JPS619262U - Tweezers for semiconductor wafer processing - Google Patents
Tweezers for semiconductor wafer processingInfo
- Publication number
- JPS619262U JPS619262U JP9362184U JP9362184U JPS619262U JP S619262 U JPS619262 U JP S619262U JP 9362184 U JP9362184 U JP 9362184U JP 9362184 U JP9362184 U JP 9362184U JP S619262 U JPS619262 U JP S619262U
- Authority
- JP
- Japan
- Prior art keywords
- tweezers
- semiconductor wafer
- wafer processing
- contact
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、本考案の一実施例を示す側面図である。
１１・・・・・・接触部、１２・・・・・・操作部、１
３・・・・・・支点部、１４・・・・・・ギア部。
第２図ａ， ｂおよびＣは第１図で示した接醇部の拡大
図で、それぞれ平面図、正面図、側面図である。
２１．２２・・・・・・接触面。第３図は第１図で示し
た操作部の拡大図である。
３１，３２・・・・・・操作棒、３３・・・・・・ギア
部。第４図ａおよびｂはギア部分の拡大図であり、ギア
解放時の断面図および側面図である。
４１，４３・・・・・・ギア底部、４２，４２’・・・
・・・先端カギ部。
第５図は第４図で示したギア部分がロックされた状態の
断面図および側面区である。
第６図は本考案の他の実施例による操作部の側面図であ
る。
６ｉ，６２・・・・・・操作棒、６３・・・・・・スプ
リング。FIG. 1 is a side view showing an embodiment of the present invention. 11...Contact part, 12...Operation part, 1
3... Fulcrum part, 14... Gear part. 2A, 2B and 2C are enlarged views of the welding part shown in FIG. 1, and are a plan view, a front view, and a side view, respectively. 21.22...Contact surface. FIG. 3 is an enlarged view of the operating section shown in FIG. 1. 31, 32... Operating rod, 33... Gear part. FIGS. 4a and 4b are enlarged views of the gear portion, and are a cross-sectional view and a side view when the gear is released. 41, 43... Gear bottom, 42, 42'...
...Tip key part. FIG. 5 is a sectional view and side view of the gear portion shown in FIG. 4 in a locked state. FIG. 6 is a side view of an operating section according to another embodiment of the present invention. 6i, 62... Operating rod, 63... Spring.
Claims (1)
を加えその圧力を固定し一定量以上の圧力負荷を阻止す
る操作部分と、前記接触部分と前記操作部分との間の位
置で交差接続する支点部とを有することを特徴とする半
導体ウエハ処理用ピンセット。A contact part that makes two-dimensional contact with the wafer surface, an operating part that applies pressure during operation and fixes the pressure to prevent a pressure load exceeding a certain amount, and a cross connection at a position between the contact part and the operating part. 1. Tweezers for processing semiconductor wafers, characterized in that the tweezers have a fulcrum part that supports the fulcrum part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9362184U JPS619262U (en) | 1984-06-22 | 1984-06-22 | Tweezers for semiconductor wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9362184U JPS619262U (en) | 1984-06-22 | 1984-06-22 | Tweezers for semiconductor wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS619262U true JPS619262U (en) | 1986-01-20 |
Family
ID=30651463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9362184U Pending JPS619262U (en) | 1984-06-22 | 1984-06-22 | Tweezers for semiconductor wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619262U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06185711A (en) * | 1992-12-18 | 1994-07-08 | Rinnai Corp | Fire transferring device |
-
1984
- 1984-06-22 JP JP9362184U patent/JPS619262U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06185711A (en) * | 1992-12-18 | 1994-07-08 | Rinnai Corp | Fire transferring device |
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