JPS6189681A - 電界効果トランジスタの製造方法 - Google Patents
電界効果トランジスタの製造方法Info
- Publication number
- JPS6189681A JPS6189681A JP59211878A JP21187884A JPS6189681A JP S6189681 A JPS6189681 A JP S6189681A JP 59211878 A JP59211878 A JP 59211878A JP 21187884 A JP21187884 A JP 21187884A JP S6189681 A JPS6189681 A JP S6189681A
- Authority
- JP
- Japan
- Prior art keywords
- film
- pattern
- recess
- opening
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/80—FETs having rectifying junction gate electrodes
- H10D30/87—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET]
- H10D30/877—FETs having Schottky gate electrodes, e.g. metal-semiconductor FETs [MESFET] having recessed gate electrodes
Landscapes
- Junction Field-Effect Transistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59211878A JPS6189681A (ja) | 1984-10-08 | 1984-10-08 | 電界効果トランジスタの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59211878A JPS6189681A (ja) | 1984-10-08 | 1984-10-08 | 電界効果トランジスタの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6189681A true JPS6189681A (ja) | 1986-05-07 |
JPH0156533B2 JPH0156533B2 (enrdf_load_stackoverflow) | 1989-11-30 |
Family
ID=16613113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59211878A Granted JPS6189681A (ja) | 1984-10-08 | 1984-10-08 | 電界効果トランジスタの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6189681A (enrdf_load_stackoverflow) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2633100A1 (fr) * | 1988-06-20 | 1989-12-22 | Mitsubishi Electric Corp | Transistor a effet de champ et procede de fabrication |
JPH02140942A (ja) * | 1988-11-22 | 1990-05-30 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPH02142143A (ja) * | 1988-11-22 | 1990-05-31 | Nec Corp | 電界効果トランジスタの製造方法 |
US5139968A (en) * | 1989-03-03 | 1992-08-18 | Mitsubishi Denki Kabushiki Kaisha | Method of producing a t-shaped gate electrode |
US5270228A (en) * | 1991-02-14 | 1993-12-14 | Mitsubishi Denki Kabushiki Kaisha | Method of fabricating gate electrode in recess |
EP0696053A1 (fr) | 1994-06-29 | 1996-02-07 | Laboratoires D'electronique Philips | Procédé de réalisation d'un transistor à effet de champ à canal creusé |
JP2008032271A (ja) * | 2006-07-26 | 2008-02-14 | Fulta Electric Machinery Co Ltd | エアブロー装置の放熱機構 |
US9310136B2 (en) | 2008-12-17 | 2016-04-12 | Swep International Ab | Port opening of heat exchanger |
-
1984
- 1984-10-08 JP JP59211878A patent/JPS6189681A/ja active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2633100A1 (fr) * | 1988-06-20 | 1989-12-22 | Mitsubishi Electric Corp | Transistor a effet de champ et procede de fabrication |
US5362677A (en) * | 1988-06-20 | 1994-11-08 | Mitsubishi Denki Kabushiki Kaisha | Method for producing a field effect transistor with a gate recess structure |
JPH02140942A (ja) * | 1988-11-22 | 1990-05-30 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPH02142143A (ja) * | 1988-11-22 | 1990-05-31 | Nec Corp | 電界効果トランジスタの製造方法 |
US5139968A (en) * | 1989-03-03 | 1992-08-18 | Mitsubishi Denki Kabushiki Kaisha | Method of producing a t-shaped gate electrode |
US5270228A (en) * | 1991-02-14 | 1993-12-14 | Mitsubishi Denki Kabushiki Kaisha | Method of fabricating gate electrode in recess |
EP0696053A1 (fr) | 1994-06-29 | 1996-02-07 | Laboratoires D'electronique Philips | Procédé de réalisation d'un transistor à effet de champ à canal creusé |
US5643807A (en) * | 1994-06-29 | 1997-07-01 | U.S. Philips Corporation | Method of manufacturing a semiconductor device comprising a buried channel field effect transistor |
JP2008032271A (ja) * | 2006-07-26 | 2008-02-14 | Fulta Electric Machinery Co Ltd | エアブロー装置の放熱機構 |
US9310136B2 (en) | 2008-12-17 | 2016-04-12 | Swep International Ab | Port opening of heat exchanger |
Also Published As
Publication number | Publication date |
---|---|
JPH0156533B2 (enrdf_load_stackoverflow) | 1989-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6189681A (ja) | 電界効果トランジスタの製造方法 | |
US4902646A (en) | MESFET process employing dummy electrodes and resist reflow | |
US4411929A (en) | Method for manufacturing semiconductor device | |
EP0120614B1 (en) | Method of manufacturing a semiconductor device having isolation regions | |
JP2518402B2 (ja) | 半導体装置の製造方法 | |
JPS58105571A (ja) | 半導体素子の製造方法 | |
JPH06151852A (ja) | 薄膜トランジスタ | |
JP2754202B2 (ja) | 半導体素子の製造方法 | |
JPH04206775A (ja) | 薄膜トランジスタ | |
KR0150684B1 (ko) | 다중웰을 갖는 반도체소자 제조방법 | |
JPH0653519A (ja) | 半導体不揮発性メモリおよびその製造方法 | |
JPS6024009A (ja) | 半導体の不純物領域形成方法 | |
JPH0389532A (ja) | 半導体装置の製造方法 | |
JP2590467B2 (ja) | 選択的熱酸化方法 | |
KR100253344B1 (ko) | 반도체 메모리의 콘택홀 형성방법 | |
JPH05291293A (ja) | 薄膜トランジスタの製造方法 | |
JPH01105543A (ja) | 半導体装置の製造方法 | |
JPS58207676A (ja) | 半導体装置の製造方法 | |
JPS61245574A (ja) | 集積回路のゲ−ト製造方法 | |
JPS62130525A (ja) | 半導体集積回路の製法 | |
JPH07161627A (ja) | アライメントマークの形成方法 | |
JPS6049677A (ja) | 電界効果トランジスタの製造方法 | |
JPH0697129A (ja) | 半導体装置の製造方法 | |
JPH07245339A (ja) | 半導体装置およびその製造方法 | |
JPS63274178A (ja) | 半導体素子の製造方法 |