JPS63159777U - - Google Patents
Info
- Publication number
- JPS63159777U JPS63159777U JP5367287U JP5367287U JPS63159777U JP S63159777 U JPS63159777 U JP S63159777U JP 5367287 U JP5367287 U JP 5367287U JP 5367287 U JP5367287 U JP 5367287U JP S63159777 U JPS63159777 U JP S63159777U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- measured
- convex portion
- lid body
- evaluation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011156 evaluation Methods 0.000 claims description 4
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
第１図は本考案に係る評価用ＩＣソケツトの使
用状態を示す斜視図、第２図ａおよびｂは同じく
評価用ＩＣソケツトのソケツト本体を示す平面図
と正面図、第３図ａおよびｂはその蓋体を示す平
面図と正面図、第４図ａおよびｂは従来の評価用
ＩＣソケツトを示す平面図と正面図、第５図はそ
の使用状態を示す斜視図である。
１１……ソケツト本体、１１ａ……端子、１２
……被測定ＩＣ、１２ａ……ピン、１３……測定
用ボード、１６……凸部、１７……テーパ面、１
８……蓋体、１９……凹部。
Fig. 1 is a perspective view showing the usage state of an IC socket for evaluation according to the present invention, Figs. 2 a and b are a plan view and a front view showing the socket body of the IC socket for evaluation, and Figs. 3 a and b are FIGS. 4a and 4b are a plan view and a front view showing a conventional evaluation IC socket, and FIG. 5 is a perspective view showing its use. 11...Socket body, 11a...Terminal, 12
...IC to be measured, 12a...Pin, 13...Measurement board, 16...Protrusion, 17...Tapered surface, 1
8...Lid body, 19...Recessed portion.
Claims (1)
ケツト本体と、このソケツト本体に着脱自在に装
着され被測定ＩＣを押圧可能な蓋体とを備え、こ
の蓋体のＩＣ押圧位置周囲に凹部を設け、この凹
部に嵌合する凸部を前記ソケツト本体に設け、こ
の凸部に被測定ＩＣを案内するテーパ面を形成し
たことを特徴とする評価用ＩＣソケツト。 The socket includes a socket body having a terminal capable of contacting the pins of the IC to be measured, and a lid body which is detachably attached to the socket body and can press the IC to be measured, and a recess is provided around the IC pressing position of the lid body. An IC socket for evaluation, characterized in that the socket main body is provided with a convex portion that fits into the concave portion, and a tapered surface for guiding an IC to be measured is formed on the convex portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5367287U JPS63159777U (en) | 1987-04-08 | 1987-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5367287U JPS63159777U (en) | 1987-04-08 | 1987-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63159777U true JPS63159777U (en) | 1988-10-19 |
Family
ID=30879953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5367287U Pending JPS63159777U (en) | 1987-04-08 | 1987-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63159777U (en) |
-
1987
- 1987-04-08 JP JP5367287U patent/JPS63159777U/ja active Pending
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