JP2002267687A - Probe card and test device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card capable of well maintaining the electric connection to an electric device even in the case where the environment temperature varies. SOLUTION: The probe card is provided with a printed substrate having a plurality of electric fist transmission lines, a probe substrate having a plurality of electric second transmission lines connecting respectively to a plurality of the first transmission lines, arranged facing to the printed substrate and having a secondary thermal expansion coefficient smaller than a primary thermal expansion coefficient and a plurality of first contacts coming into contact with each of electrodes of the electric device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a probe card for testing electrical characteristics of electronic devices such as ICs and LSIs. In particular, the present invention relates to a probe card in which deterioration of test accuracy due to temperature change is improved.

[0002]

2. Description of the Related Art With the recent increase in definition of electronic devices,
Even in a test apparatus for testing an electronic device, a very fine probe structure is required to make an electrical connection with an electrode of the electronic device. With conventional test equipment,
An electrical connection with an electronic device has been made by a probe having a plurality of contacts made of tungsten or the like provided on a printed board made of a polyimide resin or the like.

[0003]

However, since an electronic device is manufactured using a semiconductor substrate such as Si, a difference in thermal expansion coefficient between the electronic device substrate and the probe substrate occurs. Since the probe and the electrode structure of the electronic device are very fine, a poor connection occurs in the electrical connection between the electronic device and the test apparatus due to the thermal expansion of the electronic device and the probe substrate during the test of the electronic device. However, since an electronic device is manufactured using a semiconductor substrate such as Si, a difference in the coefficient of thermal expansion between the electronic device substrate and the probe substrate occurs. Since the electrode structures of the probe and the electronic device are extremely fine, there is a possibility that a connection failure may occur in the electrical connection between the electronic device and the test apparatus due to thermal expansion of the electronic device and the probe substrate during the test of the electronic device. There was a problem. In addition, some conventional test apparatuses electrically connect to an electronic device using a long probe in order to absorb the difference in the coefficient of thermal expansion described above. However, it has been difficult to transmit a high-frequency signal with a test device using a long probe. For this reason, it has been difficult for the conventional test apparatus to achieve both absorption of the difference in the coefficient of thermal expansion and transmission of a high-frequency signal.

Accordingly, an object of the present invention is to provide an electronic device test apparatus capable of solving the above-mentioned problems. This object is achieved by a combination of features described in independent claims. The dependent claims define further advantageous embodiments of the present invention.

[0005]

According to a first aspect of the present invention, there is provided a probe card for contacting an electrode of an electronic device and used for testing characteristics of the electronic device. A printed circuit board having a plurality of first electrical transmission lines and having a first coefficient of thermal expansion,
A probe substrate having a plurality of electrical second transmission lines bonded to each of the plurality of first transmission lines, disposed opposite the printed circuit board, and having a second coefficient of thermal expansion smaller than the first coefficient of thermal expansion; , Joined to each of the plurality of second transmission lines,
A probe card, comprising: a plurality of first contacts that respectively contact electrodes of an electronic device.

In the first aspect of the present invention, the second coefficient of thermal expansion is preferably substantially equal to the coefficient of thermal expansion of the electronic device. Further, the probe substrate may be a silicon substrate. Further, the probe substrate may be a ceramic substrate. Further, the printed board may be a polyimide resin board. Further, each of the plurality of first transmission lines has a plurality of second contacts that are respectively joined to the second transmission line,
The plurality of second contacts may be provided on the printed circuit board surface and have elasticity in a direction substantially perpendicular to the printed circuit board surface.

Further, each of the plurality of second transmission lines is
It has a 1st pad joined to a 2nd contactor, and a plurality of 1st pads may be provided in a field which counters a printed circuit board surface of a probe board. Further, it is preferable that the sizes of the plurality of first pads be based on the difference in the coefficient of thermal expansion between the printed board and the probe board. In addition, the plurality of first contacts may be provided on the surface of the probe substrate and have elasticity in a direction substantially perpendicular to the surface of the probe substrate.

It is preferable that the pitch of the plurality of first contacts is smaller than the pitch of the plurality of second contacts. Further, the probe board may further include a probe board holding unit that applies pressure to the probe board in the direction of the printed board. In addition, the probe substrate holding unit may include a unit that limits a movable range of the probe substrate in a direction substantially parallel to the surface of the probe substrate. Further, it is preferable that the plurality of first pads have a size that maintains electrical connection with the plurality of second contacts in the movable range of the probe board.

According to a second aspect of the present invention, there is provided a test apparatus for testing an electronic device, comprising: a pattern generator for generating a test pattern and an expected value signal; and a pattern generator for generating the pattern signal. A waveform shaper for shaping a waveform, a probe card for supplying a test pattern shaped by the waveform shaper to an electronic device and receiving an output signal output from the electronic device, and an expected value signal output from a pattern generator And, based on the output signal output by the electronic device based on the pattern signal, comprising a determination unit that determines the quality of the electronic device, the probe card has a plurality of first electrical transmission lines,
A printed circuit board having a first coefficient of thermal expansion, and having a plurality of electric second transmission lines joined to each of the plurality of first transmission lines, disposed to face the printed circuit board, the first coefficient of thermal expansion A test apparatus comprising: a probe substrate having a small second coefficient of thermal expansion; and a plurality of first contacts that are respectively connected to the plurality of second transmission lines and contact each of the electrodes.

Note that the above summary of the present invention does not enumerate all of the necessary features of the present invention, and that a sub-combination of these features can also be an invention.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described through embodiments of the present invention. However, the following embodiments do not limit the invention according to the claims, and are described in the embodiments. Not all combinations of features are essential to the solution of the invention.

FIG. 1 shows an example of the configuration of a test apparatus 100 according to the present invention. The test apparatus 100 includes a pattern generator 1
0, waveform shaper 20, probe card 30, determination unit 50
Is provided. The pattern generator 10 generates a test pattern for testing the electronic device 60 and an expected value pattern to be output by the electronic device 60 when the test pattern is input to the electronic device 60. The waveform shaper 20 receives the test pattern generated by the pattern generator 10 and supplies a signal obtained by shaping the test pattern to the probe card 30. For example, waveform shaper 2
“0” delays the test pattern according to the reference clock generated by the test apparatus 100 and supplies the test pattern to the probe card 30. The probe card 30 supplies the test pattern shaped by the waveform shaper 20 to the electronic device 60, and based on the test pattern, the electronic device 6
0 receives the output signal output. The determination unit 50 determines the electrical characteristics of the electronic device 60 based on the output signal from the electronic device 60 received by the probe card 30 and the expected value pattern generated by the pattern generator 10.

FIG. 2 shows a cross section of an example of the probe card 30. The probe card 30 has a plurality of electrical first transmission lines and a printed circuit board 32 having a first coefficient of thermal expansion.
And a probe having a plurality of second electrical transmission lines joined to each of the plurality of first transmission lines, disposed opposite the printed circuit board, and having a second coefficient of thermal expansion smaller than the first coefficient of thermal expansion. A plurality of first contacts 38 that are respectively connected to the substrate 34 and the plurality of second transmission lines and are in contact with the electrodes of the electronic device 60; and a second transmission line that is provided at an end of the first transmission line. The printed circuit board 32 is connected to the plurality of second contacts 42 to be joined and the probe board 34 respectively.
And a probe substrate holding unit for applying pressure in the direction of.

The plurality of first transmission lines of the printed board 32 transmit the test pattern provided from the waveform shaper 20 described in FIG. 1 to the second transmission line of the probe board 34. For example, the printed board 32 has a plurality of pads 46 electrically connected to the waveform shaper 20, and the first transmission line electrically connects the pads 46 and the second transmission line of the probe board 34. May be. The printed circuit board 32 may include a shaping circuit that changes the characteristics of the test pattern such as the waveform and frequency of the given test pattern. In this case, the first transmission line electrically connects the pad 46 and the second transmission line of the probe board 34 via the shaping circuit. The shaping circuit may have the same function as the waveform shaper 20 described in FIG. Also,
Each of the plurality of first transmission lines is connected to the plurality of second contacts 42 respectively joined to the second transmission line of the probe board 34.
The plurality of second contacts 42 are provided on the surface of the printed board 32 and have elasticity in a direction substantially perpendicular to the surface of the printed board on which the plurality of second contacts 42 are provided. Is preferred. When the plurality of second contacts 42 have elasticity, for example, even if the probe board 34 is inclined with respect to the printed board 32, the plurality of second contacts 4
2 expands and contracts according to the inclination,
The probe board 34 absorbs the inclination and the printed board 3
The test can be performed as if it were parallel to 2. Further, even when the surface of the printed circuit board 32 is not smooth, each of the plurality of second contacts expands and contracts according to the smoothness of the surface of the printed circuit board 32. The test can be performed as if it were smooth.

The plurality of second transmission lines of the probe board 34 electrically connect the plurality of first transmission lines of the printed circuit board 32 and the plurality of first contacts 38, and transmit the signals from the plurality of first transmission lines. The test pattern is transmitted to the plurality of first contacts 38. The plurality of first contacts 38 are provided on the surface of the probe board 34. The plurality of first contacts 38 are
The test patterns transmitted from the plurality of first transmission lines are supplied to the electronic device 60. In addition, a plurality of first contacts 3
8 receives an output signal output by the electronic device 60 based on the supplied test pattern. Electronic device 6
0 is output from the first contact 3 described above.
8, via the second transmission line and the first transmission line, to the determination unit 50 described in FIG.

The printed board 32 may be a board made of, for example, polyimide. The probe board 34 has a second coefficient of thermal expansion smaller than the first coefficient of thermal expansion of the printed board 32. For example, the probe substrate 34 may be a silicon (Si) substrate, or may be a ceramic substrate. The second coefficient of thermal expansion, which is the coefficient of thermal expansion of the probe substrate 34, is preferably substantially equal to the coefficient of thermal expansion of the electronic device 60 to be tested. By making the coefficient of thermal expansion of the electronic device 60 substantially equal to the coefficient of thermal expansion of the probe substrate 34, even if the size of the probe substrate 34 changes due to thermal expansion, the electronic device 60 and the probe substrate 34 The electrical connection with the plurality of first contacts 38 provided on the surface of 34 can be maintained in a good state. For example, when testing the electronic device 60 formed on a silicon wafer, the electronic device 60 and the probe substrate 3 are formed by forming the probe substrate 34 from silicon.
4 can be made substantially equal, and the electrical connection between the electronic device 60 and the probe board 34 can be maintained in a good state. Further, by forming the probe substrate 34 from silicon, the probe substrate 34 can be made very smooth.

Each of the plurality of second transmission lines of the probe board 34 may have a plurality of first pads 40 electrically connected to the plurality of second contacts 42. The plurality of first pads 40 are provided on the printed board 3 of the probe board 34.
2 is provided on the surface facing the same. It is preferable that the sizes of the plurality of first pads 40 be determined based on the difference in the coefficient of thermal expansion between the printed board 32 and the probe board 34. For example, the plurality of first pads 40 may be sized based on a change in ambient temperature and a difference in the coefficient of thermal expansion that occur when the electronic device 60 is tested. That is, the plurality of first pads 40 are large enough to maintain electrical connection with the second contact 42 even at the time of the maximum change in the ambient temperature assumed when the electronic device 60 is tested. Is preferred.

The probe board holder 36 may be provided on the surface of the printed board 32, as shown in FIG. The plurality of second contacts 42 have elasticity, and the probe board holding section 36 presses the probe board 34, so that the probe board 34 can be held at a desired position. The probe substrate holding section 36 may include a pressurizing unit that applies pressure to the entire circumference of the probe substrate 34 or a portion of the plurality of probe substrates 34. For example, the probe board holding section 36
Is fixed to the printed circuit board 34 with screws or the like, and the probe board holding unit 36 may apply a pressure to the probe board 34 based on the degree of screw tightening. Further, the probe substrate holding section 36 may hold the probe substrate 34 by applying pressure to, for example, three portions of the probe substrate 34. It is preferable that the probe substrate holding section 36 can hold the probe substrate 34 at an arbitrary height. The probe substrate holding unit 36 applies pressure to the entire circumference of the probe substrate 34 or to a portion of the plurality of probe substrates 34,
The inclination of the probe board 34 with respect to the printed board 32
Can be adjusted. That is, the probe board holding unit 3
6 adjusts the inclination of the probe board 34 with respect to the printed board 32, and
By controlling the inclination of 4 within a predetermined inclination, the length of the plurality of second contacts 42 can be made shorter than that of a conventional probe. Therefore, a high-frequency signal can be transmitted to the electronic device 60 as compared with a conventional test apparatus. Further, it is preferable that the probe substrate holding section 36 has means for limiting a movable range of the probe substrate 34 in a direction substantially parallel to the surface of the probe substrate 34.
For example, the probe board holding section 36 has a protrusion substantially perpendicular to the surface of the probe board 34, and the probe board 3
4 may be restricted. In this case, it is preferable that the plurality of first pads 40 have a size that maintains electrical connection with the plurality of second contacts 42 in the movable range of the probe board 34. That is, it is preferable that the plurality of first pads 40 have a size that maintains electrical connection with the plurality of second contacts 42 even when the probe board 34 moves to the maximum within the movable range. .

It is preferable that each pitch (interval) of the plurality of first contacts 38 is smaller than each pitch of the plurality of second contacts 42. Plural second contacts 4
2 is larger than the pitch of the plurality of first contacts 38, so that the plurality of first pads 40
A plurality of first pads 40 having a sufficient size can be provided to maintain electrical connection with the first pad 40. The plurality of first contacts 38 and the plurality of second contacts 42 are electrically connected via the plurality of second transmission paths in the probe board 34. The plurality of second transmission paths are wired inside the probe board 34 so as to eliminate the pitch difference between the plurality of first contacts 38 and the plurality of second contacts 42.

The plurality of first contacts 38 are provided on the surface of the probe substrate 34, and preferably have elasticity in a direction substantially perpendicular to the surface of the probe substrate. In this example, the electronic device 60 and the probe substrate 34 are formed of, for example, silicon and have a smooth surface. However, since the plurality of second contacts 38 have elasticity, the surface of the electronic device 60 and the probe substrate 34 Even if there is a minute inclination, distortion, etc., the plurality of second contacts 3
8 expands and contracts in accordance with the surface states of the electronic device 60 and the probe substrate 34, thereby absorbing the minute inclination and distortion. In this example, since the electronic device 60 and the probe board 34 have very smooth surfaces, the length of the plurality of second contacts 38 can be shorter than that of a conventional probe.

In this embodiment, it is preferable that the test apparatus 100 further includes an adjusting means for adjusting the inclination of the electronic device 60 with respect to the probe board 34. For example, it is preferable that the test apparatus 100 further include a unit that measures the position information of the tips of the plurality of first contacts 42 and adjusts the tilt of the electronic device 60 based on the measured position information.

In this embodiment, the printed circuit board 32
Has a second contact 42, and the second transmission line of the probe board 34 has a plurality of first pads 40. In other examples, the first transmission line has a plurality of pads. A second transmission line having a plurality of second contacts;
May be provided. In this case, the plurality of first pads 40 are provided on the surface of the printed circuit board 32 and the plurality of second contacts 4
2 is provided on the surface of the probe board 34 facing the printed board 32.

In this embodiment, by providing the probe board 34 having a coefficient of thermal expansion close to the coefficient of thermal expansion of the electronic device 60 and the plurality of first pads 40, the printed board 32
And a difference in thermal expansion coefficient with the electronic device 60 is absorbed. Therefore, the second contact 42 does not need to have a length to absorb the difference in the coefficient of thermal expansion, and only needs to have a length that can correct the smoothness of the surface of the printed circuit board 32. For this reason, as described above, the lengths of the plurality of first contacts 38 and the plurality of second contacts 42 can be minimized, and the plurality of first contacts 38 and the plurality of second contacts It is possible to prevent the deterioration of the signal such as the test pattern and the output signal at 42. In addition, by minimizing the length of the plurality of first contacts 38 and the plurality of second contacts 42,
High-speed transmission of test patterns, output signals, and the like can be performed.

The printed circuit board 32 is formed by a dotted line 4 in FIG.
It may be possible to divide the area indicated by 8. That is, the printed board 32 may be dividable into an area 44 in which the plurality of second contacts 42 and the probe board holding section 36 are provided, and an area for receiving a test pattern from the waveform shaper 20. In this case, the material of the printed board in the area 44 where the plurality of second contacts 42 and the probe board holding section 36 are provided has a lower thermal expansion coefficient than the material of the printed board in the area where the test pattern is received from the waveform shaper 20. It can be a large material. In this case, due to the difference in the coefficient of thermal expansion, the plurality of second contacts 42 and the probe
Can be held in the region 44 provided with. Also,
The area for receiving the test pattern from the waveform shaper 20 is
A holding unit that holds the region 44 where the plurality of second contacts 42 and the probe board holding unit 36 are provided may be provided. The printed board 32 includes an area 44 in which the plurality of second contacts 42 and the probe board holding section 36 are provided, and the waveform shaper 20.
Can be divided into a region for receiving a test pattern from the device according to the electronic device 60 to be tested.
The probe board 34 can be easily replaced.
For example, it is possible to easily replace the probe substrate 34 with a plurality of first contacts 38 having a pitch corresponding to the electrode pitch of the electronic device 60.

The printed circuit board 32 may be dividable so as to divide the plurality of pads 46. In this case, it is preferable that each of the plurality of divided pads 46 performs signal transmission between the divided printed circuit boards 32. Each of the plurality of divided pads 46 performs signal transmission between the divided printed circuit boards 32, so that the divided pads 46 can be divided without providing a connector or the like for signal transmission between the divided printed circuit boards 32. Signal transmission between the printed circuit boards 32 can be performed.

The probe board 34 is preferably detachable from the printed board 32. By making the probe board 34 detachable from the printed board 32, the printed board 32 can be shared by a plurality of probe boards 34. That is, a plurality of probe boards 34 corresponding to the electronic device 60 to be tested can be manufactured, and the printed board 32 can be made common to each probe board 34.

FIG. 3 is a top view of an example of the probe card 30. A plurality of pads 46 are provided on the printed circuit board 32 and are electrically connected to the waveform shaper 20 or the determination unit 50 described with reference to FIG. The probe board 36 includes the printed board 32 and the second contact 4
2 (not shown). The probe board holding unit 36 applies pressure to the probe board 34 in the direction of the printed board 32. The test pattern input from the plurality of pads 46 is transmitted to the plurality of first contacts 38 via the first transmission line and the second transmission line described in FIG. The plurality of first contacts 38 are respectively connected to the electrodes of the electronic device 60, and exchange a test pattern and an output signal output from the electronic device 60 based on the test pattern.

According to the probe card 30 described above, even when the ambient temperature changes during the test of the electronic device 60, the electrical connection between the electronic device 60 and the probe card 30 can be kept good. Can be. Therefore, the test apparatus 100 can perform a highly accurate test.

Although the present invention has been described with reference to the embodiment, the technical scope of the present invention is not limited to the scope described in the above embodiment. It is apparent to those skilled in the art that various changes or improvements can be added to the above-described embodiment. It is apparent from the description of the appended claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

[0030]

As is apparent from the above description, according to the present invention, even when there is a change in the ambient temperature, the electrical connection between the electronic device 60 and the probe card 30 is kept good, and The test can be performed with high accuracy.

[Brief description of the drawings]

FIG. 1 shows an example of a configuration of a test apparatus 100 according to the present invention.

FIG. 2 shows a cross section of an example of the probe card 30.

FIG. 3 is a top view of an example of the probe card 30.

[Explanation of symbols]

10: pattern generator, 20: waveform shaper, 3
0: Probe card, 32: Printed circuit board, 3
4 ... probe board, 36 ... probe board holding part, 38 ... first contactor, 40 ... first pad, 4
2 ... second contact, 46 ... pad, 50 ... determination unit, 60 ... electronic device, 100 ... test apparatus

Continued on the front page F term (reference) 2G003 AA07 AB01 AE03 AF06 AG03 AG08 AG12 AH05 2G011 AA16 AB06 AB08 AC12 AC14 AC32 2G132 AA01 AB01 AB14 AE04 AF06 AG02 AG04 AG08 AL04 4M106 AA01 BA01 DD01

Claims (14)

[Claims] 1. A probe card for contacting an electrode of an electronic device and used for testing characteristics of the electronic device, the probe card having a plurality of first electrical transmission lines and having a first coefficient of thermal expansion. A printed circuit board having a plurality of second electrical transmission lines joined to each of the plurality of first transmission lines, and disposed opposite to the printed circuit board, and having a second smaller than the first coefficient of thermal expansion. A probe card, comprising: a probe substrate having a coefficient of thermal expansion; and a plurality of first contacts that are respectively joined to the plurality of second transmission lines and contact electrodes of the electronic device. 2. The probe card according to claim 1, wherein the second coefficient of thermal expansion is substantially equal to a coefficient of thermal expansion of the electronic device. 3. The probe card according to claim 1, wherein the probe substrate is a silicon substrate. 4. The probe card according to claim 1, wherein the probe substrate is a ceramic substrate. 5. The probe card according to claim 3, wherein the printed board is a polyimide resin board. 6. Each of the plurality of first transmission lines,
A plurality of second contacts respectively connected to the second transmission line, wherein the plurality of second contacts are provided on the surface of the printed circuit board, and have elasticity in a direction substantially perpendicular to the surface of the printed circuit board. The probe card according to any one of claims 1 to 5, comprising: 7. Each of the plurality of second transmission lines includes:
The method according to claim 6, further comprising a first pad to be joined to the second contact, wherein the plurality of first pads are provided on a surface of the probe substrate facing the printed circuit board surface. Probe card. 8. The probe card according to claim 7, wherein the sizes of the plurality of first pads are based on a difference in a coefficient of thermal expansion between the printed board and the probe board. 9. The apparatus according to claim 8, wherein the plurality of first contacts are provided on the surface of the probe substrate and have elasticity in a direction substantially perpendicular to the surface of the probe substrate.
The probe card according to 1. 10. The probe card according to claim 9, wherein a pitch between the plurality of first contacts is smaller than a pitch between the plurality of second contacts. 11. The probe card according to claim 1, further comprising a probe board holding section for applying pressure to the probe board in the direction of the printed board. 12. The probe according to claim 11, wherein the probe substrate holding unit has means for restricting a movable range of the probe substrate in a direction substantially parallel to a surface of the probe substrate. card. 13. The device according to claim 12, wherein the plurality of first pads have a size that maintains electrical connection with the plurality of second contacts in the movable range of the probe board. Probe card. 14. A test apparatus for testing an electronic device, comprising: a pattern generator for generating a test pattern and an expected value signal; and a waveform shaper for shaping a waveform of the pattern signal generated by the pattern generator. A probe card that supplies the test pattern shaped by the waveform shaper to the electronic device and receives an output signal output from the electronic device; and the expected value signal output from the pattern generator. ,
A determination unit that determines pass / fail of the electronic device based on the output signal output from the electronic device based on the pattern signal, wherein the probe card has a plurality of first electrical transmission lines. A printed circuit board having a first coefficient of thermal expansion, and a plurality of electric second transmission lines joined to each of the plurality of first transmission lines, the second printed circuit board being disposed to face the printed circuit board, A probe substrate having a second coefficient of thermal expansion smaller than one coefficient of thermal expansion, and a plurality of first contacts that are respectively connected to the plurality of second transmission lines and contact each of the electrodes. Test equipment.