JPS6178591A - 銀ろう材 - Google Patents
銀ろう材Info
- Publication number
- JPS6178591A JPS6178591A JP19861384A JP19861384A JPS6178591A JP S6178591 A JPS6178591 A JP S6178591A JP 19861384 A JP19861384 A JP 19861384A JP 19861384 A JP19861384 A JP 19861384A JP S6178591 A JPS6178591 A JP S6178591A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- silver brazing
- brazing material
- melting point
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 6
- 239000000463 material Substances 0.000 title claims description 6
- 229910052709 silver Inorganic materials 0.000 title claims description 6
- 239000004332 silver Substances 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- 229910017942 Ag—Ge Inorganic materials 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 229910000733 Li alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000001989 lithium alloy Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Contacts (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19861384A JPS6178591A (ja) | 1984-09-25 | 1984-09-25 | 銀ろう材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19861384A JPS6178591A (ja) | 1984-09-25 | 1984-09-25 | 銀ろう材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6178591A true JPS6178591A (ja) | 1986-04-22 |
JPH0436799B2 JPH0436799B2 (enrdf_load_stackoverflow) | 1992-06-17 |
Family
ID=16394099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19861384A Granted JPS6178591A (ja) | 1984-09-25 | 1984-09-25 | 銀ろう材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6178591A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100617398B1 (ko) * | 2005-09-02 | 2006-09-01 | 최진수 | 세륨을 함유한 인동합금 경납땜봉 |
SG135164A1 (en) * | 2006-03-03 | 2007-09-28 | Electroplating Eng | Electronic part |
-
1984
- 1984-09-25 JP JP19861384A patent/JPS6178591A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100617398B1 (ko) * | 2005-09-02 | 2006-09-01 | 최진수 | 세륨을 함유한 인동합금 경납땜봉 |
SG135164A1 (en) * | 2006-03-03 | 2007-09-28 | Electroplating Eng | Electronic part |
Also Published As
Publication number | Publication date |
---|---|
JPH0436799B2 (enrdf_load_stackoverflow) | 1992-06-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2885773B2 (ja) | 半田付け用無鉛合金 | |
JP2000094181A (ja) | はんだ合金組成物 | |
CA2340393A1 (en) | Lead-free solder | |
WO1999048639A1 (fr) | Soudure sans plomb | |
JP2807008B2 (ja) | 熱疲労特性に優れたPb合金ろう | |
EP3707285B1 (en) | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications | |
US4447391A (en) | Brazing alloy containing reactive metals, precious metals, boron and nickel | |
US6361626B1 (en) | Solder alloy and soldered bond | |
JP3064042B2 (ja) | 銀ロウ材 | |
KR20040073275A (ko) | 땜납 합금 및 땜납 접합부 | |
US3070875A (en) | Novel brazing alloy and structures produced therewith | |
EP0135603A1 (en) | Ductile low temperature brazing alloy | |
Mahidhara et al. | Deformation and fracture behavior of Sn-5% Sb solder | |
JPS6178591A (ja) | 銀ろう材 | |
CN113385853A (zh) | 一种低银高可靠无铅软钎料及其制备方法、应用 | |
JPS6247117B2 (enrdf_load_stackoverflow) | ||
EP3707286B1 (en) | High reliability lead-free solder alloy for electronic applications in extreme environments | |
JPS6218275B2 (enrdf_load_stackoverflow) | ||
JPS61242787A (ja) | 銀ろう材 | |
JP2001047276A (ja) | はんだ材料 | |
JPS6178590A (ja) | 銀ろう材 | |
JPS6178592A (ja) | 銀ろう材 | |
JP2667691B2 (ja) | 低融点Agはんだ | |
JP3501700B2 (ja) | 銅くわれ防止無鉛はんだ | |
JPS6218276B2 (enrdf_load_stackoverflow) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |