JP3671567B2 - Electrical connection device for electronic components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrical connection device for an electronic component for obtaining an electrical connection to an electronic component having a protruding electrode.
[0002]
[Prior art]
Electronic components such as small chip scale packages (also referred to as chip size packages: CSP) have been put into practical use. This CSP chip has a large number of bumps, which are protruding electrodes, arranged in a matrix at a pitch of 0.5 mm, for example. Since the protruding electrodes of such a CSP chip are arranged on the chip itself, the CSP chip is a very small chip.
When testing the electrical characteristics of such a CSP chip, in the test process, the protruding electrodes (hereinafter referred to as bumps) of the CSP chip are each connected using an electrical connection device as shown in FIGS. Make electrical connection between bump and tester measuring instrument.
[0003]
For example, in the conventional electrical connection apparatus shown in FIG. 8, the bumps 2 of the CSP chip 1 are connected using substantially Y-type contact pins 3. In the electrical connection apparatus of FIG. 9, the bump 2 is electrically connected to the counterpart bump 5 using a plate-like member 4. Wires 6 are arranged on the plate-like member 4, and the bumps 2 and 5 are electrically connected using the wires 6.
[0004]
In the electrical connection apparatus of FIG. 10, the bump 2 is electrically connected to the contact pin 4, but the contact pin 7 is bent into a complicated shape. In the electrical connection device of FIG. 11, the bump 2 is electrically connected to the counterpart bump using the contact pin 8. The contact pin 8 can be moved up and down by a pressing force in the Z direction by a built-in spring. In the electrical connection device of FIG. 12, the bumps 2 are electrically connected by contact pins 8. The contact pins 8 can also be moved up and down by springs 8a.
[0005]
The bump 2 of FIG. 13 is electrically connected to the counterpart bump 5 using a rubber-like member 9. In the rubber-like member 9, metal particles (conductive particles) 9c are contained in portions corresponding to the bumps 2 and 5, and when pressure is applied from the bump 2 side, the bumps 2 and 5 are formed via the metal particles 9c. Can be connected electrically.
In the needle type electrical connection device of FIG. 14, the needle 9 a can be electrically connected to the bump 2.
[0006]
[Problems to be solved by the invention]
However, the conventional electrical connection devices shown in FIGS. 8 to 14 described above have the following problems.
In FIG. 8, when the protruding height of the bump 2 is about 50 μm, the contact pin 3 cannot be engaged with the bump 2, and electrical connection cannot be reliably performed. The electrical connection device of FIG. 9 is not suitable for an electrical connection device that is used repeatedly because the durability of the rubber-like member 4 is low. In the electrical connection device of FIG. 10, since the contact pins 7 are formed in a complicated shape, it is impossible to cope with the case where the bumps 2 have a narrow pitch.
[0007]
11 and 12, since the contact pin 8 is elastically supported by a spring, the structure is complicated, and the case where the bumps 2 have a narrow pitch cannot be handled.
The electrical connection device of FIG. 13 can cope with the case where the bumps 2 have a narrow pitch, but the durability of the rubber-like member 9 is low and is not suitable for an electrical connection device that is used repeatedly.
[0008]
In the electrical connection device of FIG. 14, the needle 9 a is contacted, but it is difficult to cope with a narrow pitch, and there is concern about the connection reliability. Therefore, the present invention solves the above-described problems , is inexpensive, and provides an electronic component electrical connection device that reliably connects a large number of electronic components when performing an electrical test of the electronic components. The purpose is that.
[0009]
[Means for Solving the Problems]
In the present invention, the above object is an electronic component electrical connection device for obtaining an electrical connection to an electronic component having a protruding electrode, and includes a plurality of conductive connection members and the plurality of conductive connection members . a base member having a plurality of holes for the passage of the conductive connecting member, the longitudinal connecting member a plurality of conductive connecting members with an electrically insulating state placed around portion including a plurality of holes of the base member An insulating elastic holding member that is elastically movable with respect to the direction, and is provided with a portion that is electrically connected to the protruding electrode of the electronic component at one end portion of the conductive connecting member . When the other end portion of the connection member is electrically connected to the circuit board for measuring the electronic component, and the protruding electrode of the electronic component is pressed against the one end portion of the conductive connection member, the measurement for measuring the electronic component is performed. Conductive so as to electrically connect to the circuit board The electrical connecting device of an electronic component of the other end portion of the connection member, is achieved.
[0010]
In the present invention, when an electrical connection is obtained with an electronic component having a protruding electrode, a conductive connection member is passed through each hole of the base member. The conductive connecting member is elastically supported by an insulating elastic holding member with respect to the base member, and is elastically movable with respect to the longitudinal direction of the connecting member. One end portion of the connection member is electrically connected to the protruding electrode of the electronic component, and the other end portion of the connection member is electrically connected to the circuit board for measurement of the electronic component. Only after the protruding electrode of the electronic component is pressed against one end portion of the connection member, the other end portion of the connection member is electrically connected to the circuit board for measurement of the electronic component.
[0011]
Thus, by pressing the protruding electrode of the electronic component against the conductive connecting member of the base member, the conductive connecting member can be moved elastically by the insulating elastic holding member on the base member. Even if there is a difference in height, each protruding electrode can be reliably connected to the corresponding conductive connecting member.
Further, since the other end portion of the first connecting member is pressed against the one end portion of the connecting member protruding electrodes of the electronic component is to be connected to the circuit board electrically measured for electronic components, the other end portion for continuously measuring Since it is not connected to the circuit board, there is an advantage that wear of the other end portion and the circuit board can be prevented.
[0012]
In the present invention, since the insulating elastic holding member is connected by the connecting portion, the elastic holding member can be firmly held with respect to the base member and can sufficiently withstand the load when the conductive connecting member moves. .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.
The embodiment described below is a preferred specific example of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention is particularly limited in the following description. Unless otherwise stated, the present invention is not limited to these forms.
[0014]
FIG. 1 is a cross-sectional view showing an electrical connection device 10 according to the present invention and a tester 100 arranged corresponding thereto, and FIG. 2 is a plan view of the electrical connection device 10.
1 and 2, an electronic component electrical connection device 10 is used for, for example, an electrical continuity test of a chip 17 of a chip scale package (hereinafter referred to as CSP). The CSP chip 17 has a large number of bumps 17a arranged on the back side thereof in a predetermined pattern, for example, a full matrix. The bumps 17a are arranged in the X direction and the Y direction at a narrow pitch of 0.5 mm, for example.
[0015]
The electrical connecting device 10 includes an insulating plate (base member) 12, a conductive connecting member 15, an insulating elastic holding member 16, a positioning guide 30, a spacer 18, a socket base (base member) 19, and the like. Yes.
The socket base 19 and the insulating plate 12 constitute a base member. The socket base 19 is, for example, a metal rectangular member. Holes 19b through which screws 19a are passed are formed at the four corners of the socket base 19.
The insulating plate 12 is, for example, a square plate-shaped member made of an insulating material such as plastic. As shown in FIGS. 1 and 3, the insulating plate 12 has a large hole 12 a and a small hole 21. The insulating plate 12 is inserted into the hole 19 c of the socket base 19 and placed on the spacer 18. Accordingly, a hole 18 a that is slightly smaller than the size of the insulating plate 12 is formed at the center of the spacer 18.
[0016]
The spacer 18 can be made of metal or plastic, and the thickness of the spacer 18 is set smaller than the thickness of the socket base 19. The thickness of the socket base 19 is set to be considerably larger than the thickness of the insulating plate 12, and the insulating plate 12 and the positioning guide 30 can be completely fitted into the hole 19 c of the socket base 19. The positioning guide 30 is made of, for example, an insulating plastic, and is a member for positioning the CSP chip 17 corresponding to the insulating plate 12. Specifically, the positioning guide 30 can position the CSP chip 17 such that each bump 17 a of the CSP chip 17 corresponds to the upper end portions of the plurality of connecting members 15 of the insulating plate 12.
[0017]
The plurality of connecting members 15 are pins or needle-like members and are conductive. These connecting members 15 are inserted into the small holes 21 of the insulating plate 12 as shown in FIG.
[0018]
An insulating elastic holding member 16 is formed on the insulating plate 12 of FIG. That is, the insulating elastic holding member 16 is made of, for example, rubber, and the elastic holding member 16 is disposed on the one surface 12f and the other surface 12g of the insulating plate 12 and the hole 12a. The elastic holding member disposed in the hole 12a is a connecting portion (second portion) 16a. By forming the connecting portion 16a, the adhesive force of the elastic holding member 16 formed on the one surface 12f and the other surface 12g of the insulating plate 12 to the insulating plate 12 can be sufficiently retained.
Further, if the elastic holding member 16 is partially included in the small hole 21 of the insulating plate 12, the adhesiveness of the elastic holding member 16 between the one surface 12f and the other surface 12g can be further improved. Can do. That is, the first portion 16b of the elastic holding member 16 in the hole 21 improves the adhesion.
The elastic holding member 16 arranged corresponding to the small hole 21 can hold each connection member (also referred to as a contact pin) 15 so as to be elastically movable in the Z direction.
[0019]
Particularly characteristic are the following points. As shown in FIG. 4, in a state where the insulating plate 12 is set in the hole 19c of the socket base 19 and rests on the spacer 18, the one end portion 15a of the connecting member 15 is connected to the CSP chip 17 as shown in FIG. The bumps 17a are in contact with each other. On the other hand, the other end portion 15b of the connection member 15 and the electrode 47 of the circuit board 102 are separated from each other with a predetermined distance D as shown in FIGS. When the CSP chip 17 is simply set as described above, the other end portion (the other end) 15b of the connection pin 15 is not in contact with the electrode 47, so that the electrode 47 of the circuit board 102 and the other end of the connection member 15 are provided. Wear of the portion 15b can be prevented as much as possible.
The holes 12a of the insulating plate 12 shown in FIGS. 1 and 2 are formed at, for example, eight locations on the insulating plate 12 as shown in FIG.
[0020]
Next, the tester 100 of FIG. 1 will be described.
The tester 100 includes a board (circuit board) 102, a connection line 103, and a determination unit 101. Each electrode 47 of the substrate 102 is electrically connected to the determination unit 101 via a line 103. Bolts 19a are provided at the four corners of the substrate 102 vertically upward. For example, the determination unit 101 tests the electrical characteristics and electrical connectivity of the CSP chip 17.
[0021]
Next, a method for attaching the plurality of connecting members 15 to the insulating plate 12 will be described. As shown in FIG. 5, a hole 21 and a hole 12 a are made in the insulating plate 12. As shown in FIG. 3, one end portion 15 a protrudes from one surface 12 f of the insulating plate 12 and the other end portion 15 b of the connecting member protrudes from the other surface 12 g of the insulating plate 12. Hold on.
[0022]
While maintaining this state, an elastic holding member 16 such as rubber is poured into the one surface 12f and the other surface 12g of the insulating plate 12 and hardened. Thereby, each connection member 15 can move elastically separately in the Z direction with respect to the insulating plate 12. The amount of movement of the connecting member 15 in the Z direction is, for example, around 100 μm. The thickness of the connection member 15 is preferably 0.2 to 0.3 mm when the arrangement pitch of the bumps 17a of the CSP chip 17 is 0.5 mm. When the arrangement pitch of the bumps 17a is 0.8 mm, the thickness of the connection member 15 is preferably 0.4 to 0.5 mm.
Each connecting member is plated with gold in order to improve electrical contact with the bumps 17a and the electrodes 47, or the one end portion 15a and the other end portion 15b as shown in FIG. ) And (B) can be conical or hemispherical as shown in FIG.
[0023]
The pressing member 60 in FIG. 1 adjusts the amount of pressing force applied to the CSP chip 17 by changing the shape of the one end portion 15a and the other end portion 15b of the connecting member 15 and changing the contact area between the bump 17a and the electrode 47. can do. Further, the magnitude of the force necessary for moving the connecting member is adjusted by the hardness and thickness of the insulating holding member 16.
The insulating plate 12 having the connecting member 15 made in this way is placed on the spacer 18 as shown in FIGS. 1 and 4, and the positioning guide 30 is placed on the insulating plate 12. The positioning guide 30 is prepared in advance according to the type of the CSP chip.
[0024]
Next, the CSP chip 17 is inserted into the guide hole 30a of the positioning guide 30 as shown in FIG. 4, and the bump 17a of the CSP chip contacts the one end portion 15a of each connection member 15 as shown in FIGS. Put it on.
However, in this state, since the pressing member 60 has not yet pressed the CSP chip 17 downward, the connecting member 15 is elastically held by the elastic holding member 16, so that the electrode 47 and the other end portion 15 b There is an interval D between them.
[0025]
When the pressing member 60 pushes the CSP chip 17 in the direction of the arrow Z1 in FIG. 1, the other end portion 15b of the connecting member 15 is electrically reliable against the corresponding electrode 47 against the elastic force of the elastic holding member 16. Can be connected to. At this time, even if there is a variation in the height of the bump 17a, the connection member 15 moves individually in the insulating plate 12 corresponding to the variation, so that the electrical connection between the bump 17a and the electrode 47 is ensured. It can be carried out. When the CSP chip 17 is electrically connected to the determination unit 101 of FIG. 1 via the bump 17a, the connection member 15, and the electrode 47, the determination unit 101 performs a test on the electrical characteristics of the CSP chip 17 and the result thereof. Judging.
Thus, in the state where the CSP chip 17 is not pressed by the pressing member 60, the other end portion 15b of the connecting member 15 is not in contact with the electrode 47. Therefore, the electrode 47 is not in contact with the connecting member except during measurement by pressing. Wear of the electrode 47 can be reduced as much as possible.
[0026]
The elastic holding member 16 receives a force for moving the connecting member 15 at every measurement, but the elastic holding member 16 is connected to the second portion 16a of the connecting portion in the hole 12a of FIG. The first holding portion 16b of the elastic holding member 16 that is slightly inserted into the insulating plate 12 can be held so as not to be peeled off by increasing the adhesive force with respect to the insulating plate 12.
As described above, in the electrical connection device of the present invention, the holes 21 are formed in a matrix in the insulating plate 12, and the connection member 15 such as a wire is inserted into the holes. Then, an elastic holding member 16 such as rubber wraps the insulating plate 12 and the connecting member 15 so that the connecting member is elastically held by hardening from the front and back sides of the insulating plate 12.
Therefore, the electrical connection device is inexpensive and has excellent electrical contact properties.
[0027]
By the way, the present invention is not limited to the above embodiment.
In the above-described embodiment, a CSP chip is taken as an example of an electronic component. However, the present invention is not limited to this, and it is of course used for testing other types, for example, an electronic component such as a ball grid array (BGA). Can do.
[0028]
【The invention's effect】
As described above, according to the electrical connection device of the present invention, it is inexpensive and can securely connect many electronic components when performing an electrical test of the electronic components. .
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of an electrical connection device of the present invention and a tester therefor.
2 is a plan view of the electrical connection device of FIG. 1. FIG.
FIG. 3 is an enlarged view showing a main part of the electrical connection device.
FIG. 4 is a diagram illustrating a state in which a CSP chip that is an electronic component is to be mounted on an electrical connection device.
FIG. 5 is a cross-sectional view showing an insulating plate, an elastic holding member, a connection member, and the like.
FIG. 6 is a diagram showing a positional relationship between a CSP chip, connection pins, and electrodes on a substrate.
FIG. 7 is a view showing an example of the shape of an end portion of a connection member.
FIG. 8 shows a conventional electrical connection device.
FIG. 9 is a diagram showing a conventional electrical connection device.
FIG. 10 is a diagram showing a conventional electrical connection device.
FIG. 11 is a diagram showing a conventional electrical connection device.
FIG. 12 is a diagram showing a conventional electrical connection device.
FIG. 13 is a diagram showing a conventional electrical connection device.
FIG. 14 is a diagram showing a conventional electrical connection device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Electrical connection apparatus, 12 ... Insulating plate, 15 ... Connection member, 15a ... One end part of a connection member, 15b ... Other end part of a connection member, 16a ... Elastic holding Connection part (second part) of member, 16c ... first part of elastic holding member, 17 ... CSP chip (electronic component), 17a ... bump (projection electrode), 18 ... spacer, 30 ... Positioning guide, 47 ... Electrode, 100 ... Tester

Claims (4)

An electronic component electrical connection device for obtaining an electrical connection to an electronic component having a protruding electrode,
A plurality of conductive connecting members;
A base member having a plurality of holes for passing the plurality of conductive connection members;
Elastically movable insulating elastic holding holding with respect to the longitudinal direction of said connecting member said plurality of conductive connecting members are disposed around the portion of an electrically insulating state including the plurality of holes of said base member A member, and
Said electrically connecting portion between the protrusion electrode of the electronic component provided at one end portion of the conductive connecting member, the circuit board for measurement of the electronic component to the other end portion of the conductive connecting member Provide an electrical connection part ,
When the protruding electrode of the electronic component is pressed against one end portion of the conductive connection member, the other end portion of the conductive connection member is electrically connected to the circuit board for measurement of the electronic component. electrical connecting device of the electronic component, characterized in <br/> that with. The insulating elastic holding member is disposed on one surface of the base member facing the electronic component side and the other surface of the base member facing the measurement circuit board side, The electrical connection device for an electronic component according to claim 1, wherein the elastic holding member on the one surface of the base member and the elastic holding member on the other surface of the base member are connected by a connecting portion. The electrical connection device for an electronic component according to claim 2, wherein the connecting portion of the insulating elastic holding member is a portion of the elastic holding member disposed in the plurality of holes of the base member. The connecting portion of the insulating elastic holding member includes a first portion of the elastic holding member arranged in the plurality of holes of the base member and the connecting portion of the base member arranged in another connecting hole. The electronic component electrical connection device according to claim 2, comprising a second portion of the elastic holding member.

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