JPS6186068A - プリント基板把持具保持機構 - Google Patents

プリント基板把持具保持機構

Info

Publication number
JPS6186068A
JPS6186068A JP20866884A JP20866884A JPS6186068A JP S6186068 A JPS6186068 A JP S6186068A JP 20866884 A JP20866884 A JP 20866884A JP 20866884 A JP20866884 A JP 20866884A JP S6186068 A JPS6186068 A JP S6186068A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
shaft
soldering
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20866884A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0156866B2 (enrdf_load_stackoverflow
Inventor
Teruyuki Shibata
柴田　輝幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP20866884A priority Critical patent/JPS6186068A/ja
Publication of JPS6186068A publication Critical patent/JPS6186068A/ja
Publication of JPH0156866B2 publication Critical patent/JPH0156866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP20866884A 1984-10-04 1984-10-04 プリント基板把持具保持機構 Granted JPS6186068A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20866884A JPS6186068A (ja) 1984-10-04 1984-10-04 プリント基板把持具保持機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20866884A JPS6186068A (ja) 1984-10-04 1984-10-04 プリント基板把持具保持機構

Publications (2)

Publication Number Publication Date
JPS6186068A true JPS6186068A (ja) 1986-05-01
JPH0156866B2 JPH0156866B2 (enrdf_load_stackoverflow) 1989-12-01

Family

ID=16560072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20866884A Granted JPS6186068A (ja) 1984-10-04 1984-10-04 プリント基板把持具保持機構

Country Status (1)

Country Link
JP (1) JPS6186068A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103200781A (zh) * 2013-04-16 2013-07-10 中国电子科技集团公司第二十研究所 一种smd器件的印焊膏装置
CN106385773A (zh) * 2016-10-27 2017-02-08 江门市众能电控科技有限公司 一种电路板的自动浸锡设备及工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103200781A (zh) * 2013-04-16 2013-07-10 中国电子科技集团公司第二十研究所 一种smd器件的印焊膏装置
CN106385773A (zh) * 2016-10-27 2017-02-08 江门市众能电控科技有限公司 一种电路板的自动浸锡设备及工艺

Also Published As

Publication number Publication date
JPH0156866B2 (enrdf_load_stackoverflow) 1989-12-01

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