JPS6186923U - - Google Patents
Info
- Publication number
- JPS6186923U JPS6186923U JP17248384U JP17248384U JPS6186923U JP S6186923 U JPS6186923 U JP S6186923U JP 17248384 U JP17248384 U JP 17248384U JP 17248384 U JP17248384 U JP 17248384U JP S6186923 U JPS6186923 U JP S6186923U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic components
- heater
- thin film
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
- Physical Vapour Deposition (AREA)
- Thin Magnetic Films (AREA)
Description
第１図はこの考案の一実施例による電子部品用
基板を示す斜視図、第２図はこの考案の一実施例
による電子部品用基板を薄膜形成用真空装置の電
極に取付けた状態を示す断面説明図、第３図は従
来の真空装置に電子部品用基板を真空装置に取付
けた説明図、第４図〜第７図はこの考案の他の実
施例を示す説明図である。
図において、４は基板、３０はヒーター、３１
は端子。なお図中、同一符号は同一、又は相当部
分を示す。
FIG. 1 is a perspective view showing a substrate for electronic components according to an embodiment of this invention, and FIG. 2 is a cross-sectional view showing a state in which the substrate for electronic components according to an embodiment of this invention is attached to an electrode of a vacuum device for forming a thin film. FIG. 3 is an explanatory view of a conventional vacuum apparatus in which an electronic component board is attached to the vacuum apparatus, and FIGS. 4 to 7 are explanatory views showing other embodiments of this invention. In the figure, 4 is a substrate, 30 is a heater, 31
is a terminal. In the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
程を必要とする電子部品用基板において、その基
板の内部または外表面に自己加熱用のヒーターと
このヒーターに電流を流すための端子とを有する
ことを特徴とする電子部品用基板。 A substrate for electronic components that requires a manufacturing process in which a thin film is formed on its surface in a vacuum, and has a heater for self-heating and a terminal for passing current to the heater on the inside or outside of the substrate. A substrate for electronic components characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17248384U JPS6186923U (en) | 1984-11-14 | 1984-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17248384U JPS6186923U (en) | 1984-11-14 | 1984-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6186923U true JPS6186923U (en) | 1986-06-07 |
Family
ID=30730146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17248384U Pending JPS6186923U (en) | 1984-11-14 | 1984-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6186923U (en) |
-
1984
- 1984-11-14 JP JP17248384U patent/JPS6186923U/ja active Pending
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