JPS6177155A - Manufacturing device for thin film of laminate structure - Google Patents

Manufacturing device for thin film of laminate structure

Info

Publication number
JPS6177155A
JPS6177155A JP20136085A JP20136085A JPS6177155A JP S6177155 A JPS6177155 A JP S6177155A JP 20136085 A JP20136085 A JP 20136085A JP 20136085 A JP20136085 A JP 20136085A JP S6177155 A JPS6177155 A JP S6177155A
Authority
JP
Japan
Prior art keywords
sputtering
sputtered
thin film
base
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20136085A
Other languages
Japanese (ja)
Other versions
JPH0532817B2 (en
Inventor
Noboru Sato
昇 佐藤
Fuji Tanaka
富士 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP20136085A priority Critical patent/JPS6177155A/en
Publication of JPS6177155A publication Critical patent/JPS6177155A/en
Publication of JPH0532817B2 publication Critical patent/JPH0532817B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/10Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field
    • G11B11/105Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by magnetic means or other means for magnetisation or demagnetisation of a record carrier, e.g. light induced spin magnetisation; Demagnetisation by thermal or stress means in the presence or not of an orienting magnetic field using a beam of light or a magnetic field for recording by change of magnetisation and a beam of light for reproducing, i.e. magneto-optical, e.g. light-induced thermomagnetic recording, spin magnetisation recording, Kerr or Faraday effect reproducing

Abstract

PURPOSE:To hold superior characteristics uniformly at respective parts by providing a mask which controls the transmission of a flying sputter material between a sputter source and a base body to be sputtered, and increasing opening width from the center axis side to outer peripheries. CONSTITUTION:Opening 14 and 15 which spread outward in the direction of a straight line (x) running in the centers of targets 10 and 11 are bored in the mask 9 at parts corresponding to the targets 10 and 11; while a base 6 is not in motion, rare earth metal from the target 10 at a different part of a base body 1 is sputtered and transition metal from the other target 11 is sputtered to the other half part. Then while the base 6 is rotated, the targets 10 and 11 are connected to a negative electrode to perform DC sputtering. A thin film 5 is deposited on and adhered to the base body 1 and a Tb layer 2 and an Fe layer 3 are laminated alternately and repeatedly. Consequently, the thin film of the structure of periodic lamination is manufactured, and this is applied for, for example, the manufacture of a photomagnetic recording medium, thereby manufacturing the medium having good characteristics.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えば書き換え可能な光磁気ディスクに適用
する光磁気記録媒体の作製に用いられる積層構造の¥!
I膜の作製装置に係わる。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention is directed to a multilayer structure used for producing a magneto-optical recording medium applied to, for example, a rewritable magneto-optical disk.
This relates to I film production equipment.

〔発明の概要〕[Summary of the invention]

本発明は複数のスパッタ源を同一円周上に配置してこれ
に対して被スパッタリング基体を回転させつつそのスパ
ッタリングを行って、各スパッタ源からのスパッタ材に
よる極薄の各薄膜層の積層構造による薄膜を得ることが
できるようにするものである。
In the present invention, a plurality of sputtering sources are arranged on the same circumference, and the substrate to be sputtered is rotated relative to the sputtering sources while sputtering is performed, thereby forming a laminated structure of ultra-thin thin film layers using sputtering materials from each sputtering source. This makes it possible to obtain a thin film based on the method.

〔従来の技術〕[Conventional technology]

レーザー光、例えば半導体レーザー光により書き込み、
読み出しを行うことができ書き換え可能な光磁気ディス
クとして、希土類金属と遷移金属とのアモルファス(非
晶質)合金によるものが提案されている。このような光
磁気ディスク、すなわち光磁気記録媒体を得る方法とし
ては、スパッタリング法がある。この場合のスパッタリ
ングは、1つのスパッタ源からなされる。すなわち、そ
のスパッタ源、すなわちターゲットは、遷移金属ターゲ
ット上に希土類金属のベレット(細片)を載せた構成と
し、これら金属を同時に基体上にスバツタリングすると
いう方法がとられる。このようにして得た光磁気記録媒
体の磁化曲線(磁化の強さM−磁場の強さH曲線)は、
第3図に示すようにそのヒステリシス特性の角型が悪い
。したがって、この場合、何らかの理由で、記録済みの
媒体に外部磁界が与えられた場合などにおいて媒体上の
記録が劣化しS/Nを低めてしまうなどの問題点がある
。また、このような方法による場合、記録媒体の全域に
亘って一様のスパッタリング、したがって一様の磁気特
性を有するものが得難いという問題点がある。
Writing with laser light, for example semiconductor laser light,
As a readable and rewritable magneto-optical disk, one made of an amorphous alloy of a rare earth metal and a transition metal has been proposed. As a method for obtaining such a magneto-optical disk, ie, a magneto-optical recording medium, there is a sputtering method. Sputtering in this case is done from one sputtering source. That is, the sputtering source, that is, the target, has a structure in which a rare earth metal pellet is placed on a transition metal target, and these metals are simultaneously sputtered onto the substrate. The magnetization curve (magnetization strength M - magnetic field strength H curve) of the magneto-optical recording medium obtained in this way is:
As shown in FIG. 3, the hysteresis characteristics are poor in squareness. Therefore, in this case, there is a problem that when an external magnetic field is applied to a recorded medium for some reason, the recording on the medium deteriorates and the S/N ratio decreases. Further, when using such a method, there is a problem in that it is difficult to obtain uniform sputtering over the entire area of the recording medium, and thus it is difficult to obtain a recording medium having uniform magnetic properties.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明は上述した諸欠点を解消し、各部一様にすぐれた
特性を有する光磁気記録媒体を得ることのできる積層構
造の薄膜の作製装置を提供するものである。
The present invention solves the above-mentioned drawbacks and provides an apparatus for producing a thin film having a laminated structure, which makes it possible to obtain a magneto-optical recording medium having uniformly excellent characteristics in each part.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、複数のスパッタ源を同一円周上に配置し、こ
れらスパッタ源の配置された円周の中心軸0−0′を中
心として被スパッタリング基体を回転させ、スパッタ源
と上記被スパッタリング基体との間には夫々被スパッタ
リング基体に対して各スパッタ源よりの飛翔スバ・ツタ
材の透過開口を有し夫々のスパッタ領域を規制するマス
クを設はマスクの各開口はその開口幅が中心軸0−0′
側から外周方向に向って広がる形状に選定する。
In the present invention, a plurality of sputtering sources are arranged on the same circumference, a substrate to be sputtered is rotated about a central axis 0-0' of the circumference on which these sputtering sources are arranged, and the sputtering sources and the substrate to be sputtered are A mask is provided between the two substrates, each having apertures for transmitting the sputtering sputtering material from each sputtering source to the substrate to be sputtered, and regulating the respective sputtering areas. 0-0'
Select a shape that spreads from the side toward the outer circumference.

(作用〕 本発明装置によれば、複数のスバ・ツタ源を設けて基体
(1)の回転によってスパッタを行う基体(1)上に各
スパッタ源からのスパッタ材が交互に積層される。そし
て、そのスパッタ条件の選定、例えば基体(1)の回転
速度、マスク開口幅、印加電圧等の選定によって極薄の
各材料例えば各構成元素層を周期的に積層して成る超格
子構造のアモルファス薄膜を作製できる。
(Function) According to the apparatus of the present invention, sputtering materials from each sputtering source are alternately laminated on the substrate (1) where a plurality of sputtering sources are provided and sputtering is performed by rotating the substrate (1). By selecting the sputtering conditions, such as the rotational speed of the substrate (1), the width of the mask opening, and the applied voltage, an amorphous thin film with a superlattice structure is formed by periodically laminating ultrathin materials such as layers of each constituent element. can be created.

〔実施例〕〔Example〕

第1図は本発明装置の一例の路線的構成を示すもので、
マグネトロン型のスパッタリング装置の構成をとるもの
である。この場合、ベルジャ(図示せず)内に、中心軸
0−0′を中心として回転する基台(6)を設け、これ
の例えば下面に目的とする薄膜を被着形成する被スパッ
タリング体、例えば光磁気記録媒体を構成するガラス板
、樹脂板等より成る基体CI)が配置される。そして、
この基体(1)に対向して軸心0−0′を中心に等間隔
、すなわち180°の角間隔を保持して2個のスパッタ
源(7)及び(8)を配置する。これらスパッタm (
7)及び(8)と基台(6)、すなわち基体(1)との
間には、スパッタ源(7)及び(8)より夫々スパッタ
される金属のスパッタ位置を規制するマスク(9)を配
置する。スパッタ源(7)は希土類金属Tbの板状体よ
り成るターゲットα〔を有し、スパッタ源(8)は、遷
移金属reの板状体より成るターゲット(11)を有し
て成る。(12)及び(13)は、夫々マグネットを示
す。
FIG. 1 shows the line configuration of an example of the device of the present invention.
It has the configuration of a magnetron type sputtering device. In this case, a base (6) that rotates around a central axis 0-0' is provided in a bell jar (not shown), and a sputtering object, for example, a target thin film is deposited on the lower surface of the base (6), A substrate CI) made of a glass plate, a resin plate, etc. that constitutes a magneto-optical recording medium is arranged. and,
Two sputtering sources (7) and (8) are arranged facing the base (1) at equal intervals, that is, at an angular interval of 180°, about the axis 0-0'. These spatter m (
Between 7) and (8) and the base (6), that is, the base (1), there is a mask (9) for controlling the sputtering position of the metal sputtered from the sputtering sources (7) and (8), respectively. Deploy. The sputtering source (7) has a target α made of a plate of rare earth metal Tb, and the sputtering source (8) has a target (11) made of a plate of transition metal re. (12) and (13) each indicate a magnet.

マスク(9)は、例えば第2図に示すように、ターゲフ
)Q(O及び(11)に対向する部分にこれらターゲッ
トQal及び(11)の中心を通る直線X方向に外側に
向って広がるいちょう形の開口(14)及び(15)が
穿設されて成り、基台(6)が停止した状態では基体(
1)の互いに異なる部分例えば主として一半部に一方の
ターゲットαφからの希土類金属がスパッタリングされ
、主として他半部に他方のターゲット(11)からの遷
移金属がスパッタリングされるようにする。
For example, as shown in FIG. 2, the mask (9) has ginkgo leaves extending outward in the direction of a straight line Shape openings (14) and (15) are bored, and when the base (6) is stopped, the base (
The rare earth metal from one target αφ is sputtered onto mutually different parts of 1), for example, mainly one half, and the transition metal from the other target (11) is sputtered mainly onto the other half.

そして基台(6)を回転させながらターゲットQO)及
び(11)を負極側として直流スパッタリングを行う、
  (16)はシャッタで、このシャッタ(16)はス
パッタリングの開始時の放電が不安定な状態では図示の
ようにスパッタ源と被スパッタリング基体との間に配置
されるが、放電が安定した状態で排除される。
Then, while rotating the base (6), DC sputtering is performed with targets QO) and (11) on the negative electrode side.
(16) is a shutter, and this shutter (16) is placed between the sputtering source and the substrate to be sputtered as shown in the figure when the discharge is unstable at the start of sputtering, but when the discharge is stable be excluded.

今この装置によってこの基台(6)の回転を1回転3秒
間の回転速度をもって回転させて6分間、すなわち、1
20回の回転によってスパッタリングを行った。この場
合、基体(1)上には、全体として1000人の薄膜(
5)が堆積被着された。そして、このようにして形成さ
れた薄膜(5)は、第4図に示すようにTb層(2)と
Fejii(3)とが交互に繰り返し積層された構成と
なる。
Now, with this device, the base (6) is rotated at a rotation speed of 3 seconds per rotation for 6 minutes, that is, 1 rotation.
Sputtering was performed by rotating 20 times. In this case, a total of 1000 thin films (
5) was deposited. The thin film (5) thus formed has a structure in which Tb layers (2) and Fejii (3) are alternately and repeatedly stacked, as shown in FIG.

尚、基体fl)に対するスパッタリングによる各層(2
) 、 (31の成長速度は、例えば2〜20人/秒就
中5〜10人/秒となるように基体(1)とスパッタ源
との相対的回転速度、各スパッタ源、すなわち各ターゲ
ットへの印加電圧、電流条件等を選定することによって
選定する。すなわち基体への成長速度が2人/秒未満と
なると、遷移金属と希土類金属とが夫々層状に形成され
難くなり、また20人/秒を超えると磁気的特性が低下
して(ることが認められる。
In addition, each layer (2
), (31 growth rate is, for example, 2 to 20 persons/second, in particular 5 to 10 persons/second, relative rotational speed of the substrate (1) and the sputtering source, to each sputtering source, that is, to each target. The selection is made by selecting the applied voltage, current conditions, etc. In other words, if the growth rate on the substrate is less than 2 people/second, it becomes difficult for the transition metal and the rare earth metal to form layers, and if the growth rate is less than 20 people/second. It is recognized that magnetic properties deteriorate when the

上述の本発明装置によって得た光磁気記録媒体の磁化曲
線を第5図に示す、この場合、第3図のものに比し角型
比の向上がみられる。
FIG. 5 shows the magnetization curve of the magneto-optical recording medium obtained by the above-mentioned apparatus of the present invention. In this case, an improvement in the squareness ratio can be seen compared to that of FIG. 3.

尚、上述した例においては、各希土類金属と遷移金属と
を夫々単一金属によって構成した場合であるが、これら
の一方若しくは双方を2元以上の組成とすることもでき
る。例えば希土類金属としてTbGd合金、遷移金属と
してFeCo合金を用い得る。
In the above example, each of the rare earth metals and the transition metal is composed of a single metal, but one or both of them may have a composition of two or more elements. For example, a TbGd alloy can be used as the rare earth metal, and a FeCo alloy can be used as the transition metal.

このように希土類金属、或いは(及び)遷移金属として
2元以上の金属より構成する場合は、ターゲット(10
1或いは(及び>  (11)として夫々これらの合金
によって構成するか、或いはターゲットαω或いは(及
び)(11)を部分的に、特にマスク(9)の開口(1
4)或いは(及び)  (15)に臨む部分において部
分的に夫々の金属部分の面積の比率が、最終的に得るよ
うとする各合金の組成比の割合となるように選定すると
か、ターゲット00或いは(及び)  (11)として
1種の金属の板体上に他の金属ペレットを載せてそのス
パッタを行うなどの方法を採り得る。
In this way, when the rare earth metal or (and) transition metal is composed of two or more metals, the target (10
1 or (and > (11)), respectively, or the target αω or (and) (11) is partially formed, in particular in the opening (1) of the mask (9).
4) Alternatively, (and) the area facing (15) may be selected so that the area ratio of each metal part corresponds to the composition ratio of each alloy to be finally obtained, or the target 00 Alternatively, as (11), a method may be adopted in which pellets of another metal are placed on a plate of one type of metal and the pellets are sputtered.

また、スパッタ源は、希土類金属と遷移金属とに関し、
夫々異るスパッタ源を用いるものであるが、これらは夫
々複数個設けることもできる。
In addition, the sputtering source is related to rare earth metals and transition metals,
Although different sputtering sources are used in each case, a plurality of each of these can be provided.

〔発明の効果〕〔Effect of the invention〕

本発明装置によれば、全体として所要の組成となるも、
その各構成材料を、例えば各元素毎に或いは合金毎に夫
々極薄の薄膜層として順次繰り返し、周期的に積層させ
た構造の薄膜を作製でき、上述したように例えば光磁気
記録媒体の作製に通用すれば、特性の良い媒体を作製で
きるので実用上の利益は極めて大きい。
According to the device of the present invention, although the required composition as a whole is obtained,
For example, each component material can be sequentially repeated as an extremely thin film layer for each element or each alloy to create a thin film with a periodically laminated structure, and as mentioned above, it can be used, for example, to create a magneto-optical recording medium. If it is accepted, it will be of great practical benefit because a medium with good characteristics can be produced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明装置の一例の路線的構成図、第2図はそ
の要部の平面図、第3図は従来装置によって得た光磁気
記録媒体の磁化曲線図、第4図は本発明装置によって得
た光磁気記録媒体の路線的拡大断面図、第5図はその磁
化曲線図である。 (1)は基体、(6)は基台、(7)及び(8)はスパ
ッタ源である。 同  松隈秀盛4Xi、、”’、’、。 2ト・シー3日目馨屯寛 の 才11.ダ\、 じ0第
1図 マスクの半面図 第2図 ゐ江化曲舟東 第3図 6はイし 曲線
Fig. 1 is a line configuration diagram of an example of the device of the present invention, Fig. 2 is a plan view of the main parts thereof, Fig. 3 is a magnetization curve diagram of a magneto-optical recording medium obtained by the conventional device, and Fig. 4 is a diagram of the present invention. FIG. 5 is an enlarged linear cross-sectional view of the magneto-optical recording medium obtained by the apparatus, and is a magnetization curve diagram thereof. (1) is a base, (6) is a base, and (7) and (8) are sputter sources. Same Matsukuma Hidemori 4Xi,,”',',. 2nd day 3rd day of Kaoru Tunkan's Sai 11. da\, ji0 Figure 1 Half-view of the mask Figure 2 6 is good curve

Claims (1)

【特許請求の範囲】[Claims] 複数のスパッタ源が同一円周上に配置され、これらスパ
ッタ源の配置された上記円周の中心軸を中心として被ス
パッタリング基体が回転するようになされ、上記スパッ
タ源と上記被スパッタリング基体との間には夫々上記被
スパッタリング基体に対して上記各スパッタ源よりの飛
翔スパッタ材の透過開口を有し夫々のスパッタ領域を規
制するマスクが設けられ、上記マスクの上記各開口はそ
の開口幅が上記中心軸側から外周方向に向って広がる形
状に選定されたことを特徴とする積層構造薄膜の作製装
置。
A plurality of sputtering sources are arranged on the same circumference, and a substrate to be sputtered is rotated about a central axis of the circumference on which these sputtering sources are arranged, and a sputtering source is arranged between the sputtering source and the substrate to be sputtered. are each provided with a mask that has an opening for transmitting the flying sputtering material from each of the sputtering sources to the substrate to be sputtered and regulates each sputtering area, and each of the openings of the mask has an opening width that is at the center of the center of the sputtering target substrate. A device for producing a laminated thin film, characterized in that the shape is selected to expand from the shaft side toward the outer circumference.
JP20136085A 1985-09-11 1985-09-11 Manufacturing device for thin film of laminate structure Granted JPS6177155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20136085A JPS6177155A (en) 1985-09-11 1985-09-11 Manufacturing device for thin film of laminate structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20136085A JPS6177155A (en) 1985-09-11 1985-09-11 Manufacturing device for thin film of laminate structure

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP58092067A Division JPH0670858B2 (en) 1983-05-25 1983-05-25 Magneto-optical recording medium and its manufacturing method

Publications (2)

Publication Number Publication Date
JPS6177155A true JPS6177155A (en) 1986-04-19
JPH0532817B2 JPH0532817B2 (en) 1993-05-18

Family

ID=16439757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20136085A Granted JPS6177155A (en) 1985-09-11 1985-09-11 Manufacturing device for thin film of laminate structure

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296551A (en) * 1985-06-21 1986-12-27 Kyocera Corp Photomagnetic recording element and its production

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732370A (en) * 1980-07-31 1982-02-22 Matsushita Electric Ind Co Ltd Sputtering and vapor-depositing method and formation of magnetic gap by said method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732370A (en) * 1980-07-31 1982-02-22 Matsushita Electric Ind Co Ltd Sputtering and vapor-depositing method and formation of magnetic gap by said method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296551A (en) * 1985-06-21 1986-12-27 Kyocera Corp Photomagnetic recording element and its production

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JPH0532817B2 (en) 1993-05-18

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