JPS6258780U - - Google Patents
Info
- Publication number
- JPS6258780U JPS6258780U JP15029685U JP15029685U JPS6258780U JP S6258780 U JPS6258780 U JP S6258780U JP 15029685 U JP15029685 U JP 15029685U JP 15029685 U JP15029685 U JP 15029685U JP S6258780 U JPS6258780 U JP S6258780U
- Authority
- JP
- Japan
- Prior art keywords
- floating plate
- bump
- main body
- hole
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 3
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
Description
第1図は本考案のICソケツトの縦断面図、第
2図はフローテイングプレートが上昇した状態の
一部分の拡大断面図である。
1……本体、2……スプリングプローブ、3…
…ガイドピン、4……フローテイングプレート、
4b……凹部、4c……透孔、6……IC、6a
……バンプ、7……カバー板、8……押え部材。
FIG. 1 is a longitudinal sectional view of the IC socket of the present invention, and FIG. 2 is an enlarged sectional view of a portion of the IC socket with the floating plate raised. 1...Main body, 2...Spring probe, 3...
...Guide pin, 4...Floating plate,
4b... recess, 4c... through hole, 6... IC, 6a
...Bump, 7...Cover plate, 8...Press member.
Claims (1)
の本体上に上下動可能に取付けられかつ上方へ弾
圧されているフローテイングプレートと、このフ
ローテイングプレート上に検査されるべきICを
挟んで載置されるカバー板とを備えたICソケツ
トにおいて、 前記フローテイングプレートにはこの上に載置
されるICのバンプに対応する位置に前記スプリ
ングプローブを挿通するためにあけられた透孔の
上側開口端に前記ICのバンプが嵌合すべき凹部
を形成したことを特徴とするICソケツト。[Claims for Utility Model Registration] A main body provided with a plurality of spring probes, a floating plate mounted on the main body so as to be movable up and down and pressed upward, and a device to be inspected on the floating plate. In the IC socket, the floating plate is provided with a cover plate that is placed on both sides of the IC, and a hole is formed in the floating plate in order to insert the spring probe at a position corresponding to the bump of the IC that is placed on the floating plate. An IC socket characterized in that a recess into which a bump of the IC is to be fitted is formed at the upper opening end of the through hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15029685U JPS6258780U (en) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15029685U JPS6258780U (en) | 1985-09-30 | 1985-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6258780U true JPS6258780U (en) | 1987-04-11 |
Family
ID=31066306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15029685U Pending JPS6258780U (en) | 1985-09-30 | 1985-09-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6258780U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06203926A (en) * | 1992-12-25 | 1994-07-22 | Yamaichi Electron Co Ltd | Ic socket |
WO2008102652A1 (en) * | 2007-02-21 | 2008-08-28 | Japan Aviation Electronics Industry, Limited | Socket and inspection device using it |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4917685A (en) * | 1972-06-05 | 1974-02-16 | ||
JPS5824871A (en) * | 1981-08-06 | 1983-02-14 | Fujitsu Ltd | Package measuring jig for semiconductor |
-
1985
- 1985-09-30 JP JP15029685U patent/JPS6258780U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4917685A (en) * | 1972-06-05 | 1974-02-16 | ||
JPS5824871A (en) * | 1981-08-06 | 1983-02-14 | Fujitsu Ltd | Package measuring jig for semiconductor |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06203926A (en) * | 1992-12-25 | 1994-07-22 | Yamaichi Electron Co Ltd | Ic socket |
WO2008102652A1 (en) * | 2007-02-21 | 2008-08-28 | Japan Aviation Electronics Industry, Limited | Socket and inspection device using it |
JP4847575B2 (en) * | 2007-02-21 | 2011-12-28 | 日本航空電子工業株式会社 | Socket and inspection device using the same |