JPH10178129A - Electrical bonding device for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrical bonding device for an electronic part which performs electrical bonding of a plurality of electronic parts with sure, when an electrical test of the electronic parts is performed. SOLUTION: An electrical bonding device 10 of an electronic part 7 for obtaining electrical bonding for the electronic part 17 having a bump electrode 17a has a plurality of conductive bonding members 15, a base member 12 provided with holes for passing of each bonding member 15, and an insulating elastic holding member 16 which is placed on the surrounding part of the base member 12 containing each hole 21 so as to hold each bonding member 15 under an electrical insulated condition, in an elastically transferable condition in a longitudinal direction. And one end part 15a of the bonding member is electrically bonded to the bump electrode 17a of the electronic part 17, and the other end part 15b of the bonding member is electrically bonded to a circuit substrate 102 for measuring the electronic part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection device for an electronic component for obtaining an electrical connection to an electronic component having a protruding electrode.

[0002]

2. Description of the Related Art Small electronic devices such as a chip-scale package (also referred to as a chip-size package: CSP) have been put to practical use. This C
In the SP chip, bumps serving as protruding electrodes are, for example, 0.5 mm.
Many are arranged in a matrix at a pitch of mm. Since the projecting electrodes of such a CSP chip are arranged on the chip itself, the CSP chip is a very small chip. When testing the electrical characteristics of such a CSP chip, in the test process, the projecting electrodes (hereinafter referred to as bumps) of the CSP chip are each connected to an electrical connection device as shown in FIGS. Make an electrical connection between the bump and the tester tester.

For example, in the conventional electrical connection device shown in FIG.
The bumps 2 of the CSP chip 1 are connected using substantially Y-type contact pins 3. In the electrical connection device shown in FIG. 9, the bump 2 is electrically connected to the other bump 5 using the plate-shaped member 4. Wires 6 are arranged on the plate-shaped member 4, and the bumps 2 and 5 are electrically connected using the wires 6.

In the electrical connection device shown in FIG. 10, the bump 2 is electrically connected to the contact pin 4, and the contact pin 7 is bent in a complicated shape.
In the electrical connection device shown in FIG. 11, the bump 2 is electrically connected to the other bump using the contact pin 8. The contact pin 8 can be moved up and down by a pressing force in the Z direction by a built-in spring. FIG.
In the electrical connection device 2, the bump 2 is connected to the contact pin 8.
The contact pins 8 can also be moved up and down by springs 8a.

The bump 2 shown in FIG. 13 is electrically connected to the other bump 5 using a rubber-like member 9.
In the rubber-like member 9, metal particles (conductive particles) 9c are contained in portions corresponding to the bumps 2 and 5, and the bump 2
When pressure is applied from the side, the bumps 2 are formed via the metal particles 9c.
5 can be electrically connected. In the needle type electrical connection device shown in FIG. 14, the needle 9a can be electrically connected to the bump 2.

[0006]

However, FIG.
14 have the following problems. In FIG. 8, when the protrusion height of the bump 2 is about 50 μm, the contact pin 3 cannot mesh with the bump 2 and electrical connection cannot be reliably performed. In the electrical connection device of FIG. 9, the durability of the rubber-like member 4 is low and is not suitable for an electrical connection device that is used repeatedly. FIG.
In the electrical connection device of No. 0, since the contact pins 7 are formed in a complicated shape, it is impossible to cope with the case where the bumps 2 have a narrow pitch.

In the electrical connection device shown in FIGS. 11 and 12,
Since the structure is such that the contact pins 8 are elastically supported by springs, the structure is complicated, and it is impossible to cope with the case where the bumps 2 have a narrow pitch. The electrical connection device of FIG. 13 can cope with the case where the bumps 2 have a narrow pitch, but the durability of the rubber-like member 9 is low,
Not suitable for repeatedly used electrical connection devices.

In the electrical connection device shown in FIG.
Although it is a method of contacting a, it is difficult to cope with a narrow pitch, and there is a concern about the reliability of the connection. Therefore, the present invention has been made to solve the above-described problem, and to provide an electronic component electrical connection device capable of reliably performing electrical connection of a large number of electronic components when performing an electrical test of the electronic components. The purpose is.

[0009]

SUMMARY OF THE INVENTION The object of the present invention is to provide an electronic component electrical connection device for obtaining electrical connection to an electronic component having a protruding electrode. A connecting member, a base member having a hole for passing each connecting member, and a peripheral member including each hole of the base member, and each connecting member is elastically moved in an electrically insulated state in a longitudinal direction of the connecting member. One end of the connection member is a portion electrically connected to the protruding electrode of the electronic component, and the other end of the connection member is used for measuring the electronic component. This is achieved by an electrical connection device for electronic components, which is a portion electrically connected to a circuit board for use.

According to the present invention, when electrical connection is made to the electronic component having the protruding electrode, a conductive connection member is passed through each hole of the base member. This conductive connection member
The base member is elastically supported by an insulating elastic holding member and is elastically movable in the longitudinal direction of the connection member. One end of the connection member is electrically connected to a protruding electrode of the electronic component, and the other end of the connection member is electrically connected to a circuit board for measurement of the electronic component.

[0011] By pressing the protruding electrode of the electronic component against the conductive connecting member of the base member, the conductive connecting member can be elastically moved on the base member by the insulating elastic holding member. Even if the height of the protruding electrodes is different, each protruding electrode can be reliably connected to the corresponding conductive connecting member. In the present invention, the other end of the connecting member is electrically connected to the circuit board for measurement of the electronic component only after the protruding electrode of the electronic component is pressed against one end of the connecting member. By doing so, there is an advantage that the other end portion and the circuit board can be prevented from being worn because the other end portion is not always connected to the circuit board for measurement.

In the present invention, the insulating elastic holding member is
Since the elastic holding member is connected by the connecting portion, the elastic holding member can be firmly held on the base member, and can sufficiently withstand a load when the conductive connecting member moves. The pressure applied to the protruding electrode of the electronic component and the circuit board for measurement is adjusted by the size of the tip area of one end and the other end of the connection member. Moreover, the magnitude of the force required for moving the connecting member can be adjusted by the hardness and thickness of the insulating elastic holding member. In this manner, the type of the electronic component to be measured and the pressure for pressing the electronic component against the conductive connection member can be freely set.

[0013]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIG. 1 is a cross-sectional view showing an electrical connection device 10 of the present invention and a tester 100 arranged correspondingly, and FIG. 2 is a plan view of the electrical connection device 10. FIG.
2 and FIG. 2, the electronic component electrical connection device 10 is used for, for example, an electrical continuity test of a chip 17 of a chip scale package (hereinafter referred to as CSP). C
The SP chip 17 has a large number of bumps 17a arranged on the back surface thereof in a predetermined pattern, for example, in a full matrix. The bumps 17a are arranged in the X direction and the Y direction at a narrow pitch of, for example, 0.5 mm.

The electrical connection device 10 includes an insulating plate (base member) 12, a conductive connection member 15, an insulating elastic holding member 16, a positioning guide 30, a spacer 18, a socket base (base member) 19, and the like. Have. The socket base 19 and the insulating plate 12 constitute a base member. The socket base 19 is, for example, a rectangular member made of metal. At the four corners of the socket base 19 are screws 19a
A hole 19b is formed to allow the air to pass therethrough. Insulating plate 12
Is a square plate-shaped member made of an insulating material, for example, plastic. The insulating plate 12 has a large hole 12a and a small hole 21 as shown in FIGS. The insulating plate 12 is inserted into the hole 19 c of the socket base 19 and is placed on the spacer 18. Therefore, the insulating plate 12
A hole 18a slightly smaller than the size of the hole 18a is formed.

The spacer 18 can be made of metal or plastic, and the thickness of the spacer 18 is set smaller than the thickness of the socket base 19.
The thickness of the socket base 19 is set to be considerably larger than the thickness of the insulating plate 12.
The insulating plate 12 and the positioning guide 30 can be completely fitted into the 9 holes 19c. The positioning guide 30
For example, it is made of insulating plastic, etc.
This is a member for positioning the CSP chip 17 corresponding to the insulating plate 12. Specifically, the positioning guide 30 can position the CSP chip 17 so that each bump 17a of the CSP chip 17 corresponds to the upper end of the plurality of connection members 15 of the insulating plate 12.

The plurality of connection members 15 are pins or needle-shaped members and are conductive. These connecting members 15 are inserted into small holes 21 of the insulating plate 12 as shown in FIG.

An insulating elastic holding member 16 is formed on the insulating plate 12 shown in FIG. That is, the insulating elastic holding member 16 is made of, for example, rubber, and the elastic holding member 16 is disposed on one surface 12f, the other surface 12g, and the hole 12a of the insulating plate 12. The elastic holding member arranged in the hole 12a is a connecting portion (second portion) 16a. By forming the connecting portion 16a, the elastic holding member 1 formed on one surface 12f and the other surface 12g of the insulating plate 12 is formed.
6 can sufficiently maintain the adhesive strength to the insulating plate 12. Further, if the elastic holding member 16 is partially inserted into the small hole 21 of the insulating plate 12, the adhesion between the elastic holding member 16 on one surface 12f and the other surface 12g can be further improved. Can be. That is, the first portion 16b of the elastic holding member 16 in the hole 21 improves the adhesiveness. The elastic holding members 16 arranged corresponding to the small holes 21 can hold the respective connection members (also called contact pins) 15 so as to be elastically movable in the Z direction.

Particularly characteristic is the following point. As shown in FIG. 4, the insulating plate 12
In the state set on 9c and placed on the spacer 18,
As shown in FIG. 3, the one end portion 15a of the connection member 15
The bumps 17a of the SP chip 17 are in contact with each other. On the other hand, the other end portion 1 of the connection member 15
5b and the electrode 47 of the circuit board 102 are separated by a predetermined distance D as shown in FIGS. In this state where the CSP chip 17 is simply set, the other end (the other end) 15 b of the connection pin 15 is prevented from contacting the electrode 47, so that the electrode 47 of the circuit board 102 and the other end of the connection member 15 are connected. Wear of the portion 15b can be prevented as much as possible.
The holes 12a of the insulating plate 12 shown in FIGS. 1 and 2 are formed at, for example, eight places of the insulating plate 12 as shown in FIG.

Next, the tester 100 shown in FIG. 1 will be described. The tester 100 has a board (circuit board) 102, a connection line 103, and a determination unit 101. Substrate 10
2 are connected to the determination unit 101 via a line 103.
Is electrically connected to At the four corners of the substrate 102, bolts 19a are provided vertically upward. The determination unit 101 performs, for example, an inspection of electrical characteristics and electrical connectivity of the CSP chip 17.

Next, a method of attaching a plurality of connecting members 15 to the insulating plate 12 will be described. As shown in FIG. 5, a hole 21 and a hole 12a are formed in the insulating plate 12. Then, the connection member 15 is passed through each hole 21 as shown in FIG.
One end portion 15a protrudes from one surface 12f of the insulating plate 12, and the other end portion 15b of the connecting member is held so as to protrude from the other surface 12g of the insulating plate 12.

In this state, an elastic holding member 16 such as rubber is poured into one surface 12f and the other surface 12g of the insulating plate 12 and solidified. Thereby, each connecting member 15 can be elastically moved separately in the Z direction with respect to the insulating plate 12. The moving amount of the connecting member 15 in the Z direction is, for example, about 100 μm. When the arrangement pitch of the bumps 17a of the CSP chip 17 is 0.5 mm, the thickness of the connection member 15 is 0.2 to 0.
Preferably, it is 3 mm. When the arrangement pitch of the bumps 17a is 0.8 mm, the thickness of the connection member 15 is preferably 0.4 to 0.5 mm. Each connection member is plated with gold in order to improve electrical contact with the bump 17a and the electrode 47, or
As shown in FIG. 7, the one end portion 15a and the other end portion 15b may be formed in a conical shape as shown in FIGS. 7A and 7B, or may be formed in a hemispherical shape as shown in FIG. 7C.

By changing the shape of the one end portion 15a and the other end portion 15b of the connecting member 15 to change the contact area between the bump 17a and the electrode 47, the pressing force applied by the pressing member 60 of FIG. Can be adjusted. The magnitude of the force required to move the connection member is adjusted by the hardness and thickness of the insulating holding member 16. The insulating plate 12 having the connecting member 15 thus formed is placed on the spacer 18 as shown in FIGS. 1 and 4, and the positioning guide 30 is placed on the insulating plate 12. This positioning guide 30 is
It is prepared in advance according to the type of the P chip and the like.

Next, the CSP chip 17 is inserted into the guide hole 30a of the positioning guide 30 as shown in FIG.
6, the bumps 17 a of the CSP chip are placed so as to be in contact with the one end portions 15 a of the connection members 15. However, in this state, since the pressing member 60 has not yet pressed the CSP chip 17 downward, the connecting member 15 is elastically held by the elastic holding member 16, so that the connection between the electrode 47 and the other end portion 15b is established. There is an interval D between them.

When the pressing member 60 presses the CSP chip 17 in the direction of arrow Z1 in FIG.
Can reliably be electrically connected to the corresponding electrode 47 against the elastic force of the elastic holding member 16. At this time, even if the height of the bump 17a varies, the connecting member 15 responds to the variation to the insulating plate 12a.
, The bump 17a and the electrode 47
Can be reliably connected. When the CSP chip 17 is electrically connected to the determination unit 101 of FIG. 1 via the bump 17a, the connection member 15, and the electrode 47, the determination unit 101 performs a test on the electrical characteristics of the CSP chip 17 and the result. Judge. In the state where the CSP chip 17 is not pressed by the pressing member 60, the other end portion 15b of the connecting member 15 is not in contact with the electrode 47.
The electrode 7 does not contact the connecting member except at the time of measurement by pressing, so that the wear of the electrode 47 can be reduced as much as possible.

The elastic holding member 16 receives a force for moving the connecting member 15 every time the measurement is performed.
6 is a second portion 16a of the connecting portion in the hole 12a of FIG.
And the elastic holding member 1 slightly inserted into each small hole 21.
The first portion 16b of 6 can increase the adhesive strength to the insulating plate 12 and hold it so as not to peel off. As described above, in the electrical connection device of the present invention, the insulating plate 12
, Holes 21 are formed in a matrix, and a connection member 15 such as a wire is inserted into the holes 21. An elastic holding member 16 such as rubber wraps the insulating plate 12 and the connecting member 15 and is hardened from the front and back sides of the insulating plate 12 to elastically hold the connecting members. For this reason, the electrical connection device is inexpensive and has excellent electrical contact properties.

The present invention is not limited to the above embodiment. In the above-described embodiment, the electronic component is CS
Although the P chip is taken as an example, other types,
For example, it can of course be used for testing electronic components such as a ball grid array (BGA).

[0028]

As described above, according to the present invention,
When conducting an electrical test of an electronic component, electrical connection of a large number of electronic components can be reliably performed.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an electrical connection device of the present invention and a tester therefor.

FIG. 2 is a plan view of the electrical connection device of FIG. 1;

FIG. 3 is an enlarged view showing a main part of the electrical connection device.

FIG. 4 is a CSP that is an electronic component for the electrical connection device.
The figure which shows the state which is going to mount a chip.

FIG. 5 is a sectional view showing an insulating plate, an elastic holding member, a connecting member, and the like.

FIG. 6 is a diagram showing a positional relationship among a CSP chip, connection pins, and electrodes on a substrate.

FIG. 7 is a view showing an example of the shape of an end of a connection member.

FIG. 8 is a diagram showing a conventional electrical connection device.

FIG. 9 is a diagram showing a conventional electrical connection device.

FIG. 10 is a diagram showing a conventional electrical connection device.

FIG. 11 is a diagram showing a conventional electrical connection device.

FIG. 12 is a diagram showing a conventional electrical connection device.

FIG. 13 is a diagram showing a conventional electrical connection device.

FIG. 14 is a diagram showing a conventional electrical connection device.

[Explanation of symbols]

10 ... electrical connection device, 12 ... insulating plate, 15
..Connection member, 15a... One end portion of connection member, 15
b ... the other end of the connection member, 16a ... the connection portion (second portion) of the elastic holding member, 16c ... the first portion of the elastic holding member, 17 ... CSP chip (electronic component), 1
7a: bump (projection electrode), 18: spacer,
30 ... positioning guide, 47 ... electrode, 100
..Test equipment

Claims (9)

[Claims] 1. An electronic component electrical connection device for obtaining electrical connection to an electronic component having a protruding electrode, comprising: a plurality of conductive connection members; and a hole for passing each connection member. A base member, and an insulating elastic holding member that is arranged in a peripheral portion including each hole of the base member and holds each connection member elastically movable in a longitudinal direction of the connection member in an electrically insulated state. One end of the connection member is a portion electrically connected to the protruding electrode of the electronic component, and the other end of the connection member is a portion electrically connected to the circuit board for measurement of the electronic component. Characteristic electrical connection device for electronic components. 2. The electrical connection device for electronic components according to claim 1, wherein the connection members are arranged in a matrix on the base member. 3. The electronic component according to claim 1, wherein when the projecting electrode of the electronic component is pressed against one end of the connection member, the other end of the connection member is electrically connected to a circuit board for measuring the electronic component. Electrical connection device. 4. The insulating elastic holding member is disposed on one surface of the base member facing the electronic component and on the other surface of the base member facing the circuit board for measurement. The electrical connection device for an electronic component according to claim 1, wherein the elastic holding member on one surface of the base member and the elastic holding member on the other surface of the base member are connected by a connecting portion. 5. The electrical connection device for an electronic component according to claim 4, wherein the connecting portion of the insulating elastic holding member is a portion of the elastic holding member disposed in the hole of the base member. 6. The connecting portion of the insulating elastic holding member includes a first portion of the elastic holding member disposed in the hole of the base member and a first portion of the elastic holding member disposed in another connecting hole of the base member. The electrical connection device for an electronic component according to claim 4, further comprising a second portion. 7. The electrical connection device for an electronic component according to claim 1, wherein the electronic component is a chip scale package, and the projecting electrodes are bumps of the chip scale package. 8. The electric component according to claim 1, wherein the pressure applied to the projecting electrode of the electronic component and the circuit board for measurement is adjusted by the size of the tip area of one end and the other end of the connection member. Connection device. 9. The magnitude of the force required to move the connecting member is:
The electrical connection device for an electronic component according to claim 1, wherein the adjustment is performed by adjusting the hardness and the thickness of the insulating elastic holding member.