JPS6177579U - - Google Patents
Info
- Publication number
- JPS6177579U JPS6177579U JP16276084U JP16276084U JPS6177579U JP S6177579 U JPS6177579 U JP S6177579U JP 16276084 U JP16276084 U JP 16276084U JP 16276084 U JP16276084 U JP 16276084U JP S6177579 U JPS6177579 U JP S6177579U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- socket body
- holes
- attached
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は、本考案にかかる半導体集積回路用ソ
ケツトの構成を示す斜視図、第２図は、従来の半
導体集積回路用ソケツトの構成を示す斜視図であ
る。
１…ソケツト本体、２，２０，２１…外部リー
ド挿通孔、３，３０，３１…ピン、４，５…欠除
部。
FIG. 1 is a perspective view showing the structure of a socket for a semiconductor integrated circuit according to the present invention, and FIG. 2 is a perspective view showing the structure of a conventional socket for a semiconductor integrated circuit. 1... Socket body, 2, 20, 21... External lead insertion hole, 3, 30, 31... Pin, 4, 5... Missing part.
Claims (1)
配置と合致し、かつ、外部リード数と同数の貫通
孔が穿設され、さらに、同貫通孔のすべてにピン
が取り付けられ、その各一端がソケツト本体の下
方へ導出されるとともに、前記貫通孔の所定のも
のが、ソケツト本体の側面部から貫通孔にまで達
する欠除部を介してソケツト本体の側面部に開放
し、前記貫通孔に取りつけられたピンの一部が露
出していることを特徴とする半導体集積回路用ソ
ケツト。 The socket body has through-holes that match the external lead arrangement of the semiconductor integrated circuit and have the same number of external leads.Furthermore, pins are attached to all of the through-holes, and one end of each is attached to the socket body. At the same time, a predetermined one of the through holes is opened to the side surface of the socket body through a cutout extending from the side surface of the socket body to the through hole, and the pin attached to the through hole is guided downward. A socket for a semiconductor integrated circuit, characterized in that a part of the socket is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16276084U JPS6177579U (en) | 1984-10-26 | 1984-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16276084U JPS6177579U (en) | 1984-10-26 | 1984-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6177579U true JPS6177579U (en) | 1986-05-24 |
Family
ID=30720632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16276084U Pending JPS6177579U (en) | 1984-10-26 | 1984-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6177579U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013041710A (en) * | 2011-08-12 | 2013-02-28 | Kel Corp | Ic socket |
-
1984
- 1984-10-26 JP JP16276084U patent/JPS6177579U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013041710A (en) * | 2011-08-12 | 2013-02-28 | Kel Corp | Ic socket |