JPS6170720A - パタ−ン形成方法 - Google Patents
パタ−ン形成方法Info
- Publication number
- JPS6170720A JPS6170720A JP59191448A JP19144884A JPS6170720A JP S6170720 A JPS6170720 A JP S6170720A JP 59191448 A JP59191448 A JP 59191448A JP 19144884 A JP19144884 A JP 19144884A JP S6170720 A JPS6170720 A JP S6170720A
- Authority
- JP
- Japan
- Prior art keywords
- organic layer
- forming method
- pattern
- layer
- pattern forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59191448A JPS6170720A (ja) | 1984-09-14 | 1984-09-14 | パタ−ン形成方法 |
KR1019850006265A KR930010248B1 (ko) | 1984-09-14 | 1985-08-29 | 패턴 형성 방법 |
US07/060,323 US4835089A (en) | 1984-09-14 | 1987-06-10 | Resist pattern forming process with dry etching |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59191448A JPS6170720A (ja) | 1984-09-14 | 1984-09-14 | パタ−ン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6170720A true JPS6170720A (ja) | 1986-04-11 |
JPH0477899B2 JPH0477899B2 (en, 2012) | 1992-12-09 |
Family
ID=16274790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59191448A Granted JPS6170720A (ja) | 1984-09-14 | 1984-09-14 | パタ−ン形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6170720A (en, 2012) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002005035A1 (fr) * | 2000-07-12 | 2002-01-17 | Nissan Chemical Industries, Ltd. | Composition de remplissage d'espaces lithographiques |
US7026237B2 (en) | 1999-08-26 | 2006-04-11 | Brewer Science Inc. | Fill material for dual damascene processes |
JPWO2004061526A1 (ja) * | 2002-12-26 | 2006-05-18 | 日産化学工業株式会社 | アルカリ溶解型リソグラフィー用ギャップフィル材形成組成物 |
US7998318B2 (en) | 1999-08-26 | 2011-08-16 | Brewer Science Inc. | Crosslinkable fill compositions for uniformly protecting via and contact holes |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59114824A (ja) * | 1982-12-21 | 1984-07-03 | Agency Of Ind Science & Technol | 半導体装置の平坦化方法 |
-
1984
- 1984-09-14 JP JP59191448A patent/JPS6170720A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59114824A (ja) * | 1982-12-21 | 1984-07-03 | Agency Of Ind Science & Technol | 半導体装置の平坦化方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7026237B2 (en) | 1999-08-26 | 2006-04-11 | Brewer Science Inc. | Fill material for dual damascene processes |
US7998318B2 (en) | 1999-08-26 | 2011-08-16 | Brewer Science Inc. | Crosslinkable fill compositions for uniformly protecting via and contact holes |
WO2002005035A1 (fr) * | 2000-07-12 | 2002-01-17 | Nissan Chemical Industries, Ltd. | Composition de remplissage d'espaces lithographiques |
JP2003057828A (ja) * | 2000-07-12 | 2003-02-28 | Nissan Chem Ind Ltd | リソグラフィー用ギャップフィル材形成組成物 |
CN100367111C (zh) * | 2000-07-12 | 2008-02-06 | 日产化学工业株式会社 | 形成平版印刷用填隙材料的组合物 |
KR100881831B1 (ko) * | 2000-07-12 | 2009-02-03 | 닛산 가가쿠 고교 가부시키 가이샤 | 리소그래피용 갭-필재 형성 조성물 |
US7517633B2 (en) | 2000-07-12 | 2009-04-14 | Nissan Chemical Industries, Ltd. | Composition for forming gap-filling material for lithography |
JPWO2004061526A1 (ja) * | 2002-12-26 | 2006-05-18 | 日産化学工業株式会社 | アルカリ溶解型リソグラフィー用ギャップフィル材形成組成物 |
Also Published As
Publication number | Publication date |
---|---|
JPH0477899B2 (en, 2012) | 1992-12-09 |
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