JPH11295342A - Probe card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure elasticity with a margin of a probe and to make the probe easily exchangeable, by forming a wiring pattern in a main substrate to which a guide plate and an intermediate substrate are detachably installed and connecting the wiring pattern and a conductive pattern. SOLUTION: A guide plate 200 is constituted of material comprising a coefficient of thermal expansion close to the material of an LSI chip 800, which is a semiconductor integrated circuit of an object to be inspected. A probe 100 is installed to the guide plate 200 according to the arrangement of the electrode pad 810 of the LSI chip 800. An intermediate substrate 300 is installed to the upper surface of the guide plate 200, and the probe 100 and the conductive pattern 310 of the intermediate substrate 300 is connected by a bonding wire 400. The guide plate 200 and the intermediate substrate 300 are detachably installed to the lower side of a main substrate 500, and the wiring pattern 530 formed on the main substrate 500 and the conductive pattern 310 are connected by a contact 600. By this, it is possible to remove the guide plate 200 and the intermediate substrate 300 from the main substrate 500.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a probe card used for measuring various electrical characteristics of a semiconductor integrated circuit such as an LSI chip, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventional probe cards are roughly classified into a horizontal type called a cantilever type and a vertical type called a vertical type. The former horizontal type probe card is excellent in many respects, but is not suitable for simultaneous multi-chip measurement due to recent high integration of LSI chips and multiplexing of testers. In contrast, a vertical probe card requires more probes (hundreds to thousands).
It is suitable for multi-chip simultaneous measurement because it can be used and the degree of freedom of probe arrangement is high.

[0003]

However, the vertical probe card has a curved portion protruding in the lateral direction at the middle part of the probe in order to secure an appropriate contact pressure between the electrode pad of the LSI chip and the probe. Since it is formed, there is a problem that it is difficult to replace individual probes. As a probe card for solving such a problem, there is a probe card in which a part of a probe is made thinner and buckling of the thinned portion within an elastic limit is used. In this type, since the probes are pulled out one by one, replacement of each probe is easy.

[0004] However, in the one that allows replacement of individual probes, since the buckling portion of the probe is close to the elastic limit, there is a possibility that plastic deformation sometimes occurs, and it is undeniable that reliability is lacking.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a probe card and a method of manufacturing the probe card which can easily perform a probe replacement operation or the like while securing sufficient elasticity of the probe. It is intended to be.

[0006]

A probe card according to the present invention has a guide plate made of a material having a thermal expansion coefficient close to the material of a semiconductor integrated circuit to be inspected and an arrangement of electrode pads of the semiconductor integrated circuit. A probe correspondingly attached to the guide plate, the guide plate is a separate body, an intermediate substrate attached to the upper surface of the guide plate,
Bonding wires for connecting the probe and the conductive pattern of the intermediate substrate, a main substrate for detachably mounting the guide plate and the intermediate substrate on the lower side, and a wiring pattern and the conductive pattern formed on the main substrate. Connection means for connection.

Further, according to the method of manufacturing a probe card according to the present invention, a guide plate made of a material having a thermal expansion coefficient close to that of a semiconductor integrated circuit to be inspected is provided on a guide plate corresponding to an electrode pad of the semiconductor integrated circuit. The method further includes a step of connecting the arranged and attached probe and a conductive pattern of an intermediate substrate which is separate from the guide plate by wire bonding.

[0008]

FIG. 1 is a schematic sectional view of a main part of a probe card according to an embodiment of the present invention, and FIG. 2 is a diagram showing a connection between a probe and a conductive pattern of the probe card according to the embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing another example of the connection between the probe and the bonding wire of the probe card according to the embodiment of the present invention.

A probe card according to an embodiment of the present invention has an LSI chip 8 as a semiconductor integrated circuit to be inspected.
A guide plate 200 made of a material having a thermal expansion coefficient close to that of the material of the LSI chip 800;
10, a probe 100 attached to the guide plate 200 corresponding to the arrangement of the guide plate 200, the guide plate 200 is a separate body, and an intermediate substrate 300 attached to the upper surface of the guide plate 200; Bonding wire 4 for connecting the conductive pattern 310 to the conductive pattern 310
00, a main substrate 500 on which the guide plate 200 and the intermediate substrate 300 are detachably mounted on the lower side,
A contact 600 is provided as connecting means for connecting the wiring pattern 530 formed on the conductive pattern 310 to the conductive pattern 310.

The guide plate 200 comprises two upper plates 210 and lower plates 220 made of, for example, silicon nitride, a spacer 230 interposed between the two plates 210 and 220 to form a space, and the space is filled. Soft silicone resin 2
40. The upper plate 210 has through holes 211 corresponding to the arrangement of the electrode pads 810, and the lower plate 220 has through holes 221 corresponding to the arrangement of the electrode pads 810. Since the through hole 211 and the through hole 221 are portions through which the probe 100 described later penetrates, the probe 100 comes into vertical contact with the electrode pad 810.

A land 212 is formed around the through hole 211 of the upper plate 210. This land 212 is formed integrally with the conductive layer 123 formed on the inner peripheral surface of the through hole 211.

In the through hole 221 of the lower plate 220,
No conductive pattern of this kind is formed. However, the lower plate 220 has a resin injection hole 222 that is not provided in the upper plate 210. This resin injection hole 222
Is a portion into which the soft silicone resin 240 to be filled in the space is injected, and is appropriately formed according to the size of the space,
It is established where appropriate.

The upper plate 210 is formed larger than the lower plate 220. This is for attaching the guide plate 200 to the main board 500. This will be described later.

The probe 100 is formed of a thin wire such as tungsten, and the contact portion 110 at the tip is sharpened. The middle portion of the probe 100 is formed as an elastically deformable portion 120 so as to be thinner than other portions. That is, the probe 100 is
When the overdrive is applied in contact with the, the elastic deformation portion 120 is elastically deformed, so that the contact pressure between the probe 100 and the electrode pad 810 becomes suitable. The length of the probe 100 is
Since the contact portion 110 protrudes from the guide plate 200, the contact portion 110 is of course set to be larger than the thickness dimension of the guide plate 200.

The overdrive in the above description is
This means that pressure is further applied after the contact portion 110 of the probe 100 contacts the electrode pad 810 of the LSI chip 800.

The intermediate substrate 300 is mounted on the upper surface of the guide plate 200, that is, on the upper surface of the upper plate 210. Moreover, the intermediate substrate 300 is
1 and is attached to the outer peripheral edge of the guide plate 200.

On the upper surface of the intermediate substrate 300, a land-shaped conductive pattern 310 is formed. The conductive pattern 310 is basically formed in one-to-one correspondence with the land 212. The conductive pattern 310 and the lands 212 are connected by using a bonding wire method frequently used in a process of assembling a semiconductor integrated circuit device.

That is, the conductive pattern 310 and the land 212 are connected using a wire bonder. Considering that the capillary of the wire bonder moves from inside to outside, the land 212 is used as a first bond and the conductive pattern 310 is used as a bond. Second bond. The bonding wire 400 that connects the conductive pattern 310 and the land 212 is a gold wire.

The main substrate 500 includes the conductive pattern 3
A through hole 510 corresponding to 10 is opened. The through hole 510 is a portion to which a contact 600 as a connecting means for connecting the wiring pattern 530 formed on the main substrate 500 and the conductive pattern 310 is attached.

A backing plate 520 made of silicon nitride is attached to the back surface of the main substrate 500. The backing plate 520 also has through holes 5 corresponding to the through holes 510.
21 have been established.

The contact 600 is the probe 1 described above.
As in the case of 00, it is formed from a fine wire such as copper or beryllium copper. The middle part of the contact 600 is formed as an elastically deformable part 620 thinner than other parts. However, unlike the probe 100, the contact portion 610 at the tip of the contact 600 is not sharpened. That is, when the contact portion 610 of the contact 600 is completed as a probe card, it keeps in contact with the conductive pattern 310 unless it is disassembled.
This is because the contact and separation are not repeated like 0.

The contact 600 thus formed is soldered with its base end slightly protruding above the main board 500. As a result, the contact 600 is attached to the main substrate 500.
Is electrically connected to the wiring pattern 530 of FIG.

On the other hand, the main board 500 includes the guide plate 2
The mounting member 700 for mounting 00 is mounted. The mounting member 700 includes a mounting angle 710 made of silicon nitride, and the mounting angle 710 connected to the main substrate 500.
And a bolt / nut 720 to be fixed to the back side.

The mounting angle 710 is formed in a substantially L-shape in cross section. The jaw 711 projecting inward from the lower end is a portion that supports the outer peripheral edge of the upper plate 210 of the guide plate 200, that is, a portion larger than the lower plate 220 from below. Further, a bolt hole through which a bolt penetrates is formed in a mounting portion 712 extending upward from the jaw portion 711.

The mounting angle 710 and the main board 500
A spacer 730 for adjusting the size is appropriately interposed between the backing plate 520 on the back side and the backing plate 520.

Next, a procedure for manufacturing the above-described probe card will be described. First, the probe 1 is placed on the guide plate 200.
00 is attached. The probe 100 is inserted into the through-hole 211 and the through-hole 221 of the guide plate 200, and the rear end side is held while slightly protruding from the upper plate 210. At this time, it is one of the important points that the contact portions 110 at the tips of the probes 100 are at the same height.

Next, the soft silicon resin 240 is injected into the space between the upper plate 210 and the lower plate 220 from the resin injection hole 222 of the lower plate 220 of the guide plate 200. When the soft silicone resin 240 is cured, the probe 1
00 is attached to the guide plate 200. The base end of the probe 100 is of course soldered to the land 212.

After the probe 100 is attached to the guide plate 200, it is soldered to a land 212 formed on the upper plate 210. Thereby, the probe 100
The guide plate 200 to which is attached is completed.

Next, the intermediate substrate 30 is
0 is attached. The attachment of the intermediate substrate 300 is performed with an epoxy resin adhesive or the like.

Next, as shown in FIG.
2 and the conductive pattern 310 of the intermediate substrate 300 are connected by a bonding wire 400. As described above, the connection by the bonding wire 400 uses the land 212 as the first bond and the conductive pattern 310 as the second bond. This takes into account that the capillary of the wire bonder moves from inside to outside. Then, the surface of the bonding wire 400 is coated with an insulating resin by an appropriate method.

On the other hand, the contact 600 is attached to the main substrate 500. That is, the base end of the contact 600 is
The solder is soldered to the wiring pattern 530 while slightly protruding above the zero. Thus, the contact 600 is electrically connected to the wiring pattern 530, and structurally, the main substrate 5
This is fixed at 00.

Next, the guide plate 200 on which the probe 100 is mounted is set on the mounting angle 710 of the mounting member 700. That is, the upper plate 210 of the guide plate 002
Is mounted on the jaw 711 of the mounting angle 710. At this time, the guide plate 2
00 may be adhered to the mounting angle 710.

The mounting angle 710, to which the guide plate 200 is mounted, is attached to the main board 5 by using bolts and nuts 720.
Attach to 00. As a result, the tip of the contact 600 is pressed against the conductive pattern 310 and the conductive pattern 31 is pressed.
0 and the wiring pattern 530 are electrically connected. That is, the electrical connection is made in the order of the probe 100 → land 212 → bonding wire 400 → conductive pattern 310 → contact 600 → wiring pattern 530.

The contact 600 has an elastically deformable portion 6.
Since the contact 20 is provided, even if the contact 600 is slightly longer, the contact 600 is absorbed by the deformation of the elastic deformation portion 620.

In the above embodiment, the intermediate substrate 300
The bonding wire 400 is connected to the conductive pattern 310 of FIG.
As shown in FIG. 6, the probe 100 may be directly connected to the proximal end.

The measurement of the electrical characteristics of the LSI chip 800 using the probe card manufactured as described above will be described. The probe card is attached to a probe card support mechanism (not shown). Then, the wafer-shaped LSI chip 800 is placed on the suction table 850 below.

Next, the probe card and the suction table 85
0 relative to the contact portion 1 of the probe 100.
10 is brought into contact with the electrode pad 810 of the LSI chip 800. Furthermore, the probe 10
The contact pressure on the zero electrode pad 810 is made appropriate. At this time, the elastic deformation portion 120 of the probe 100 elastically deforms to absorb the overdrive.

In this state, signals are exchanged with an inspection device (not shown) to measure various electrical characteristics of the LSI chip 800.

As described above, a plurality of LSI chips 80
The electrical characteristics of 0 are repeatedly measured.

When the arrangement of the electrode pads 810 of the LSI chip 800 to be measured is changed, the guide plate 200 on which the probe 100 corresponding to the new arrangement of the electrode pads 810 is replaced is replaced. I do.

[0041]

According to the probe card of the present invention, the guide plate made of a material having a thermal expansion coefficient close to that of the semiconductor integrated circuit as the object to be inspected and the electrode pads of the semiconductor integrated circuit corresponding to the arrangement of the electrode pads are provided. A probe mounted on the guide plate, the guide plate being a separate body, an intermediate substrate mounted on an upper surface of the guide plate, a bonding wire connecting the probe to a conductive pattern of the intermediate substrate, and the guide plate A main board for detachably mounting the main board and the intermediate board on the lower side; and a connecting means for connecting a wiring pattern formed on the main board to the conductive pattern.

According to this probe card, the guide plate and the intermediate substrate can be easily removed from the main substrate, so that the probe can be easily replaced. Also,
Since the probe and the conductive pattern of the intermediate board are connected by bonding wires, the probe card can be manufactured using a conventional wire bonder, and only the conductive pattern formed on the board as in the past is used. More probes can be accommodated than those that have been accommodated. In particular, by using a bonding wire and a conventional conductive pattern together, it becomes possible to cope with a probe with a higher density.

In addition, in this probe card, the guide plate is made of a material having a thermal expansion coefficient close to the material of the semiconductor integrated circuit, for example, silicon nitride. It can respond to testing. That is, in the burn-in test, the probe card is heated by heating the semiconductor integrated circuit. However, at room temperature, the probe accurately corresponds to the arrangement of the electrode pads at room temperature because the coefficient of thermal expansion between the semiconductor integrated circuit and the probe card is different. Even if it does, it may shift due to thermal expansion, but if the thermal expansion coefficient is close, the influence of thermal expansion can be minimized.

The guide plate has a through hole through which the base end of the probe penetrates, and a land formed around the through hole, so that a bonding wire is connected to the land. Then, since the capillary of the wire bonder does not directly hit the probe when forming the bonding wire, displacement of the probe during wire bonding hardly occurs.

Further, the guide plate has a through hole through which the base end of the probe penetrates. When the bonding wire is connected to the base end of the probe, the bonding wire has a smaller area and more probe. Can be arranged. However, it is important to firmly fix the probe to the guide plate in advance to prevent displacement due to contact with the capillary.

On the other hand, in the method of manufacturing a probe card according to the present invention, a guide plate made of a material having a thermal expansion coefficient close to that of a semiconductor integrated circuit to be inspected is provided on a guide plate corresponding to the electrode pad of the semiconductor integrated circuit. The method further comprises a step of connecting the arranged and attached probe and a conductive pattern of an intermediate substrate which is separate from the guide plate by wire bonding.

Therefore, according to this method, a probe card in which more probes are arranged can be manufactured by using a conventional wire bonder. Moreover,
According to this method, manual connection work as in the related art is reduced, which contributes to improvement in productivity.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of a main part of a probe card according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view of a bonding wire and the like connecting a probe and a conductive pattern of the probe card according to the embodiment of the present invention.

FIG. 3 is a schematic sectional view showing another example of the connection between the probe and the bonding wire of the probe card according to the embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 probe 200 guide plate 300 intermediate substrate 400 bonding wire 500 main substrate 600 contact (connection means) 800 LSI chip

Claims (4)

[Claims] A guide plate made of a material having a thermal expansion coefficient close to a material of a semiconductor integrated circuit to be inspected; a probe attached to the guide plate corresponding to an arrangement of electrode pads of the semiconductor integrated circuit; The guide plate is a separate body, an intermediate substrate attached to the upper surface of the guide plate, a bonding wire connecting the probe to the conductive pattern of the intermediate substrate, and the guide plate and the intermediate substrate being detachably attached. A probe card, comprising: a main board attached to a lower side; and connection means for connecting a wiring pattern formed on the main board to the conductive pattern. 2. The guide plate has a through-hole through which the base end of the probe penetrates, and a land formed around the through-hole. A guide wire is connected to the land. The probe card according to claim 1, wherein: 3. The probe according to claim 1, wherein the guide plate has a through hole through which a base end of the probe penetrates, and the bonding wire is connected to a base end of the probe. Probe card. 4. A probe mounted on a guide plate made of a material having a thermal expansion coefficient close to that of a material of a semiconductor integrated circuit to be inspected, corresponding to an electrode pad of the semiconductor integrated circuit; A method for manufacturing a probe card, comprising a step of connecting a conductive pattern of an intermediate substrate separate from a plate by wire bonding.