JPS60194347U - lead pin - Google Patents
lead pinInfo
- Publication number
- JPS60194347U JPS60194347U JP8208884U JP8208884U JPS60194347U JP S60194347 U JPS60194347 U JP S60194347U JP 8208884 U JP8208884 U JP 8208884U JP 8208884 U JP8208884 U JP 8208884U JP S60194347 U JPS60194347 U JP S60194347U
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- lead
- package
- head
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案に係るリードピンの１実施例を委したも
ので、第２図は第１図におけるロウ片を嵌着する前のリ
ードピン本体を、第３図は該リードビンをセラミック基
板に挿入しロウ付は処理をした状態を、又、第４図は本
考案に係るリードピンの他の形態を表わしたものである
。さらに第５図は刃−ドピンとリードパターンとの他の
接合構成であり、第５図の接合構成とした場合のリード
ビンは第６図に示したものである。
１・・・・・・リードピン、２・・・・・・リードピン
本体、３．９，１１・・・・・・ロウ片、４・・・・・
・頭部、５・・・・・・脚部、６・・・・・・凹部、７
・・・・・・セラミック基板、８・・・・・・リードパ
ターン、１０・・・・・・凸部。Figure 1 shows one embodiment of the lead pin according to the present invention, Figure 2 shows the lead pin body before fitting the solder piece in Figure 1, and Figure 3 shows the lead pin inserted into the ceramic substrate. The soldered state is shown in the processed state, and FIG. 4 shows another form of the lead pin according to the present invention. Furthermore, FIG. 5 shows another joining structure between the blade-doping pin and the lead pattern, and the lead bin in the case of the joining structure shown in FIG. 5 is as shown in FIG. 6. 1... Lead pin, 2... Lead pin body, 3.9, 11... Brazing piece, 4...
・Head, 5... Legs, 6... Concavity, 7
. . . Ceramic substrate, 8 . . . Lead pattern, 10 . . . Convex portion.
Claims (3)
を形成する際の該パッケージ内部のリードパターンとの
接続加工に適用するリードピンにおいて、該リードピン
頭部にブロック体を成すロウ片を嵌着したことを特徴と
するＩＣパッケージ用リードピン。(1) When forming a plug-in type package for a semiconductor IC, etc., a lead pin used for connection processing with a lead pattern inside the package has a wax piece forming a block fitted to the head of the lead pin. Characteristic lead pins for IC packages.
凹部に嵌着した実用新案登録請求の範囲第１項記載のＩ
Ｃパッケージ用リードピン。(2) I according to claim 1 of the utility model registration claim, in which a recess is formed on the upper surface of the head, and a columnar wax piece is fitted into the recess.
Lead pin for C package.
を該凸部に嵌着した実用新案登録請求の範囲第１項記載
のＩＣパッケージ用リードピン。(3) The lead pin for an IC package according to claim 1, wherein a convex portion is formed on the upper surface of the head, and a ring-shaped solder piece is fitted into the convex portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8208884U JPS60194347U (en) | 1984-06-01 | 1984-06-01 | lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8208884U JPS60194347U (en) | 1984-06-01 | 1984-06-01 | lead pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60194347U true JPS60194347U (en) | 1985-12-24 |
Family
ID=30629489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8208884U Pending JPS60194347U (en) | 1984-06-01 | 1984-06-01 | lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60194347U (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57197843A (en) * | 1981-05-29 | 1982-12-04 | Tanaka Kikinzoku Kogyo Kk | Lead pin for integrated circuit device |
| JPS583255A (en) * | 1981-06-30 | 1983-01-10 | Tanaka Kikinzoku Kogyo Kk | Lead pin for integrated circuit device |
| JPS5833863A (en) * | 1981-08-25 | 1983-02-28 | Tanaka Kikinzoku Kogyo Kk | Integrated circuit device |
| JPS5886754A (en) * | 1981-11-19 | 1983-05-24 | Tanaka Kikinzoku Kogyo Kk | Lead pin for integrated circuit device |
-
1984
- 1984-06-01 JP JP8208884U patent/JPS60194347U/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57197843A (en) * | 1981-05-29 | 1982-12-04 | Tanaka Kikinzoku Kogyo Kk | Lead pin for integrated circuit device |
| JPS583255A (en) * | 1981-06-30 | 1983-01-10 | Tanaka Kikinzoku Kogyo Kk | Lead pin for integrated circuit device |
| JPS5833863A (en) * | 1981-08-25 | 1983-02-28 | Tanaka Kikinzoku Kogyo Kk | Integrated circuit device |
| JPS5886754A (en) * | 1981-11-19 | 1983-05-24 | Tanaka Kikinzoku Kogyo Kk | Lead pin for integrated circuit device |
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