JPH0329901Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to the structure of an IC socket suitable for testing flat type IC packages.

[Conventional technology]

Conventionally, in a test IC socket for a flat type IC package, as shown in FIGS. 5 and 6, a contact pin 4 to be connected to a lead P ₁ of an IC package P to be mounted is placed on a substrate 1. are arranged in a row, and when the IC package P is loaded (Fig. 6), each lead _P1 is pressed by a pad 6 formed on the holding plate 2 of the IC socket, so that it connects with the corresponding contact pin 4. It is configured so that it can be connected to Also known as this type of IC socket is one described in Japanese Utility Model Application Publication No. 44786/1986.

[Problem to be solved by the invention] Generally speaking, the lead tips _P2 of the IC package P are inclined at about 10 degrees with respect to the surface of the IC package P in order to facilitate soldering to a wiring board, etc. (See Figure 7). However, in the conventional IC socket, as shown in FIG. 7, the contact portion 5 of the contact pin 4 and the tip end surface of the pad 6 are both formed to be parallel to the substrate surface, that is, to form a horizontal flat surface. has been done. Therefore, when the IC package P is placed in a predetermined position in the IC socket, the lead tip _P2 forms an angle of about 10 degrees with respect to the contact surface of the tip of the contact pin 4. Therefore, IC package P is required.
When loading the IC package into the socket, the IC package P is first stored in the socket and the rear presser plate 2 is closed, resulting in the state shown in Figure 8, and the lead _P1 moves from the position shown by the solid line in Figure 9 to the position shown by the dotted line. It will be changed to the position shown. This means that undesirable stress is generated within the IC package P. From a further condition
When the IC package P reaches the fully loaded state, the lead tip _P2 is deformed so that the inclination angle becomes zero as shown in FIG. 10, and in this case, the pressing force of the pad 6 is released. As shown in FIG. 11, lead P ₁ suffers from permanent distortion and can no longer return to its original shape with the above-mentioned inclination angle.
As a result, there were problems such as failure of soldering during mounting of the IC package P, and even damage to the IC package P.

In view of these circumstances, it is an object of the present invention to provide an IC socket in which the inclination angle of the tip of the lead can be maintained and proper contact with the contact pin can be made when an IC package is loaded.

[Means and actions for solving problems]

In the IC socket according to the present invention, the contact surface of the upper end of the contact pin with the lead is formed to be inclined with respect to the surface of the IC package at the loading position so as to match the inclination angle of the lead, and the lead is pressed. The lower end pressing surface of the pad for bringing the pad into contact with the contact pin is formed so as to be parallel to the contact surface of the contact pin at the pressing position of the pad. Therefore, when the IC package is placed in a predetermined position in the IC socket and the rear leads are pressed by the pads, the angles of inclination of the contact surfaces of the contact pins, leads, and pads match, so that the angle of inclination of the lead tips decreases. is maintained in its original shape, and electrical connections between each lead and contact pin can be made accurately.

〔Example〕

Hereinafter, based on Figures 1 to 4, the invention will be explained.
To explain one embodiment of the IC socket, in the figure, 1
2 is a base of the socket, 2 is a holding plate pivotably attached to the base 1 so that it can be opened and closed, and 3 is a locking member that engages with the holding plate 2 to maintain the fully loaded state of the IC package P (Fig. 1). , 4 are contact pins arranged in rows on the board 1 corresponding to the leads P ₁ to be connected, 5
is a lead formed on one end of contact pin 4.
In the contact portion for P ₁ , 5a is a contact surface inclined to match the inclination angle of the lead tip P ₁ (for example, about 10°), 5b is a contact surface formed symmetrically with the contact surface 5a, and 6 is a contact surface This is a pad that is inclined so that a pressing surface 6a that projects from the holding plate 2 and faces the lead tip _P1 is parallel to the contact surface 5a of the contact pin 4.

Since the IC socket of the present invention is constructed as described above, when the rear holding plate 2 is closed after the IC package P is stored in a predetermined position within the socket,
The pad 6 presses the lead tip _P2 , but in this case, the contact surface 5a and the pressing surface 6a are connected to the lead tip P2.
Since the lead tip P ₂ is inclined to almost the same degree as P 2 , the lead tip P ₂ is pressed down by a certain amount while being in contact with the contact surface 5 a without being deformed and being sandwiched between the pressing surface 6 a and the lead end P 2 . After that, the IC package P is locked by locking the holding plate 2 with the locking member 3.
loading is complete. When the IC package P is fully loaded, the lead P ₁ is connected to the contact pin 4.
Due to its elasticity, it comes into contact with this with a moderate and uniform pressure contact force, and the electrical connection between the two is reliably established.
Further, in this state, the lead P ₁ is not deformed, so even if the presser plate 2 is opened and the pressure by the pad 6 is released, the lead P ₁ remains in its original shape. As is clear from the above description, as shown in FIG. 3, for example, the inclination angle θ of the lead tip _P2 is equal to the inclination angle of the contact surface 5a, for example (about 10 degrees).
Even if the tip is smaller, the tip _P2 is deformed to follow the inclination of the contact surface 5a by being pressed by the pad 6, so when the pressure of the pad 6 is released, the tip is at the standard inclination angle. It is transformed so that it holds. Furthermore, the lead tip
Even when the inclination angle θ of P ₂ is zero, a standard inclination angle is given in the same manner as above. During correction in these cases, the bent portion of the tip _P2 comes into contact with the contact surface of the contact pin in advance, and only the free end side is bent, so that no adverse effects are caused inside the IC package. In this way, since the lead tip _P2 of the IC package P taken out from the IC socket of the present invention is always given a predetermined angle of inclination, the solder of the lead P1 is removed when the package P is mounted on a wiring board, _etc. Attachment can be performed reliably and easily.

Since the contact surfaces 5a and 5b are formed symmetrically, for example, as shown in _FIG . The same effect can be obtained. Therefore, the curved portion 4a of the contact pin 4
It is also possible to arrange one side of the contact pins 4 in a row so as to be located inside the IC socket body, and by doing so, the socket body can be made more compact. Further, the inclination angles of the contact surfaces 5a, 5b and the pressing surface 6a are not limited to those of the above embodiment, but may be changed as necessary.

[Effect of idea]

As mentioned above, the IC socket according to the present invention
When the IC package is loaded, it is possible to achieve a reliable electrical connection between each lead and the contact pin, and it has extremely excellent practical advantages, such as being able to easily and precisely solder the IC package when mounting it.

[Brief explanation of the drawing]

Figures 1 to 4 show an embodiment of the IC socket of the present invention, with Figure 1 being a longitudinal cross-sectional view of the IC package loaded, and Figure 2 being a portion showing the state of contact between the leads and contact pins. 3 is a partial cross-sectional view showing the relationship between the inclination angles of leads and contact pins; FIG. 4 is an explanatory view showing a different arrangement of contact pins from that shown in FIG. 1; FIGS. 5 to 11 shows an example of a conventional IC socket,
Fig. 5 is a plan view, Fig. 6 is a cross-sectional view, Fig. 7 is a partial sectional view showing the relationship between the tip of the lead and the contact part of the contact pin, and Fig. 8 is the state when the holding plate of the socket is closed. FIG. 9 is a partial side view showing the deformed state of the lead, and FIG. 10 shows the contact state between the lead and the contact pin when the IC package is completely loaded into the socket. FIG. 11 is a partial sectional view showing a deformed lead. 1... Board, 2... Holding plate, 3... Locking member,
4...Contact pin, 5...Contact part, 5a, 5
b...Contact surface, 6...Pad, 6a...Press surface.

Claims (1)

[Scope of utility model registration request] The upper end contact surface of the contact pin that comes into contact with the lead of the IC package is formed to be inclined with respect to the surface of the package at the loading position, and the lower end pressing surface of the pad that presses the lead is located above the surface of the pad at the pressing position. For flat type IC packages that are formed parallel to the contact surface.
IC socket.