JPS6271577U - - Google Patents
Info
- Publication number
- JPS6271577U JPS6271577U JP16253985U JP16253985U JPS6271577U JP S6271577 U JPS6271577 U JP S6271577U JP 16253985 U JP16253985 U JP 16253985U JP 16253985 U JP16253985 U JP 16253985U JP S6271577 U JPS6271577 U JP S6271577U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- package
- lead terminal
- contact pins
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
第１図は本考案によるＩＣ検査用ソケツトの一
実施例の縦断面図、第２図Ａ及びＢは夫々上記実
施例のコンタクトピンとＩＣパツケージのリード
端子との接触状態を示す斜視図及び断面図、第３
図は従来例の縦断面図、第４図Ａ及びＢは夫々上
記従来例のコンタクトピンの一例とＩＣパツケー
ジのリード端子との接触状態を示す斜視図及び断
面図、第５図Ａ及びＢは夫々従来例のコンタクト
ピンの他の例とＩＣパツケージのリード端子との
接触状態を示す斜視図及び断面図である。
１……ソケツト本体、３……押え蓋、４……Ｉ
Ｃパツケージ、４ａ……リード端子、５……コン
タクトピン、６……単位コンタクトピン、６ａ…
…接触部。
FIG. 1 is a longitudinal sectional view of an embodiment of the IC testing socket according to the present invention, and FIGS. 2A and 2B are a perspective view and a sectional view, respectively, showing the state of contact between the contact pin of the above embodiment and the lead terminal of the IC package. , 3rd
The figure is a vertical sectional view of the conventional example, FIGS. 4A and 4B are a perspective view and a sectional view, respectively, showing the state of contact between an example of the contact pin of the conventional example and the lead terminal of the IC package, and FIGS. 5A and B are FIG. 7 is a perspective view and a cross-sectional view, respectively, showing a contact state between another example of a conventional contact pin and a lead terminal of an IC package. 1... Socket body, 3... Presser cover, 4... I
C package, 4a...Lead terminal, 5...Contact pin, 6...Unit contact pin, 6a...
...Contact part.
Claims (1)
タクトピンにＩＣパツケージのリード端子を接触
させ、ＩＣパツケージを押え蓋により押圧するこ
とにより前記接触状態が保持されるようにしたＩ
Ｃ検査用ソケツトにおいて、ピツチ方向の厚さが
薄い単位コンタクトピンを複数個並設することよ
り各一個のコンタクトピンを形成するようにした
ことを特徴とするＩＣ検査用ソケツト。 A lead terminal of an IC package is brought into contact with a plurality of contact pins aligned and fixed in a socket body, and the contact state is maintained by pressing the IC package with a holding lid.
C. An IC testing socket characterized in that each contact pin is formed by arranging a plurality of unit contact pins that are thin in the pitch direction in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985162539U JPH0442782Y2 (en) | 1985-10-23 | 1985-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985162539U JPH0442782Y2 (en) | 1985-10-23 | 1985-10-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6271577U true JPS6271577U (en) | 1987-05-07 |
| JPH0442782Y2 JPH0442782Y2 (en) | 1992-10-09 |
Family
ID=31089895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985162539U Expired JPH0442782Y2 (en) | 1985-10-23 | 1985-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442782Y2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63307678A (en) * | 1987-06-09 | 1988-12-15 | Texas Instr Japan Ltd | Socket |
| KR100583448B1 (en) * | 2001-03-29 | 2006-05-24 | 군세이 기모토 | Probe pin assembly |
| JP2011122942A (en) * | 2009-12-10 | 2011-06-23 | Micronics Japan Co Ltd | Probe device |
| JP2011181194A (en) * | 2010-02-26 | 2011-09-15 | Chichibu Fuji Co Ltd | Measuring terminal and method of manufacturing the same |
| JP2014085347A (en) * | 2012-10-24 | 2014-05-12 | Multitest Elektronische Systeme Gmbh | Contact spring for inspection socket for high current inspection of electronic component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826442U (en) * | 1971-08-02 | 1973-03-30 | ||
| JPS59146955U (en) * | 1983-03-22 | 1984-10-01 | 山一電機工業株式会社 | Connector with connected device body removal device |
-
1985
- 1985-10-23 JP JP1985162539U patent/JPH0442782Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4826442U (en) * | 1971-08-02 | 1973-03-30 | ||
| JPS59146955U (en) * | 1983-03-22 | 1984-10-01 | 山一電機工業株式会社 | Connector with connected device body removal device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63307678A (en) * | 1987-06-09 | 1988-12-15 | Texas Instr Japan Ltd | Socket |
| KR100583448B1 (en) * | 2001-03-29 | 2006-05-24 | 군세이 기모토 | Probe pin assembly |
| JP2011122942A (en) * | 2009-12-10 | 2011-06-23 | Micronics Japan Co Ltd | Probe device |
| JP2011181194A (en) * | 2010-02-26 | 2011-09-15 | Chichibu Fuji Co Ltd | Measuring terminal and method of manufacturing the same |
| JP2014085347A (en) * | 2012-10-24 | 2014-05-12 | Multitest Elektronische Systeme Gmbh | Contact spring for inspection socket for high current inspection of electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442782Y2 (en) | 1992-10-09 |