JPS6124244A - Fixed card for testing semiconductor device - Google Patents

Abstract

PURPOSE:To provide a fixed card for testing semiconductor device rapidly making the grounding pressure of each bonding pad optimum having no resort to any micro adjustment of complicated grounding points between probes and a bonding pad. CONSTITUTION:The ends of probes 3 are brought into contact with a bonding pad 11 on the surface of a semiconductor wafer 10. At this time, if a card is slowly lowered with the probes 3 coming into slight contact with the top of bonding pad 10, the probes 3 contracting buffer members 6 are lifted upward along a vertical through hole 5 to be energized downward by the contracted buffer members 6. Resultantly the ends of probes 3 may be brought into close contact with the bonding pad 11 without fail to finish the grounding of card rapidly making it feasible to perform a diode testing process.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement of a fixed card for a tester used in a die sorting process in a semiconductor device manufacturing process.

(Technical Background of the Invention) Many processes are required to manufacture semiconductor devices such as ICs and LSIs, and some of them involve the process of manufacturing a large number of chips formed on a semiconductor wafer (each chip is an IC). An inspection process is included to test whether each component (constituting the product) is manufactured without defects and operates normally. This inspection process, called the die sort process, is carried out using a special tester, which has a number of probes placed in predetermined positions so as to contact each of the corresponding internal terminals (ponding pads) on the surface of the semiconductor chip. Equipped with fixed cards in relation.

FIG. 2(A) is a longitudinal cross-sectional view of the above-mentioned conventional fixed card, and FIG. 2(B) is a cross-sectional view taken along line B-8 in FIG. 2(A). In these figures, 1 is an insulating card board. A predetermined pattern of aluminum wiring 2 . . . is formed on the card substrate 1 . One end of this aluminum wiring 2... is connected to the input end of a tester (not shown), and the aluminum wiring 2...
- A stylus 3 connected to the other end is provided. These stylus 3... are fixed insulated and separated from each other by passing through an insulating fixing plate 4 fixed to the card board 1, and extend below the card board 1 at a predetermined angle. The tips of these stylus needles 3 are disposed at the same level.

In the die sorting process, the stylus 3 of the fixed card is
. . are brought into contact with the bonding pads 11 .

[Problems with background technology]

It is impossible for a large number of bonding pads formed in each chip area of a semiconductor wafer to be die sorted to have uniform heights and top surfaces aligned on the same plane level. On the other hand, as mentioned above, the tips of the stylus 3 are aligned at the same level, so in the conventional die sorting process using fixed cards, the average grounding point between each stylus and the bonding pad is This means that the circuit on the wafer is being measured. For this reason, there is a problem that the ground pressure is insufficient for a certain pad, and the signal becomes weaker and noise is more likely to be picked up.

Furthermore, it is difficult to adjust the grounding points between the fixed card and each pad, and it takes a considerable amount of time to make fine adjustments. Moreover, since such fine adjustment of the grounding point is required for each wafer, conventional fixed cards have a problem in that the loss time for this is extremely large.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned circumstances, and allows suitable ground pressure to be quickly obtained for each pounding pad without the need for complicated fine adjustment of the grounding point between the stylus and the pounding pad. The present invention provides a fixed card for a semiconductor device tester that can shorten the die sorting process.

[Summary of the invention]

A fixed card for a tester of a semiconductor device according to the present invention includes an insulating card board, an insulating support wall protruding from one side of the card board, and a vertically long through hole provided through the support wall. a stylus having one end fixed to one side of the card board and extending through a through hole provided in the support wall; The stylus includes a buffer member made of an elastic insulator filled in the upper part of the stylus, and an aluminum wiring layer having a predetermined pattern formed on one side of the card board and connecting one end of the stylus to the input end of the tester, The stylus is movable up and down along the vertically elongated through hole, and the stylus moved toward the substrate is urged by the buffer member to the opposite side from the substrate. .

In the case of the above-mentioned fixed card according to the present invention, the through hole provided in the insulating support wall is vertically elongated, so that the stylus provided through the through hole is brought into contact with each other by the insulating support wall. At the same time, it is possible to move freely up and down on the same line. Moreover, since the upper portions of these stylus needles are filled with an insulating and elastic buffer, the stylus that has moved upward is pushed back from the base of the fixed card by this buffer member. As a result, it is possible to obtain good ground pressure between the test needle of the fixed card and the bonding pad of the wafer to be measured, and the permissible range of the ground position is expanded, making it possible to easily adjust the ground position without the need for fine adjustments. By repeating this operation, you will be able to touch each pad with the stylus. Therefore, the time spent on fine-tuning when using conventional fixed cards can be reduced. Furthermore, since the time required to measure one wafer is shortened, it becomes possible to evaluate and measure a large number of chips within the same amount of time.

Furthermore, since the pad of the chip and the ground point of the test needle can be brought into close contact with each other, signals can be transmitted accurately and reliably, and it also helps prevent noise generation. You can get unique effects.

[Embodiments of the invention]

FIG. 1 is a vertical cross-sectional view showing a fixed card for a tester of a semiconductor device according to an embodiment of the present invention, and FIG. 1(B) is a cross-sectional view taken along line BB in FIG. It is a diagram. In these figures, 1 is a card board, 2 is an aluminum wiring layer, 3... is a stylus. One end of the stylus 3 is connected to the aluminum wiring layer 2 formed on the bottom surface of the card board 1.
The other end extends through a support wall 4' projecting from the lower surface of the card board 1. The process up to this point is the same as the conventional fixed card shown in FIGS. 2(A) and 2(B). However, in this embodiment, a vertically elongated through hole 5 is provided in the stylus penetrating portion of the support wall 4', and the stylus 3 is supported by the lower edge of this through hole. In order to carry out the die sorting process using the fixed card according to the above embodiment in which a buffer member 6 made of an insulating elastic material such as rubber is filled in the upper space of the stylus 3 inside the through hole 5, As in the prior art, the tips of the probes 3 are brought into contact with the bonding pads 11 on the surface of the semiconductor wafer 10. At that time, as shown in Figure 3 (A
) When the card is gradually lowered from the state where the stylus 3 is lightly touching the top surface of the pounding pad 11, the stylus 3 contracts the buffer member 6 as shown in <B) of the same figure. While moving, it is lifted upward along the vertically elongated through hole 5, and is urged downward by the compressed buffer member 6. As a result, the tip of the stylus 3 is reliably brought into close contact with the top surface of the bonding pad 11, making it possible to quickly complete the grounding of the card and perform the die sort test.

Moreover, since each stylus 3... moves up and down independently, there are many pounding pads 11...! Even if the heights of the pads are different or the top surface of the pad is uneven, the tip of the stylus 3 can be accurately and reliably pressed against the top surface of the corresponding pad. Therefore, the conventional problems caused by insufficient grounding of the stylus and pad, such as generation of signal noise and reduction in signal level, can be alleviated, and it becomes possible to perform die sorting tests with more accuracy and precision.

In addition, in the case of the above embodiment, since the load placed on the stylus is small, deformation and damage to the tip of the stylus caused by forcibly pressing the stylus against the top surface of the pad can be prevented. be able to. Therefore, errors caused by repeated use of fixed cards are suppressed, and the number of fixed cards consumed is reduced, resulting in great economic effects.

〔Effect of the invention〕

As described in detail above, if the fixed card for semiconductor device testers according to the present invention is used, each bonding pad can be quickly aligned without having to make complicated fine adjustments of the grounding point between the stylus and the bonding pad. A suitable ground pressure can be obtained and accurate and reliable die sorting tests can be carried out, while at the same time
It is possible to shorten the die sorting process, etc.
It is possible to obtain a remarkable effect.

[Brief explanation of drawings]

FIG. 1(A) is a longitudinal sectional view showing a fixed card for a tester of a semiconductor device according to an embodiment of the present invention, and FIG. 1(B)
is a cross-sectional view taken along line 8-8 in the same figure (A),
Figure (A) is a vertical cross-sectional view showing a conventional tester fixed card, Figure 2 (B) is a cross-sectional view taken along the line B-B in Figure (A), and Figure 3 (A). )(B) is shown in Figure 1(A)(B)
) is an explanatory diagram showing the action of the tester fixed card according to the embodiment. 1... Card board, 2... Aluminum wiring layer, 3
...Stylus, 4'...Supporting wall, 5...Vertical through hole,
6...Buffer member. Applicant's representative Patent attorney Takehiko Suzue

Claims (1)

[Claims] An insulating card board, an insulating support wall protruding from one side of the card board, a vertically long through hole provided through the support wall, and one end fixed to one side of the card board. and a stylus extending through a through hole provided in the support wall, and an elastic insulator filled in the upper part of the stylus within the vertically elongated through hole provided in the support wall. a buffer member, and an aluminum wiring layer of a predetermined pattern formed on one side of the card board to connect one end of the stylus to the input end of the tester, and the stylus is arranged vertically along the vertically long through hole. 1. A fixed card for a tester of a semiconductor device, characterized in that the stylus is movable toward the substrate, and the stylus moved toward the substrate is biased toward the opposite side from the substrate by the buffer member.