JPS6338288U - - Google Patents
Info
- Publication number
- JPS6338288U JPS6338288U JP13156686U JP13156686U JPS6338288U JP S6338288 U JPS6338288 U JP S6338288U JP 13156686 U JP13156686 U JP 13156686U JP 13156686 U JP13156686 U JP 13156686U JP S6338288 U JPS6338288 U JP S6338288U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- package
- lead
- pad
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図乃至第４図は本考案のＩＣソケツトの一
実施例を示し、第１図はＩＣパツケージが装填さ
れた状態の縦断面図、第２図はリードとコンタク
トピンとの接触状態を示す部分拡大図、第３図は
リードとコンタクトピンの傾斜角度の関係につい
て示す部分断面図、第４図はコンタクトピンの第
１図とは異なる列設態様を示す説明図、第５図乃
至第１１図は従来のＩＣソケツトの一例を示し、
第５図は平面図、第６図は横断面図、第７図はリ
ードの先端部とコンタクトピンの接触部との関係
を示す部分断面図、第８図はソケツトの押え板が
閉じた時点のリードに対する押圧状態を示す部分
断面図、第９図はリードの変形状態を示す部分側
面図、第１０図はＩＣパツケージがソケツト内に
完全に装填された場合のリードとコンタクトピン
との接触状態を示す部分断面図、第１１図は変形
せしめられたリードを示す図である。
１……基板、２……押え板、３……係止部材、
４……コンタクトピン、５……接触部、５ａ，５
ｂ……接触面、６……パツド、６ａ……押圧面。
1 to 4 show an embodiment of the IC socket of the present invention, FIG. 1 is a longitudinal cross-sectional view of the IC package loaded, and FIG. 2 is a portion showing the state of contact between the lead and the contact pin. 3 is a partial cross-sectional view showing the relationship between the inclination angles of leads and contact pins; FIG. 4 is an explanatory view showing a different arrangement of contact pins from that shown in FIG. 1; FIGS. 5 to 11 shows an example of a conventional IC socket,
Fig. 5 is a plan view, Fig. 6 is a cross-sectional view, Fig. 7 is a partial sectional view showing the relationship between the tip of the lead and the contact part of the contact pin, and Fig. 8 is the state when the holding plate of the socket is closed. FIG. 9 is a partial side view showing the deformed state of the lead, and FIG. 10 shows the contact state between the lead and the contact pin when the IC package is completely loaded into the socket. FIG. 11 is a partial sectional view showing a deformed lead. 1... Board, 2... Holding plate, 3... Locking member,
4...Contact pin, 5...Contact part, 5a, 5
b...Contact surface, 6...Pad, 6a...Press surface.
Claims (1)
ピンの上端接触面が装填位置の該パツケージの表
面に対し傾斜するように形成されると共に、上記
リードを押圧するパツドの下端押圧面が該パツド
の押圧位置において上記接触面と平行になるよう
に形成されているフラツト型ＩＣパツケージ用の
ＩＣソケツト。 The upper end contact surface of the contact pin that comes into contact with the lead of the IC package is formed to be inclined with respect to the surface of the package at the loading position, and the lower end pressing surface of the pad that presses the lead is located above the surface of the pad at the pressing position. An IC socket for a flat type IC package that is formed parallel to the contact surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13156686U JPH0329901Y2 (en) | 1986-08-28 | 1986-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13156686U JPH0329901Y2 (en) | 1986-08-28 | 1986-08-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6338288U true JPS6338288U (en) | 1988-03-11 |
| JPH0329901Y2 JPH0329901Y2 (en) | 1991-06-25 |
Family
ID=31030136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13156686U Expired JPH0329901Y2 (en) | 1986-08-28 | 1986-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0329901Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0855665A (en) * | 1995-08-23 | 1996-02-27 | Enplas Corp | Ic socket |
-
1986
- 1986-08-28 JP JP13156686U patent/JPH0329901Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0855665A (en) * | 1995-08-23 | 1996-02-27 | Enplas Corp | Ic socket |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0329901Y2 (en) | 1991-06-25 |
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