TWI220461B - Separable test apparatus for integral circuit - Google Patents

Separable test apparatus for integral circuit Download PDF

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Publication number
TWI220461B
TWI220461B TW92101041A TW92101041A TWI220461B TW I220461 B TWI220461 B TW I220461B TW 92101041 A TW92101041 A TW 92101041A TW 92101041 A TW92101041 A TW 92101041A TW I220461 B TWI220461 B TW I220461B
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test
power supply
supply device
patent application
scope
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TW92101041A
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TW200300845A (en
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Chui-Kun Ke
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Giga Solution Tech Co Ltd
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Abstract

Separable test apparatus is provided for integral circuit (IC), which is configured to perform a test related to electronic characteristic for an IC device. An alignment plate, at a first position, contacts with a base for aligning the position of IC device. The alignment plate provides an opining for containing the IC device. While at a second position, the alignment plate is separated from the base. A force-serving device mechanically connects with a connection portion. The connection portion is affixed to the alignment plate, wherein the force-serving device shifts the connection portion together with the alignment plate to drive the alignment from the first position to the second position. The alignment plate is positioned at the second position for the reduction of unwontedly electrical interference and the improvement of test accuracy.

Description

^0461^ 0461

五、發明說明(1) 、【發明所屬之技術領域】 其特別是關於一種用 的I C測試台。 本發明係有關於一種I C測試台, 於射頻(radi〇 frequency)電性測試 ~ '【先前技術】 曰積體電路(1 c )是在一半導體晶圓上形成各個分別的I C 晶片’利用特定的電路設計,可以進行晶片的測試。V. Description of the invention (1), [Technical field to which the invention belongs] In particular, it relates to an IC test bench for use. The present invention relates to an IC test bench for radio frequency electrical testing ~ '[prior art] the integrated circuit (1 c) is to form each IC chip on a semiconductor wafer' using specific The circuit design can be used for wafer testing.

一 第一圖所示,為一般測試Ic元件之插座(socket)側面 示思圖。待測IC元件110置於插座中,利用一上蓋112芸住 並下壓待測I C元件1 1 0,使得待測I c元件1 1 〇接觸到接觸接 腳11 4,以進行測試。 此外,美國專利號5,0 0 6,7 9 2揭露測試積體電路用之 一插座接合器,將晶片置於插座中,插座再放置於測試機 台上。美國專利號5, 537, 05 1則揭露適用於不同封裝形式 的測試插座。美國專利號6,1 7 4,1 7 4針對多接腳的I C元件 測試,揭露改良式的測試插座。 上述之用以測試I C元件的傳統插座,當應用於射頻( r a d i 〇 f r e q u e n c y )電性測試時,都會面臨插座本身對於測 試之干擾的問題,進而影響到測試的準確度。因此,如何 避免待測I C元件以外的結構或裝置對於測試的干擾,是射 頻I C元件電性測試上很重要的課題。-The first picture is a schematic diagram of the side of a socket for a general test IC component. The IC component under test 110 is placed in the socket, and an upper cover 112 is used to hold down and press down the IC component under test 1 1 0 so that the IC component under test 1 contacts the contact pin 11 4 for testing. In addition, U.S. Patent No. 5,006,792 discloses a socket adapter for testing integrated circuits, the chip is placed in the socket, and the socket is placed on the test machine. U.S. Patent No. 5,537,05 1 discloses test sockets suitable for different package types. U.S. Patent No. 6, 174, 174 discloses an improved test socket for testing multi-pin IC components. The above-mentioned traditional sockets used for testing IC components, when applied to radio frequency (r a di i 0 f r e q u e n c y) electrical testing, will face the interference of the socket itself to the test, which will affect the accuracy of the test. Therefore, how to avoid the interference of the structure or device other than the IC device under test on the test is an important issue in the electrical test of the RF IC device.

第5頁 1220461 五、發明說明(2) 三、【發明内容】 對於上述欲利用一般Ic測試^行射 的干擾問題,本發明提供—分離式IC測試 的調校板,於進行電性測試時,㈣板與 y = ’可避免調校板與待測IC元件接觸所衍生的干擾問::離 對於增加κ測試台進行射頻測試的準確度,本發明提 供- 1C :]:式!’利用一氣壓缸移動連桿以移動調 置’使得调杈板於進行電性測試時遠離底元 ,增加電性測試的準確度。 /、行成I i L 7L仵 根據上述,本發明提供—種 行-1c元件的射頻電性測試,包含-調校板?; 一 = 置時,與一底座接觸,用以調彳 ; 有-開口用以容納!…牛,而^广的位置。調校板具 離。-供力裝[機構地連接二連置時,與底座分 固定於調校板,供力裝置移動連接又刀,亚且連接部分 一位置與第二位P *^接4分以帶動調校板至第Page 5 1220461 V. Description of the invention (2) III. [Summary of the invention] For the interference problem of the above-mentioned general Ic test ^ traveling emission, the present invention provides a calibration board for a separate IC test, which is used for electrical testing. , ㈣ = y = 'can avoid the interference caused by the contact between the adjustment board and the IC component to be tested. Q: To increase the accuracy of the κ test bench for radio frequency testing, the present invention provides-1C:] :! ‘Using a pneumatic cylinder to move the linkage to move the setting’ makes the adjusting plate away from the base unit when performing the electrical test, increasing the accuracy of the electrical test. / 、 Xingcheng I i L 7L 仵 According to the above, the present invention provides-a kind of radio frequency electrical test of the -1c element, including-a calibration board? ; = When in contact with a base for adjustment; there are-openings for accommodating! ... cattle, and ^ wide position. The adjustment board is off. -Power supply device [When the mechanical connection is connected in two, it is fixed to the adjustment plate with the base, and the power supply device is connected to the knife again. One position of the connection part is connected to the second position P * ^ to drive the adjustment. Board to

1220461 五、發明說明(3) 作中,應包含長度、寬度及深度的三維空間尺寸。 第二圖為根據本發明之一分離式丨c測試台的部分側面 示意圖。參照第二圖,一分離式I C測試台1 〇主要包含底座 12(base)、調校板14(alignment plate)、第二供力裝置 16(f〇rce-serving device)、測試部分 18(measuring portion)、第一供力裝置2〇,與連接部分22(C〇nneCti〇n por 11 on)。在一實施例中,分離式丨c測試台丨〇尚包含做為 固定用途的基板24(substrate plate)與支架26(stand)。1220461 V. Description of the invention (3) In the work, the three-dimensional space dimensions of length, width and depth shall be included. The second figure is a schematic partial side view of a separate test bench according to the present invention. Referring to the second figure, a separate IC test bench 10 mainly includes a base 12, an alignment plate, a second power supply device 16 and a test portion 18. portion), the first power supply device 20, and the connection portion 22 (ConneCtión por 11 on). In one embodiment, the separate-type c test bench includes a substrate 24 and a stand 26 for stationary use.

一在本發明中,底座12可用以放置調校板14與一待測1(: 几件(圖上未示)。再者,底座12包含一接觸28(c〇ntact) 用以支撐待測ic元件,以及若干測試接腳(pins)(圖上未 示)用以接觸待測I C元件以進行測試之用。可以瞭解的是 底座1 2也可包含連接測試接腳或其他用途所需的周邊電 路。另一種方式是,底座12可電性上連接至一外部電路以 進行測試之用。此外,底座12可以以任何適當材料製成, 並且可以具有適當的幾何外形,只要有一平面呈 用途即可,在一較佳實施例中,底座12為一矩^形狀。 調校板14放置於一底座12上,用以調校待測“元件 位置。在一較佳實施例中,調校板丨4具有— 待測1C元件,且接觸28在此開口範圍内。 二 22固定於調校板U上,在一較佳實施例中U =First, in the present invention, the base 12 can be used to place the calibration board 14 and a test piece 1 (: several pieces (not shown in the figure). Moreover, the base 12 includes a contact 28 to support the test piece. IC components, and a number of test pins (not shown in the figure) are used to contact the IC component under test for testing. It can be understood that the base 1 2 may also include the pins required for connecting the test pins or other purposes. Peripheral circuits. Another way is that the base 12 can be electrically connected to an external circuit for testing. In addition, the base 12 can be made of any suitable material and can have a suitable geometric shape as long as a plane is used That is, in a preferred embodiment, the base 12 has a rectangular shape. The adjustment plate 14 is placed on a base 12 to adjust the position of the component to be measured. In a preferred embodiment, the adjustment Board 丨 4 has — 1C component to be tested, and contact 28 is within this opening range. Two 22 are fixed on the adjustment board U, in a preferred embodiment U =

第7頁 五、發明說明(4) 例如若干根連桿,以機構地 1 4上。可以瞭解;、-端固定於調校板 、固定於調校板“之任以以任何適當的方式 以任何適當材料製成, j及凋杈板1 4可以 」以具有適當的幾何外形。 第二供力裝置〗6位於底座12上方# 分18,並且固定於支架26上,當測二機Ϊ地f接測試部 :吏得測試部分18接觸且施力一壓力 較佳實施例中’第二供力裳置16主要在-cylinder),測試部分i 瑕^反缸(baro-Page 7 V. Description of the invention (4) For example, a number of links are used to mechanically connect to the ground. It can be understood that, the-end is fixed to the adjustment plate, and the adjustment plate is "made to be made in any suitable manner in any suitable material, j and the withered plate 14 can be" to have an appropriate geometric shape. The second power supply device 6 is located above the base 12 # 分 18, and is fixed on the bracket 26. When the test machine 2 is connected to the test section: the test section 18 contacts and applies a pressure in a preferred embodiment. The second power supply set 16 is mainly in -cylinder), and the test part i is flawed.

元件放置於開σ 要上含厂測試桿,當待測K :試桿-端的測試頭接觸待測IC元件下杯, 當測試完畢後,氣 二二,觸至:測試接腳。 分離。要說明的是,第二;=;;:上以與待測1C元件 分離式1C測試台10之任何適當^ 人測试部^可位於 露之在底座1 2上方位置。再:’不限於此實施例所揭 氣懕缸,可L7 4人置再者弟二供力裝置1 6亦不限於 矾反缸,可U包含任何適當可產生 』个I良方、 動連動桿或螺桿的步進馬達等。 々衣置,例如可移 第:供力袈置20位於並固定在第二供 機構地連接連接部分22。可以選 ,=:6上方、 可固定於支架26上。當測H日卑,笸 弟一仏力放置20也 邱八??以鹛黏上田上 田、〗式守第一供力裝置20移動遠技 ^…動调校板“與待測心件分離。在一較=The component is placed in the open σ. The factory test rod is included. When the test K: the test head at the end of the test rod contacts the lower cup of the IC component under test. After the test is completed, the gas is touched to the test pin. Separation. It is to be noted that the second; = ;;: any appropriate human test section ^ of the 1C test stand 10 separated from the 1C component to be tested may be located at the position above the base 12 of the exposed. Further: 'It is not limited to the gas cylinder disclosed in this embodiment, but it can be installed on the L7 4-person and the second power supply device 16. It is also not limited to the aluminous cylinder. It can contain any suitable recipe that can be generated. Stepper motors such as rods or screws. The attachment device is, for example, movable. The power supply device 20 is located and fixed to the second connection mechanism connection portion 22. Can be selected, =: 6 above, can be fixed on the bracket 26. When the H day was measured, my brother placed 20 for a while, Qiu Ba? ? Adhere to Ueda and Ueda, and stay in the first power supply device. 20 Move the remote skill ^ ... The dynamic adjustment board "separate from the heart piece to be measured. One comparison =

第8頁 1220461 五、發明說明(5) 例中,第一供力裝置2 0主要包含一氣壓缸,連接部分2 2則 主要包含若干根連桿,連桿之一端固定於調校板丨4上。當: 測試的調校步驟時,氣壓缸支持連桿向下、將調校板14固 定於底座1 2上’即調校板1 4接觸底座丨2。待待測丨c元件之 ·· 位置調校完畢、準備進行測試之前,氣壓缸作動以使連桿· 向上移動’並帶動調校板1 4向上移動,因而調校板丨4與接 觸28、待測1C元件分離,即調校板14離開底座12。根據上 述j本發明的特徵之一,在於待測IC元件進行測試時,特 別是射頻(radio freqUency)電性測試時,調校板14可與 接觸2 8及待測I c元件分離,可以避免調校板丨4影響待測丨c ^ 元件的電特性、避免調校板1 4對測試時造成干擾,以及進 t增加測試的準確性。即本發明的特徵之一,在於提供可 分離的調校板,於電性測試時,調校板可與待測丨c元件分 離再者’可以瞭解的是,本發明的兩個供力裝置,可以 ^ 一供力裝置,利用切換輔助的方式,分別施力於測* 4部分1 8與連接部分2 2以進行作動,而不限於此一實施例 之利用兩個氣壓叙。 第二A圖為根據本發明之一調校板的正面示意圖。調 =板Μ $大致中心位置處具有一開口 3〇用以容納待測ic元 亚凋杈放置仇置。在一較佳實施例中,開口 3 0可進一步 ^ =调校板14的一凹槽32範圍内,而固定部分34則用以連 火例如連桿的連接部分22。可以瞭解的是,調校板1 4以適 虽的材質制士、 、,Page 8 1220461 V. Description of the invention (5) In the example, the first power supply device 20 mainly includes a pneumatic cylinder, and the connecting portion 22 mainly includes a plurality of connecting rods, and one end of the connecting rod is fixed to the adjustment plate. 4 on. When: The adjustment steps of the test, the pneumatic cylinder supports the connecting rod downward and fixes the adjustment plate 14 on the base 12 ', that is, the adjustment plate 14 contacts the base 丨 2. To be tested 丨 The position of the c component is completed. Before the position adjustment is completed and the test is ready to be tested, the pneumatic cylinder is actuated to move the connecting rod 'and move the adjustment board 1 and 4 upward, so the adjustment board 4 and the contact 28, The 1C component under test is separated, that is, the adjustment board 14 leaves the base 12. According to one of the features of the present invention described above, when the IC component to be tested is tested, especially during radio frequency (radio freqUency) electrical test, the adjustment board 14 can be separated from the contact 28 and the IC component to be tested, which can be avoided. The calibration board 4 affects the electrical characteristics of the components under test c ^, avoids the calibration board 14 causing interference during the test, and improving the accuracy of the test. That is, one of the features of the present invention is to provide a detachable adjustment board. During the electrical test, the adjustment board can be separated from the c component to be tested. Furthermore, it can be understood that the two power supply devices of the present invention It is possible to use a power supply device to apply force to the measuring part * 4 and the connecting part 22 for actuation by means of switching assistance, and is not limited to the use of two air pressures in this embodiment. FIG. 2A is a schematic front view of an adjustment board according to the present invention. There is an opening 30 at the approximate center of the plate M $ to accommodate the IC to be tested. In a preferred embodiment, the opening 30 can be further within a range of a groove 32 of the adjustment plate 14, and the fixing portion 34 is used to ignite a connecting portion 22 such as a connecting rod. It can be understood that the adjustment board 1 4 is made of suitable materials,

、衣成’亚且幾何形狀不限於圖上所示。而第三BThe clothes are not limited to the geometric shapes shown in the figure. And the third B

第9頁 1220461Page 9 1220461

ί : 本發明之一調校板的侧面示意圖。#測1C元件 轭加一壓力於待測IC元件,使待測IC元件τ 壓至與測試接腳接觸以進行測試。 兀件下 根據上述’本發明提供一種IC測試台,用以進行—I c 元件的電性測試,包含一調校板放置於一底座上,並且用 以凋11C元件的位置。調校板具有一開口用以容納丨c元件 。一第二供力裝置,機構地(mechanicauy)連接一測試部 分,當電性測試時,第二供力裝置使得測試部分接觸且施 加一壓力於I C元件。一第一供力裝置,機構地連接一連接 部为,並且連接部分固定於調校板,於進行電性測試之前 ’第一供力裝置移動連接部分以帶動調校板與丨c元件分離 以上所述之實施例僅係為說明本發明之技術思想及特 點’其目的在使熟習此項技藝之人士能夠瞭解本發明之内 容並據以實施,當不能以之限定本發明之專利範圍,即大 凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵 蓋在本發明之專利範圍内。ί: A schematic side view of an adjustment board of the present invention. # 测 1CElement The yoke applies a pressure to the IC component under test, so that the IC component τ is pressed to contact the test pin for testing. According to the above, the present invention provides an IC test bench for conducting electrical testing of the I c element, including an adjustment board placed on a base and used to position the 11C element. The adjustment board has an opening for receiving the c element. A second power supply device is mechanically connected to a test portion. When the electrical test is performed, the second power supply device makes the test portion contact and apply a pressure to the IC component. A first power supply device is mechanically connected to a connection portion, and the connection portion is fixed to the adjustment board. Before the electrical test is performed, the 'first power supply device moves the connection portion to drive the adjustment plate to separate from the c element. The described embodiments are merely to explain the technical ideas and characteristics of the present invention. The purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. When the scope of the patent of the present invention cannot be limited, Any equal changes or modifications made according to the spirit disclosed in the present invention should still be covered by the patent scope of the present invention.

第10頁 1220461 圖式簡單說明 五、【圖式簡單說明】 第一圖所示,為一般測試1C元件之插座(socket)側面 示意圖。 第二圖為根據本發明之一分離式I C測試台的部分侧面 示意圖。 第三A圖為根據本發明之一調校板的正面示意圖。 第三B圖則為根據本發明之一調校板的側面示意圖。 符號說明 10 分 離 式1C 測 試台 12 底 座 14 調 校 板 16 第 一 供 力 裝 置 18 測 試 部 分 20 第 二 供 力 裝 置 22 連 接 部 分 24 基 板 26 支 架 28 接 觸 30 開 D 32 凹 槽 34 固 定 部 分Page 10 1220461 Brief description of the drawings 5. [Simplified description of the drawings] The first picture is a schematic diagram of the side of the socket for testing 1C components. The second figure is a schematic partial side view of a separate IC test bench according to the present invention. FIG. 3A is a schematic front view of an adjustment board according to the present invention. FIG. 3B is a schematic side view of an adjustment board according to the present invention. Explanation of Symbols

第11頁Page 11

Claims (1)

1220461 六、申請專利範圍 1. 一種分離式I C測試台,用以進行一 I C元件的電性測試, 該分離式I C測試台包含: 一調校板,於一第一位置時,與一底座接觸,用以調 校該I C元件的位置,該調校板具有一開口用以容納該I C元 件,以及於一第二位置時,與該底座分離;及 一第一供力裝置(force-serving device),該第一供 力裝置機構地連接一連接部分,並且該連接部分固定於該 調校板,其中該第一供力裝置移動該連接部分以帶動該調 校板至該第一位置與該第二位置。1220461 6. Scope of patent application 1. A separate IC test stand for conducting electrical test of an IC component, the separate IC test stand includes: a calibration board, in a first position, in contact with a base For adjusting the position of the IC element, the adjusting plate has an opening for receiving the IC element, and is separated from the base when in a second position; and a first force-serving device ), The first power supply device is mechanically connected to a connection portion, and the connection portion is fixed to the adjustment board, wherein the first power supply device moves the connection portion to drive the adjustment plate to the first position and the Second position. 2. 如申請專利範圍第1項之分離式I C測試台,更包含一第 二供力裝置,該第一供力裝置機構地連接一測試部分,其 中當該調校板於該第二位置時,該第二供力裝置使得該測 試部分接觸且施加一壓力於該I C元件。 3. 如申請專利範圍第2項之分離式I C測試台,其中該壓力 使得該I C元件電性上接觸該底座。 4. 如申請專利範圍第1項之分離式I C測試台,更包含一支 架固定該第一供力裝置於該底座之上方。 5. 如申請專利範圍第1項之分離式I C測試台,其中該第一 供力裝置包含一氣壓缸。2. For example, the separate IC test bench of the scope of patent application, further includes a second power supply device, the first power supply device is mechanically connected to a test section, wherein when the adjustment board is in the second position The second power supply device makes the test part contact and apply a pressure to the IC component. 3. The separated IC test bench of item 2 of the patent application scope, wherein the pressure makes the IC component electrically contact the base. 4. For example, the separate IC test bench of the scope of patent application, further includes a bracket for fixing the first power supply device above the base. 5. The separated IC test bench of item 1 of the patent application scope, wherein the first power supply device includes a pneumatic cylinder. 第12頁 1220461Page 12 1220461 6 ·如申請專利範圍第1項之分離式I c測試台,其中該連接 部分包含一或多個連桿,該一或多個連桿之一端固定於1 調校板上,該一或多個連桿之另一端機構地連接該第二^ 7 · —種I C測试台’用以進行一 I c元件的電性測試,該I ◦測 試台包含: 一調校板(alignment plate)放置於一底座(base) 上,並且用以調校該i C元件的位置,該調校板具有一開口 用以容納該I C元件; 一第一供力裝置,該第一供力裝置機構地連接一連接 erf分,並且δ玄連接部分固定於該調校板,其中於進行電性 測試之河’該第一供力裝置移動該連接部分以帶動該調校 板與該I C元件分離;及 一第一供力裝置,該第二供力裝置機構地 (mechanical ly)連接一測試部分,其中當電性測試時,該 第二供力裝置使得該測試部分接觸且施加一壓力於該〗c元 件。 8 ·如申請專利範圍第7項之ιχ測試台,更包含一支架 (stand)用以固定該第二供力裝置於該底座之上方。 )·如申請專利範圍第8項之I C測試台,其中該第一供力裝 置置於该第二供力裝置之上方。6 · The separated type I c test bench according to item 1 of the patent application scope, wherein the connection part includes one or more connecting rods, and one end of the one or more connecting rods is fixed on the 1 adjustment board, the one or more The other end of the connecting rods is mechanically connected to the second ^ 7 type IC test bench for conducting electrical testing of an IC device. The test bench includes: an alignment plate On a base and used to adjust the position of the i C component, the adjustment plate has an opening for receiving the IC component; a first power supply device, the first power supply device is mechanically connected An erf point is connected, and a δ-xuan connection portion is fixed to the adjustment board, wherein the first power supply device moves the connection portion to drive the adjustment board to be separated from the IC component; and A first power supply device, the second power supply device is mechanically connected to a test portion, and when the electrical test is performed, the second power supply device makes the test portion contact and apply a pressure to the c element . 8. The test bench of item 7 in the scope of patent application, further comprising a stand for fixing the second power supply device above the base. ) If the IC test bench of item 8 of the patent application scope, wherein the first power supply device is placed above the second power supply device. 1220461 六、申請專利範圍 1 0 .如申請專利範圍第7項之I C測試台,其中該第一供力裝 置包含一氣壓缸。 11.如申請專利範圍第7項之I C測試台,其中該第二供力裝 置包含一氣壓缸。1220461 VI. Scope of patent application 10. The IC test bench of item 7 of the scope of patent application, wherein the first power supply device includes a pneumatic cylinder. 11. The IC test bench according to item 7 of the patent application scope, wherein the second power supply device comprises a pneumatic cylinder. 1 2.如申請專利範圍第7項之I C測試台,其中當電性測試完 畢後,該第二供力裝置更用以使得該測試部分與該I C元件 分離。 1 3.如申請專利範圍第7項之I C測試台,其中於一調校步驟 時,該第一供力裝置更用以將該調校板固定於該底座上。 1 4.如申請專利範圍第1 3項之I C測試台,其中該調校步驟 於電性測試之前進行。1 2. The IC test bench of item 7 of the scope of patent application, wherein the second power supply device is further used to separate the test part from the IC device after the electrical test is completed. 1 3. The IC test bench of item 7 in the scope of patent application, wherein the first power supply device is further used to fix the calibration board on the base during a calibration step. 1 4. The IC test bench of item 13 in the scope of patent application, wherein the adjustment step is performed before the electrical test. 1 5.如申請專利範圍第1 3項之I C測試台,其中於該調校步 驟後,該第二供力裝置使得該測試部分接觸且施加一壓力 於該I C元件。 1 6.如申請專利範圍第7項之I C測試台,其中該測試部分包 含一測試桿,該測試桿之一端用以連接該第二供力裝置, 該測試桿之另一端用以接觸該I C元件。1 5. The IC test bench of item 13 of the patent application scope, wherein after the adjustment step, the second power supply device makes the test part contact and apply a pressure to the IC device. 16. The IC test bench according to item 7 of the patent application scope, wherein the test part includes a test rod, one end of the test rod is used to connect the second power supply device, and the other end of the test rod is used to contact the IC element. 第14頁 1220461 六、申請專利範圍 1 7·如申請專利範圍第7項之IC測試台,1# Α ^ ^ 甲5亥連接部分句 含一或多個連桿,該一或多個連桿之一端因 77已 鵝回疋於該調校拓 上,該一或多個連桿之另一端機構地連接該第一供力裝置 〇 1 8 ·如申請專利範圍第7項之I C測試台,其中該底座更包含 一接觸(contact)用以接觸該調校板。 1 9 ·如申請專利範圍第7項之丨c測試台,其中該底座更包含 複數個測試接腳(P i n s )用以進行電性測試。 ·如_申請專利範圍第1 9項之I C測試台,其中該壓力使得 4 I C元件與該複數個測試接腳有電性上連接。Page 14 1220461 VI. Application for patent scope 1 7 · If the IC test bench for item 7 of the patent scope is applied, 1 # Α ^ ^ A 5 Hai connection part sentence contains one or more links, the one or more links One end has returned to the adjustment extension because of 77. The other end of the one or more connecting rods is mechanically connected to the first power supply device. 0 1 · If the IC test bench of item 7 of the patent application scope, The base further includes a contact for contacting the adjustment board. 19 · If the test bench of item 7 in the scope of patent application, the base further includes a plurality of test pins (P i n s) for electrical testing. · For example, the I C test bench for item 19 of the scope of patent application, wherein the pressure causes the 4 I C element to be electrically connected to the plurality of test pins. 第15頁Page 15
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