JPS5824871A - Package measuring jig for semiconductor - Google Patents

Abstract

PURPOSE:To bring a spring pin into contact with a load section by placing to an IC package in a positioning hole on a pachage lifting resin plate to position while a guide hole provided on said resin plate is utilized with the pressurizing section being pushed down. CONSTITUTION:An IC package 35 is placed in a positioning hole 40 on a package lifting resin plate 38 to position. At this point, a pressurizing section 50 turns a supporting section 52 to such a position as facilitating mounting of the IC package. Then, a IC package set rear rod 51 is lowered so that a lead section 36 of the IC package will be pressurized with a pressurizing section 50. With the lowering of the pressurizing section 50, the package lifting resin plate 38 is forced down to a resin plate 32 so as to bend a plate spring 39. The lead section 36 of the IC package 35 gets in contact with the tip of a spring pin 33 compressing it being guided with a pin guide hole 41 provided on the package lifting resin plate 38. The other end of the spring pin comes in contact with an IC tester to test characteristics of the IC package.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device measuring jig having a package lifting mechanism.

2. Description of the Related Art Conventionally, flat package type IC measuring jigs as shown in FIGS. 1(a) and 1(b) are shown in plan and side views. In the figure, 1 is a contact that has a slightly shaped shape and has spring properties. 2 is a groove in which all the contacts 1 are arranged at the bottom, which positions the lead part of a flat package type IC. 3 is a resin base in which the contact 1 is completely molded. 4 is a resin holding lid that presses the lead part 8 onto the contact 1 with the convex part 5 after positioning the lead part B of the flat package C (shown as a dot) in the groove 2 of the resin base 3, and 6 fixes the lid. The claw-like hook is part. Flat package ■C is shown in Figure 1 (a
) is indicated by a dotted line.

The above-mentioned conventional IC measuring jig requires positioning 17 of the TC in the sun-shaped groove 2 of the resin base 3, and then fixing the presser cover 4 with the claws 6, which results in very poor workability and an unsatisfactory IC.
The drawback was that it was not suitable for the C test. In order to improve this point, as shown in FIG. 2, the IC package 23 is positioned in the package alignment hole 22 provided in the resin plate 21, and the contactor 24 is
A tester has been developed that tests the electrical characteristics of all ICs by lowering the resin plate 25 embedded with the contact and applying the contact 24 to the lead part 26 of the package 23. (not shown), the signal line becomes long and measurement accuracy is reduced.

The present invention has been made in view of the above-mentioned points, and includes: an insulating plate in which a spring bin is embedded through the hole; an insulating plate for floating a package having a frame, a semiconductor package positioning hole, and a spring pin positioning hole; It has an insulator pressurizing part for the lead terminal of the semiconductor package, and the package floating insulating plate is vertically movably supported within the frame by an elastic body, and when no force is applied from the insulator pressurizing part, Fi is applied. The lead terminal of the semiconductor package positioned in the semiconductor package positioning hole and the spring pin are not in contact with each other, but the lead terminal and the spring pin are in contact when force is applied from the insulator pressurizing part. The present invention provides a semiconductor package measuring jig characterized by the following.

That is, the objects of the present invention are (1) to be able to perform measurements without a carrier and without deteriorating the characteristics, and (2) to be able to easily perform alignment. The feature is that the package positioning plate can be moved by a spring or the like. At the time of alignment, the package is floating above the measurement contact, and the entire IC can be easily set without applying stress to the leads. Next, when the leads of the package are pressed down from above, they come into contact with the alignment plate, making it easy to align the package and providing good characteristics.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC measuring jig having a package lifting mechanism according to the present invention will be described below with reference to the drawings.

FIG. 4 shows a perspective view of an IC measuring jig having a package lifting mechanism according to the present invention.

In the figure, 31 is a resin board, 34 is a resin frame, 38 is a resin plate for floating the package, 39 is a leaf spring, 4o is a positioning hole that just fits the IC package, and 50 is a resin plate that holds the lead part of the IC package. It is a pressurizing part. Pressure section 5
o can be raised and lowered by moving the rod 51 up and down. The support part 52 of the mechanism for raising and lowering the rod 51 can be rotated in a horizontal plane as shown by arrow A. Figure 3(a)(b)
) respectively show a plan view and a cross-sectional view of essential parts of the XC measurement fixture of the present invention. 31 is a resin board, 32 is a resin plate in which a spring pin 33 serving as a contact is embedded, and 34 is a spring pin 3.
3 and a resin frame for adjusting the interval between the lead terminals 360 of the IC package 35, the resin plate 32 and the resin frame 34 are fixed to the resin board 31 with screws 3"7. 38 is supported by the resin frame 34 by a leaf spring 39. This is a package floating resin plate having a hole 40 that is just large enough to fit an IC package.

The leaf spring 39 is fixed by screws 42 only on the package floating resin plate 3. Initially, in the state shown in FIG. At this time, the pressurizing section 50 rotates the support section 52 and moves it to a position where it is easy to attach the IC package.Next, after setting the IC package, place the support section 51 in the state shown in Fig. 4. The pressure unit 50 pressurizes the lead part 36 of the IC package.By lowering the pressure unit 50vr, the package floating resin plate 3 is pushed down to the resin plate 32 as shown in FIG. The spring 39 is in a bent state as shown in the figure. Note that the hole for the bottle guide is omitted in Fig. 3(c). The spring pin 33 guided by the pin guide hole 41 is compressed and comes into contact with the tip of the pin.The other end of the spring pin is connected to the IC tester, and in the state shown in Fig. 3(C). Characteristics of IC packages can be tested.

After measuring the characteristics, pull up the pressurizing part 50 and remove the package C.

As mentioned above, the positioning hole 4° of the C-package measuring device having the package lifting mechanism of the present invention makes it possible to position the C-package extremely easily, and by pressing down the pressure part 5o, the package can be lifted up and the resin removed. Spring bin guide hole 44 provided in the plate [from spring bin 3]
3 can be brought into contact with the lead portion 36 of the IC package with high accuracy.

In the non-embodiments, an example was given in which one IC package was measured, but a plurality of IC packages may be measured simultaneously. Although leaf spring kumquat was used as an elastic body, it is not limited to this. A loose structure is not limited to the embodiments, and any structure that can achieve the objectives of the present invention may be used.

FIG. 3 is a diagram showing the XC measuring jig of the present invention, and FIG. 4 is a perspective view of the C measuring jig of the present invention.

31; Resin board, 32: Resin plate, 33 Nice spring bottle, 34: Resin frame, 35: IC! Package, 36: Lead terminal, 37: Screw: 38: Resin plate for floating the package, 39: Leaf spring, 40 2nd C package positioning, 4
1 spring pin guide hole, 42: screw, 50: pressurizing part of insulator, 51: rod, 52: support part.

Agent: Patent Attorney Hiroshibe Matsuoka

Claims (1)

[Claims] an insulating plate into which a spring bottle is embedded and a frame;
The insulating plate for lifting the package has an insulating plate provided with holes for positioning the semiconductor package and the holes for positioning the spring bin, and an insulator pressurizing part for the lead terminal of the semiconductor package, and the insulating plate for lifting the package has an elastic body inside the frame. When no force is applied from the insulator pressurizing section, the lead terminal of the semiconductor package positioned in the semiconductor package positioning hole and the spring pin are not in contact with each other, and the insulator is pressurized. 1. A semiconductor package measuring jig, characterized in that the lead terminal and the spring pin are in contact with each other when a force is applied from a portion thereof.・