the Ei mother is removed. After washing and drying, Kinpu Mother 4 and Ninokel Skumper 5 are separated from each other at the boundary to obtain Ninokel Skumper 5. There is no discernible difference in the first base of the nickel stamper 5 on the same circle as above when measured using a micrometer. On the other hand, there are large differences between each portion in the diametrical direction.

Table 1 shows the results of adding the thicknesses of the nickel stampers obtained as described above at different distances from the center no. In addition, @ samples are all 152
It is y-.

(Left below) In Table 1, the reason why the wall thickness near the periphery is 20 to 40% larger than that near the center is because the current is concentrated in the periphery. That is, the current distribution is not uniform. Generally, it is known that if the composition of the electrolytic solution and the electrolytic conditions (excluding the current density) are constant, the internal stress of the precipitate has a value of -1 for each current density. Therefore, the fact that the current distribution is uniform means that the internal stress of the precipitate is not uniform.

As a result of the above, the peripheral portion of the nickel stamper 5 curls into a bowl shape as shown in FIG. 8 due to the influence of tensile stress.

On the other hand, a disk record is manufactured by resin molding through a master disk 1 on which an audio signal is recorded, a metal master 3, a metal fly mother 4, and a Ninokel Skumper 5. That is, the nickel plating process is usually performed three times. In this process, the flatness of the Ninokel Skumper 5 is impaired due to the influence of the internal stress of the precipitates, and as a result, the flatness of the disc record is lost.

Although disc records maintain their apparent flatness, they have ridges of various sizes that impede signal reproduction.

It is generally known that the internal stress of two-layer plating deposits can be improved by gradually adding additives to the electrolyte. Saccharin, sulfone, etc. as additives that reduce total internal stress.
Amidobenzene.

There are compounds such as sulfonamide paratoluene and 1,3.6-f phthaline sulfonic acid. However, it is also known that even if the additives that reduce the internal stress are taken into account, the internal stress is not made equal at each current density. From the above, in order to make the internal stress uniform and suppress it to near zero, it is first necessary to make the current distribution uniform. It is necessary to equalize the current density in the sealing part and use an appropriate amount of stress reducing agent (However, the current density flowing on the surface of the electroforming mold and the
It varies considerably depending on the shape of the @-type and the shape of the anode, and it is impossible to work with a uniform current density, and the value of the current density that makes the internal stress of the precipitate zero is known. However, the current situation is that nothing can be done about it as long as uniform electrodeposition cannot be achieved at that current density.

However, there is a theory that the current density can be made completely uniform by making the distance between the anode and the anode five or more times the diameter of the disk, but this is economically difficult. Also, have any attempts been made to reduce excessive current by masking the anode or cathode with a baffle plate, or by using an auxiliary cathode?

The reality is that it cannot be quantitatively controlled and the expected effects cannot be obtained.

Purpose of the Invention The present invention is intended to solve the above-mentioned disadvantages. In particular, in a high-speed disc-shaped rotary knob in which the negative and anodes are brought close to each other and a large current is passed per unit area, each part of the disc-shaped rotating cathode is An object of the present invention is to provide an apparatus that controls the current density of the plating object, makes the internal stress of the precipitate uniform in each part of the disc-shaped object to be plated, and obtains the required amount of deposit on each part of the object to be plated.゛---------Constitution of the Invention The present invention is directed to an electrolytic cell composed of a plurality of anodes and a disk-shaped rotating common cathode of 111-, in which each of the plurality of anodes is
Each current is controlled by connecting to a single disk-shaped rotating common cathode via a current power source, applying a DC voltage between each cathode and anode, and controlling the applied voltage between each cathode and anode. The amount of precipitation and the internal stress of the precipitate at the portion corresponding to each of the plurality of anodes of a single disk-shaped rotating common cathode are calculated as 11ilJ.
It is configured so that m+.

DESCRIPTION OF EMBODIMENTS An embodiment in which the present invention is applied to a disk-shaped rotary plating apparatus used for manufacturing a master mold for a disk record will be described below in sequence with reference to the drawings.

Note that the present invention is not limited to the production of master molds for disc records, but can also be applied to compact discs and video discs.

The information can be applied to various dosage types.

It is not particularly limited.

FIG. 9 shows a disc-shaped rotary plating apparatus according to the present invention.

This disk-shaped rotary plating apparatus has a cathode side having the same structure as the conventional example described above. 38, 39.

40 are independent DC power supplies, 41, 42, 43 are the first
It is an anode configured in a triple ring shape as shown in Figure 0.
The anode is a ring-shaped separator plate 44 made of an electrical insulator 2.
45.

The disk-shaped rotating common cathode 13 is an anode composed of the three parts 41, 42, 43 via the shaft 33, the power supply brush 18, and the stand, which are independent DC power supplies 38°39.4Q.
It is electrically connected to each of the anode electrodes 4'6, 47°48, and is rotatable by a motor 19. This disk-shaped rotating common cathode 13 is made of synthetic resin and has a circular cloth diaphragm 22 at the center of the bottom surface.
In the cathode chamber 23 formed by
and the anode support base 3 of the anode chamber 24 formed by the partition wall 14
7, the electrolyte enters the cathode chamber 23 from the electrolyte inlet 15, and after overflowing, enters the anode chamber 24. Although the electrolyte level of the anode chamber 24 is lower than the electrolyte level of the cathode chamber 23, there is no space between the cathode chamber and the anode chamber. Therefore, each of the anodes 41, 42, 43 and the disc-shaped rotating common cathode 13, which are comprised of the three parts in the electrolytic cell, can be electrically energized through the electrolyte. Anodes 41, 42 composed of the three parts. ．． 43 are independent donut-shaped titanium cases 49 filled with pellet-like nickel 50, and have a triple structure. Electron 7Q liquid is composed of nickel sulfamate, fluoric acid, a small amount of interface, a surface active agent (antivit agent), a stress reducing agent, cobalt chloride, and nickel chloride. A formulation example is shown below.

Example 1 Nickel sulfamate 55oy-/β oxalic acid
30n/f nickel chloride
6y-/β surfactant (antivital agent) 2CC, 76 example 2 Sulfur amino acid nickel 350-/β oxalic acid
30! ? /β cobalt chloride
30y-/β stress reducer 12t
/β surfactant (anti-hit agent), 2CC, /β Next, as a specific example of nickel plating in the production of a tape recorder type according to the present invention.

The nickel stamper 5 is manufactured from the metal mother 4 and the nickel plating according to the electrolytic solution formulation example 1 and formulation example 2 will be explained.

Prior to nickel plating, p of the electrolyte according to the above formulation example is
Adjust H to 4°2±0.1 with acid or alkali, and set the liquid temperature to 53°C±2°C. The circulation pump 27 supplies the electrolyte solution to the cathode chamber 23 from the electrolyte solution 15 . The electrolyte that overflows in the cathode chamber enters the anode chamber 24, and the excess electrolyte in the anode chamber returns to the circulation pump 27 via the storage tank 28. Preparation for nickel plating is completed in the above manner.

After cleaning, the metal mother 4 was subjected to passivation treatment in the same manner as described above by immersing it in a potassium dichromate solution.

Wash thoroughly with water. And rotation II of the disc-shaped rotating common cathode 13 of the disc-shaped rotary plating device! 1l133 Attach the center hole of the metal motherboard 4 to the center bolt 20, and then attach the nut 2
1, and further firmly fixed by the peripheral portion holding link 29. Next, the motor 19 is started, the common cathode 13 is rotated, and the DC power source 38.3 is directly activated.
9. Apply voltage and conduct current according to 40. In the case of a mother mold with a diameter of 350 mm, the total current is 3 OA for 5 minutes after energization.
and the respective ratio is power supply 38:39:4o=
o, s: 1:1.1. After 5 minutes have elapsed, the DC power source is boosted to bring the total current to 140A. The ratio of each DC power source is 38:39:40=0.7:1
The knee is 1.1. Nickel plating is completed when the total current is 140A. After completing the nickel plating, release the fixation of the metal mother 4 from the disk-shaped rotating common cathode, and
The disk on which the nickel stamper 5 is deposited is removed. After washing and drying, Metal Mother 4 and Ninokel Skumper 5
Separate the two from the boundary to obtain Ninokelskumper 5. There is no discernible difference in the wall thickness of Ninokel Skumper 5 obtained as described above in the same manner as above and in the field soil using a micrometer. On the other hand, the wall thickness at each fixed point along the diametrical direction was within ±3 coefficients of the standard wall thickness. B-5 shows the results using the electrolytic solution of Formulation Example 1, and samples B-6 to B-1'O show the results using the electrolytic solution of Formulation Example 2. In addition, the weight of each sample is 15
2y-.

Effects of the Invention As described above, the plating apparatus of the present invention has an electrolytic cell composed of a plurality of anodes and a single disk-shaped rotating common cathode.
Since each of the plurality of anodes is connected to a single disk-shaped rotating common cathode through each power source, a DC voltage is applied between each negative and positive electrode, and the applied voltage between each negative and positive electrode is controlled respectively. death,
Uniform cathode current density can be easily obtained by controlling the % light density of the parts corresponding to the plurality of anodes of a single disc-shaped rotating common gruesome object. The amount of precipitation and the internal stress of the precipitate were controlled by jli:4. In addition, the electrolyte of Formulation Example 2 contains 301
/l of cobalt chloride, the precipitate becomes an alloy of nickel and cobalt, and the cobalt content in the precipitate is 2.
At 7% by weight, the Vickers hardness showed nv470. On the other hand, in the above formulation example 1, the precipitates from the electrolyte that does not contain cobalt ions also have a Vickers hardness of HV2 when deposited by conventional or disc-shaped rotary plating method according to the present invention.
It did not exceed 00. As described above, the alloy precipitates of nickel and cobalt are close to ideal for molding molds that require hardness or IS, and therefore, abrasion resistance.

Such nickel-cobalt alloy plating is sensitive to changes in cathode current density, and small changes in cathode current density will cause rapid stress fluctuations, making it especially unconventional if a uniform cathode current density cannot be obtained. Although it was impossible to apply 1
Since the present invention can easily make the cathode current density uniform, it is possible to obtain cobalt-nickel alloy precipitates as shown in Table 2 above. The ability to make the cathode current density uniform (that is, in one example other than the examples described above, it is possible to modify nickel precipitates by gradually adding an organic compound to the electrolytic solution).

[Brief explanation of the drawing]

Figures 1 to 6 are diagrams showing the process of obtaining a nickel stamper 1 from a master disk on which audio signals have been recorded, Figure 7 is a longitudinal cross-sectional view of a typical conventional disc-shaped rotary plating device, and Figure 8 is the surrounding area. 9 is a longitudinal sectional view showing an embodiment of the disc-shaped rotary plating apparatus according to the present invention, and FIG. 10 is a sectional view taken along the line xx' in FIG. 9. Blood diagram, Figure 11 is the vertical rotational phase diagram of the titanium anode,
FIG. 12 is a longitudinal cross-sectional side view of the same. 10... Electrolytic cell, 13... Disc-shaped rotating cathode, 38-40... Power supply, 41, 42.43...
····anode. 49...Container, 50...Bellet-shaped nickel. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 3, 9 Figure 4, ? Figure 5 Figure 7 tq Figure 8 Figure 9 Q Figure 10 Figure 11

Claims (1)

[Claims] An electrolytic cell consisting of multiple anodes and a single disc-shaped rotating common cathode (7 fires) is constructed by connecting each of the multiple anodes to a single disc-shaped rotating cathode and cathode through each power supply. A disc-shaped rotary plating device configured to control the DC voltage applied between the corner and anode.