JPS6167925A - Semiconductor pellet mounter - Google Patents

Semiconductor pellet mounter

Info

Publication number
JPS6167925A
JPS6167925A JP19011684A JP19011684A JPS6167925A JP S6167925 A JPS6167925 A JP S6167925A JP 19011684 A JP19011684 A JP 19011684A JP 19011684 A JP19011684 A JP 19011684A JP S6167925 A JPS6167925 A JP S6167925A
Authority
JP
Japan
Prior art keywords
pellet
cameras
leads
monitor
mounter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19011684A
Other languages
Japanese (ja)
Inventor
Fumimaro Ikeda
池田　史麻呂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP19011684A priority Critical patent/JPS6167925A/en
Publication of JPS6167925A publication Critical patent/JPS6167925A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To contrive the improvement of the yield in the mounting process of a semiconductor pellet and the simplification of the structure of the titled device, and to enable to improve the productivity of the device by a method wherein the positioning regions of the inner leads on the side of the pellet and the electrodes on the external substrate are sectioned on the left and right and plural sets of cameras, by which the positioning regions are picked up, are provided. CONSTITUTION:The positioning regions of inner leads 2 on the side of a pellet 1 on the semiconductor pellet mounter and outer leads 3 on an external substrate 4 on the mounter are sectioned on the left and right and two sets of cameras 7, by which the positioning regions are discretely picked up, are set up over the upper direction of the pellet 1. A monitor 8 is connected to the cameras 7 through a camera control unit 9 and a separator 12 on the output side of the cameras 7 and the state of the inner leads 2 and the outer leads 3 is monitored by this monitor 8. Then, the positioning of the inner leads 2 and the outer leads 3 is performed by the joy sticks 10 of the monitor 8, the information on the result positioned is read in a controller 11, the correction amount of the position of the pellet 1 is calculated and the X, Y and theta stages are automatically adjusted. By this way, the yield in the mounting process is improved by a single constitution.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、フィルムキャリア方式に上るアウターリード
ボンディング工程にてペレットを外部基板上にマウント
する半導体ペレットマウンターに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor pellet mounter for mounting pellets on an external substrate in an outer lead bonding process using a film carrier method.

〔従来技術〕[Prior art]

フィルムキャリアを用いたＩＣの製造工程では、フィル
ムキャリア上にエツチングにより形成された多数の電極
（インナーリード）と、ペレット上の電極（パン７６）
とを位置合せした後にインナーリードダンディング（Ｉ
ＬＢ　）　４行なう。ＩＬＢ後はインナーリードからペ
レットを切断分離し、該ペレットは外部基板上ヘー・ン
ダ等によシマラントされ、外部電極（アウターリード）
にアウターリードボンディング（ＯＬＢ　）される。In the IC manufacturing process using a film carrier, a large number of electrodes (inner leads) are formed by etching on the film carrier, and electrodes (pan 76) on the pellet.
After aligning the inner lead dangling (I
LB) Do 4 lines. After ILB, the pellet is cut and separated from the inner lead, and the pellet is shimmered on the external substrate by a wire holder, etc., and then attached to the external electrode (outer lead).
Outer lead bonding (OLB) is performed.

上記ペレットマウント工程にて、従来用いていた方法を
第２図（ａ）　、　（ｂ）に示す。第２図（ａ）　、　
（ｂ）において、１はペレット、２はインナーリード、
３はアウターリード、４は外部基板、５は吸着アーム、
６は顕微鏡を示す。The method conventionally used in the pellet mounting process is shown in FIGS. 2(a) and 2(b). Figure 2(a),
In (b), 1 is a pellet, 2 is an inner lead,
3 is an outer lead, 4 is an external board, 5 is a suction arm,
6 indicates a microscope.

切断分離された個々のペレットを収納したトレーよ９１
個ずつ（レットを吸着アーム５にて外部基板４上のマウ
ント位置へ搬送し、これを外部基板４上に保持する。そ
の後、顕微鏡５を用い第２図（ｂ）に示すインナーリー
ド２とアラターリ−１−＋３との像を観察しながら、ペ
レット１または、外部基板４をＸ、Ｙ、θに移動させて
インナーリードとアクタ−リードを位置合せする。Tray 91 containing cut and separated pellets
The suction arm 5 transports the individual leads (lets) to the mounting position on the external substrate 4 and holds them on the external substrate 4. Then, using the microscope 5, the inner leads 2 and the inner leads 2 shown in FIG. While observing the images -1-+3, the pellet 1 or the external substrate 4 is moved in X, Y, and θ to align the inner lead and the actor lead.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、上記の様な方法によると、インナーリードとア
クタ−リードとの位置合せ領域の全体を顕微鏡で観察し
位置合せを行なうため、その領域の一部を拡大して観察
することは不可能であシ、必然的に低倍率によシ観察す
ることになり、位置合せ精度が低下し、位置合せに長い
時間要していた。位置合せ領域の一部を拡大して高倍率
によシ位置合せを行なう場合には、顕微鏡（或いは認識
用カメラ）もしくは、外部基板及びペレットの両方を同
時に移動させる必要があるため、位置合せするマウント
装置の構造が複雑となり、自動認識する場合でも制御が
複雑になるという問題がある。However, according to the above method, the entire alignment area between the inner lead and the actor lead is observed and aligned using a microscope, so it is impossible to enlarge and observe a part of that area. However, observation must be performed at low magnification, resulting in a decrease in alignment accuracy and a long time required for alignment. When enlarging a part of the alignment area and performing alignment at high magnification, it is necessary to move the microscope (or recognition camera) or both the external substrate and pellet at the same time. There is a problem in that the structure of the mounting device becomes complicated, and even in the case of automatic recognition, the control becomes complicated.

今日では特にペレット外径寸法の拡大や多リード化が上
記問題点を一層助長し、問題解決が急務となっていた。Nowadays, the above-mentioned problems are further aggravated by the increase in the outer diameter of pellets and the increase in the number of leads, and there is an urgent need to solve the problems.

本発明は、上記問題点を解消した半導体ペレ。The present invention provides a semiconductor chip that solves the above problems.

トマウンターを提供するものである。mounter.

〔問題点を解決するための手段〕 本発明はフィルムキャリア方式によるアウターリードボ
ンディング工程にてペレットを夕ｔ　＝ｃ　ｓ　、ｉ上
にマウントする半導体ペレットマウンターにおいて、ペ
レット側リードと外部基板上の電極との位置合せ領域を
区分けしてこれを撮像する複数台のカメラ７．７を備え
たものである。[Means for Solving the Problems] The present invention provides a semiconductor pellet mounter in which pellets are mounted on a substrate t = c s and i in an outer lead bonding process using a film carrier method. It is equipped with a plurality of cameras 7.7 that divide the alignment area with the camera and take images of the area.

〔作用〕[Effect]

位置合せ領域を区分けし、その区分けされた領域を複数
台のカメラにてそれぞれ撮像することによシ、ペレット
及びカメラ等を固定したｉｔ高高率率位置合せ領域を拡
大して映像化し、その映イ象に基いて位置合せを行なう
。By dividing the alignment area and imaging each of the divided areas with multiple cameras, the IT high-rate alignment area in which pellets, cameras, etc. are fixed can be enlarged and visualized. Alignment is performed based on the image.

〔実施例〕〔Example〕

以下に、本発明の一実施例を図によシ説明する。 An embodiment of the present invention will be explained below with reference to the drawings.

第１図において、ペレット１のインナーＩＪ　−ド２と
外部基板４のアウターリード３との位置合せ領域を左右
に区分してそれぞれの領域を個々に撮像スる２台のカメ
ラ７．７をペレット１の上方に設置する。In FIG. 1, two cameras 7 and 7 are used to divide the alignment area between the inner IJ-domain 2 of the pellet 1 and the outer lead 3 of the external board 4 into left and right parts and image each area individually. Install it above 1.

各カメラ７の出力側をカメラコントロールユニット９、
セノヤレータ１２を介してモニター８に接続する。１１
はカメラ７．７のコントローラ、１０は操作用ソヨイス
テックである。The output side of each camera 7 is connected to a camera control unit 9,
It is connected to the monitor 8 via the senoyalator 12. 11
is the controller for camera 7.7, and 10 is the operating Soyoi Stick.

トレーよシにレット１は外部基板４上に搬送される。２
台のカメラ７．７はにレット１のリード２と外部基板４
のリード３との一部ずつを高倍率にて、モニター８に映
し出す。ここで、モニター画面はセ・やレータ１２を介
することにより２分割され、左右にそれぞれのカメラの
映像が映し出される。The let 1 is conveyed onto the external substrate 4 on the tray. 2
Camera 7.7 leads 2 of lead 1 and external board 4
A portion of the lead 3 is displayed on the monitor 8 at high magnification. Here, the monitor screen is divided into two parts via the sensor 12, and images from the respective cameras are displayed on the left and right sides.

作業者は、モニター８を観察し、インナーリード２とア
ウターリード３とをＸ、Ｙ、θステージと連動されたジ
ョイステック１０を操作して位置合せを行なう。The operator observes the monitor 8 and aligns the inner lead 2 and the outer lead 3 by operating the joystick 10 linked to the X, Y, and θ stages.

また、コントローラ１１を用いて自動認識を行なう場合
には、一度に情報をコントローラ１１に取シ込み補正量
を計算し、Ｘ、Ｙ、θステージを駆動して位置合せを行
なうことができる。Further, when automatic recognition is performed using the controller 11, information can be input to the controller 11 at one time, a correction amount can be calculated, and positioning can be performed by driving the X, Y, and θ stages.

〔発明の効果〕〔Effect of the invention〕

以上のように本発明は位置合せ時にカメラあるいは外部
基板とペレットを同時に移動する必要性がなくなシ、構
造が簡略化できる。また、移動に要する時間が不要とな
シ、さらに高倍率によシ位置合せを行なうことができる
ため、位置合せ作業を短時間で簡単に行なうことができ
、同時に位置合せ精度を向上することができる。As described above, the present invention eliminates the need to move the camera or the external substrate and the pellet at the same time during alignment, and the structure can be simplified. In addition, since the time required for movement is not required and alignment can be performed at a high magnification, alignment work can be done easily in a short time, and at the same time alignment accuracy can be improved. can.

したがって、本発明によれば、従来の問題点を解消でき
、マウント装置における歩留向上と装置のコスト低減を
図ることができるばかりでなく、作業能率（インデイツ
クス）を向上できると同時に作業性を高め、生産性の向
上に大きく寄与でき、しかも大イレット、多数リード化
に対処できる効果を有するものである。Therefore, according to the present invention, it is possible not only to solve the conventional problems and improve the yield of the mounting device and reduce the cost of the device, but also to improve the work efficiency (indices). This can greatly contribute to improving productivity, and has the effect of being able to deal with large islets and multiple leads.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明装置の一実施例を示・す構成図、第２図
（、）は従来装置を示す構成図、第２図（ｂ）は顕微鏡
によシ映し出された画像を示す図である。 図に於て、 １・・・ペレット、２・・・インナーリード、３・・・
アウターリード、４・・・外部基板、５・・・吸着アー
ム、６・・・顕微鏡、７・・・カメラ、８・・・モニタ
ー、９・・・カメラコントロールユニット、１０・・・
）ヨイスｆ、、り、１１　　・コントローラ、１２　・
・セノぐレータヲ示ス。Fig. 1 is a block diagram showing an embodiment of the device of the present invention, Fig. 2 (,) is a block diagram showing a conventional device, and Fig. 2 (b) is a diagram showing an image projected by a microscope. It is. In the diagram, 1...pellet, 2...inner lead, 3...
Outer lead, 4...External board, 5...Adsorption arm, 6...Microscope, 7...Camera, 8...Monitor, 9...Camera control unit, 10...
) Yois f, ri, 11 ・Controller, 12 ・
・Display the cenogrator.

Claims (1)

【特許請求の範囲】[Claims] （１）フィルムキャリア方式によるアウターリードボン
ディング工程にてペレットを外部基板上にマウントする
半導体ペレットマウンターにおいて、ペレット側リード
と外部基板上の電極との位置合せ領域を区分けしてこれ
を撮像する複数台のカメラを備えたことを特徴とする半
導体ペレットマウンター。(1) In a semiconductor pellet mounter that mounts pellets on an external substrate in an outer lead bonding process using a film carrier method, multiple units separate the alignment area between the pellet side lead and the electrode on the external substrate and image this. A semiconductor pellet mounter characterized by being equipped with a camera.
JP19011684A 1984-09-11 1984-09-11 Semiconductor pellet mounter Pending JPS6167925A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19011684A JPS6167925A (en) 1984-09-11 1984-09-11 Semiconductor pellet mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19011684A JPS6167925A (en) 1984-09-11 1984-09-11 Semiconductor pellet mounter

Publications (1)

Publication Number Publication Date
JPS6167925A true JPS6167925A (en) 1986-04-08

Family

ID=16252645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19011684A Pending JPS6167925A (en) 1984-09-11 1984-09-11 Semiconductor pellet mounter

Country Status (1)

Country Link
JP (1) JPS6167925A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119031A (en) * 1987-10-31 1989-05-11 Nec Corp Pellet bonding device
US5059559A (en) * 1987-11-02 1991-10-22 Hitachi, Ltd. Method of aligning and bonding tab inner leads

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119031A (en) * 1987-10-31 1989-05-11 Nec Corp Pellet bonding device
US5059559A (en) * 1987-11-02 1991-10-22 Hitachi, Ltd. Method of aligning and bonding tab inner leads

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