JP2000269306A - Manufacture of semiconductor device and manufacturing apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing device of a structure, wherein semiconductor chips can be picked up with high accuracy and at high speed without generating leftover semiconductor chips, and, at the same time, a high-accuracy visual inspection can be made, and to provide a manufacturing method of the semiconductor device. SOLUTION: A semiconductor device manufacturing apparatus has a movable stage 12, a chip mounting means which is mounted on the stage 12 and is mounted with a plurality of semiconductor chips, a first imaging means 36 which enlarges a first region on the chip mounting means at a first magnification to image the first region, a second imaging means 44 which enlarges a second region within the first region at a second magnification higher than the first magnification to image the second region, and a control means 46 which calculates each position of the chips within the first region on the basis of a first image imaged by the means 36, images one semiconductor chip with the calculated position within the first region by the means 44, and positions the position of the one semiconductor chip at a prescribed position by moving the stage 12 on the basis of a second image imaged by the means 44.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus and a method for manufacturing a semiconductor device, and more particularly to an apparatus and a method for manufacturing a semiconductor device for picking up a semiconductor chip.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device, a characteristic inspection such as an appearance inspection is performed to judge the quality of a manufactured semiconductor chip. In particular, in the case of a semiconductor laser device, it is necessary to inspect the light emission characteristics of the laser, and since the light emission characteristics cannot be inspected as a whole wafer, it is necessary to inspect the semiconductor chip as a single semiconductor chip.

In the inspection of semiconductor chips, a plurality of semiconductor chips mounted on a stage are inspected for appearance, picked up using a chip pick-up hand, and conveyed to a predetermined characteristic inspection stage.

When picking up a semiconductor chip,
It is necessary to position a semiconductor chip at a predetermined position so that it can be picked up by a chip pick-up hand. A conventional optical system for positioning a semiconductor chip will be described with reference to FIG. FIG. 7A is a conceptual diagram showing a conventional optical system for aligning a semiconductor chip, and FIG. 7B is a conceptual diagram showing an image enlarged by an optical lens.

As shown in FIG. 7A, a low-magnification optical lens 132 is provided on a stage 112 on which a semiconductor chip is mounted. The image enlarged by the low-magnification optical lens 132 is captured by the CCD camera 134,
The captured image is input to the image processing unit 136. The image processed by the image processing unit 136 is transmitted to the CPU unit 146.
Is input to The CPU unit 146 controls the stage 11
2 to position the semiconductor chip 135 at a predetermined position.

[0006]

However, in the conventional optical system as shown in FIG. 7, since a low-magnification lens 132 is used, high-precision positioning cannot be performed.
In particular, in recent years, the miniaturization of semiconductor chips has been advanced, and for such fine semiconductor chips, higher-precision positioning is required, and high-precision visual inspection (scratch, crack and crack) is performed. Etc.) are required. Further, since a semiconductor chip using a GaAs-based substrate is vulnerable to an impact at the time of being picked up, higher-precision positioning has been required to prevent unnecessary impact from being applied to the substrate.

Here, in order to perform highly accurate positioning and appearance inspection, it is conceivable to perform positioning using a high-magnification optical lens 133 as shown in FIG.

However, when the high-magnification optical lens 133 is used, the field of view becomes narrow as shown in FIG. 8B, and the following problems occur.

FIG. 9A shows a state where the semiconductor chip 135 is placed on a vinyl sheet (not shown) stretched on the chip ring 126. Originally, the visual field 150 moves rightward along the trajectory A as shown in FIG.
Then, it is desirable that the semiconductor chip 135 be picked up by moving to the left along the trajectory B and performing sequential alignment.

However, when the semiconductor chip 135 is searched and picked up using the narrow field of view 150 with high magnification, the semiconductor chip 135 must be picked up along the track A as shown in FIG. Not be able to
View 1 along the semiconductor chip 135 in the view 150
In some cases, the 50 moves and the field of view 150 moves to the vicinity of the adjacent trajectory B. For example, in the case shown in FIG. 9B, the visual field 150 shifts to the vicinity of the trajectory B at the point 154, and the visual field 150 returns to the trajectory A at the point 156.

When the visual field 150 moves along such a locus 148, as shown in FIG.
Between the point 4 and the point 156, the semiconductor chip 135 is left behind near the track A.

Further, when the semiconductor chip 135 cannot be searched in the visual field 150 as shown in FIG. 10, a search for the next semiconductor chip 135 to be picked up is continued, so that a loss time has occurred.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device manufacturing apparatus and a manufacturing method capable of picking up a semiconductor chip with high accuracy and high speed without leaving a residue and performing a high-precision appearance inspection. is there.

[0014]

An object of the present invention is to provide a movable stage, a chip mounting means mounted on the stage and having a plurality of semiconductor chips mounted thereon, and a first stage mounted on the chip mounting means. A first imaging unit for enlarging an image of the first area at a first magnification, and a second area in the first area;
A second imaging unit configured to enlarge the image at a second magnification higher than the first magnification, and a semiconductor in the first region based on a first image captured by the first imaging unit; Calculating the position of each of the chips;
One semiconductor chip in the area is imaged by the second imaging means, and the position of the one semiconductor chip is moved by moving the stage based on the second image imaged by the second imaging means. And a control unit for positioning the semiconductor device at a predetermined position. Thus, the semiconductor chip is observed using the wide field of view enlarged at the first magnification, and the semiconductor chip within the field of view is positioned at the second magnification higher than the first magnification, so that the semiconductor chip is left behind. In addition, a semiconductor chip can be picked up at high speed and with high accuracy, and a high-precision appearance inspection can be performed.

In the above-described apparatus for manufacturing a semiconductor device, a first lens facing the chip mounting means, and a branch provided on the first lens for branching light from the first lens. Means, and a second lens coupled to the light branched by the branching means, wherein the first imaging means captures an image enlarged by the first lens, and It is preferable that the imaging means captures an image enlarged by the first lens and the second lens. Thus, the semiconductor device manufacturing apparatus can have a simple configuration.

The above object is also achieved by enlarging a first area on a chip mounting means, which is mounted on a movable stage and on which a plurality of semiconductor chips are mounted, at a first magnification, thereby obtaining a first magnification. And calculating a position of each of the semiconductor chips in the first area based on the first image, and calculating one position of the semiconductor chip in the first area whose position has been calculated. A second image is enlarged at a second magnification higher than the first magnification, a second image is captured, and the position of the one semiconductor chip is moved to the predetermined position based on the second image by moving the stage. The present invention is attained by a method of manufacturing a semiconductor device, characterized in that it is positioned at a position. Thus, the semiconductor chip is observed using the wide field of view enlarged at the first magnification, and the semiconductor chip within the field of view is positioned at the second magnification higher than the first magnification, so that the semiconductor chip is left behind. In addition, a semiconductor chip can be picked up at high speed and with high accuracy, and a high-precision appearance inspection can be performed.

The above object is also achieved by enlarging, at a first magnification, a first area on a chip mounting means on which a plurality of semiconductor chips are mounted on a movable stage. Calculating the position of each semiconductor chip in the area of 1 and enlarging the calculated semiconductor chip by a second magnification higher than the first magnification, and positioning the semiconductor chip by moving the stage; This is achieved by a method of manufacturing a semiconductor device characterized by the following. Thus, the semiconductor chip is observed using the wide field of view enlarged at the first magnification, and the semiconductor chip within the field of view is positioned at the second magnification higher than the first magnification, so that the semiconductor chip is left behind. In addition, a semiconductor chip can be picked up at high speed and with high accuracy, and a high-precision appearance inspection can be performed.

The above object is also achieved by enlarging a first area on a chip mounting means, which is mounted on a movable stage and on which a plurality of semiconductor chips are mounted, at a first magnification, thereby obtaining a first magnification. And calculating a position of each of the semiconductor chips in the first area based on the first image, and calculating one position of the semiconductor chip in the first area whose position has been calculated. A semiconductor device, comprising: enlarging at a second magnification higher than a first magnification, capturing a second image, and performing an appearance inspection of the one semiconductor chip using the second image. This is achieved by a manufacturing method. Thus, the semiconductor chip is observed using the wide field of view enlarged at the first magnification, and the semiconductor chip within the field of view is enlarged at the second magnification higher than the first magnification to perform the appearance inspection. The appearance inspection of the semiconductor chip can be performed with high accuracy.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor device manufacturing method and method according to one embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic diagram showing a semiconductor inspection system to which the semiconductor device manufacturing apparatus according to the present embodiment is applied. FIG. 2 is a schematic diagram illustrating the semiconductor device manufacturing apparatus according to the present embodiment. FIG. 3 is a conceptual diagram showing a track for picking up a semiconductor chip. FIG. 4 is a conceptual diagram showing a logical coordinate space. FIG. 5 is a conceptual diagram showing the coordinates of each semiconductor chip with respect to the center of the visual field. FIG. 6 is a conceptual diagram showing the coordinates of each semiconductor chip in the logical coordinate space.

First, the semiconductor inspection system using the semiconductor device manufacturing apparatus according to the present embodiment will be explained with reference to FIG. The present invention can be applied not only to a semiconductor inspection system but also to various uses such as a semiconductor manufacturing system.

The semiconductor inspection system shown in FIG. 1 transfers a semiconductor chip 35 (see FIG. 3) placed on the stage 12 of the chip pickup section 10 to the characteristic inspection stage 16 using the chip pickup hand 14 and In this system, the semiconductor chips 35 inspected on the inspection stage 16 are arranged on the chip tray 22 of the chip tray unit 20 using the chip arrangement hand 18. The operation setting of this semiconductor inspection system is made by the console 24.

The chip pickup unit 10 is provided with a stage 12. The stage 12 appropriately moves the semiconductor chip 35 by using a θ stage (not shown) and an XY stage (not shown). The θ stage is for rotating the direction of the semiconductor chip 35, and the XY stage is for moving the semiconductor chip 35 in the horizontal and vertical directions.

On the stage 12, for example, 170 mmφ
Of the tip ring 26 (see FIG. 3). A vinyl sheet (not shown) is attached to the tip ring 26, and a plurality of semiconductor chips 35 to be inspected are placed on the vinyl sheet.

Semiconductor chip 35 to be picked up
Is positioned in the chip pickup unit 10 by a method described later.

The chip pick-up hand 14 moves to a predetermined position on the stage 12, picks up the positioned semiconductor chip 35 by inspecting its appearance.

The chip pickup hand 14 transports the picked-up semiconductor chip 35 to the characteristic inspection stage 16. In the characteristic inspection stage 16, a characteristic inspection is performed on the semiconductor chip 35 that has been transported.

The semiconductor chip 35 subjected to the characteristic inspection is:
The chip is picked up by the chip arrangement hand 18 and transported to a desired position on the chip tray section 20.

The chip tray section 20 has an XY stage 30
Are provided, and a plurality of chip trays 22 are mounted on the XY stage 30. Chip tray 22 is X
The semiconductor chip positioned by the Y stage 30 and transported by the chip arrangement hand 18 is placed at a desired position on the chip tray 22. Thus, the semiconductor chips 35 are arranged on the chip tray 22.

Next, the apparatus for fabricating the semiconductor device according to the present embodiment will be explained with reference to FIG.

As shown in FIG. 2, an optical lens 32 is provided above the stage 12.
The low-magnification image magnified by is captured by the CCD camera 34. The upper part of FIG. 2 shows an example of an image enlarged by the optical lens 32 and captured by the CCD camera 34. The image picked up by the CCD camera 34 is an image enlarged at a low magnification and has a wide field of view, and a large number of semiconductor chips 35 are scattered in this field of view. CC
The low magnification image captured by the D camera 34 is input to the image processing unit 36.

On the other hand, the image enlarged by the optical lens 32 is further enlarged by the optical lens 40 via the half mirror 38. The high-magnification image magnified in this way is a CCD
An image is taken by the camera 42. 2 shows an example of an image enlarged by the optical lenses 32 and 40 and captured by the CCD camera 42. Since the image captured by the CCD camera 42 is an image enlarged at a high magnification, the field of view is narrow, and the semiconductor chips 35 which are greatly enlarged are scattered in this field of view. The image captured by the CCD camera 42 is input to the image processing unit 44.

The image input to the image processing unit 36 is subjected to predetermined processing by the image processing unit 36 and input to the CPU unit 46. The image input to the image processing unit 44 is
Predetermined processing is performed by the image processing unit 44 and input to the CPU unit 46.

The CPU unit 46 performs a predetermined process using the image input from the image processing unit 36 and the image input from the image processing unit 44, and positions the semiconductor chip 35 to be picked up at a predetermined position. The stage 12 is controlled as described above.

Next, a semiconductor chip positioning process performed by the semiconductor device manufacturing apparatus according to the present embodiment will be described with reference to FIG.
This will be described with reference to FIGS.

FIG. 3A shows a state in which the semiconductor chip 35 is mounted on a vinyl sheet stretched over the tip ring 26. Semiconductor chip 3 mounted in this manner
5 are sequentially inspected and picked up along a locus 48 as shown in FIG.

In the semiconductor device manufacturing apparatus according to the present embodiment, as shown in FIGS. 3A and 3B, the semiconductor chip 35 is observed in a wide field of view 50 enlarged at a low magnification. The field of view 50 has been processed by the image processing unit 36 and is enlarged at a low magnification by the lens 32, so that the field of view 50 is wide.

In FIG. 3B, A and B indicate the trajectories on which the visual field 50 moves. The field of view 50 moves rightward along the trajectory A and, when approaching the tip ring 26, turns back and moves leftward along the trajectory B. In this way, the plurality of semiconductor chips 35 in the field of view 50 are sequentially inspected and picked up by a method described later. The interval between the trajectory A and the trajectory B may be set as appropriate.

FIG. 4 shows a logical coordinate space used when picking up a semiconductor chip. The center of the logical coordinate space is the reference origin (0, 0), and the logical coordinate space extends in the X and Y directions. The right direction of the paper is the positive direction of the X coordinate, the left direction of the paper is the negative direction of the X coordinate, the upward direction of the paper is the positive direction of the Y coordinate, and the downward direction of the paper is the negative direction of the Y coordinate.

FIG. 4 shows a case where the field of view 50 is located at the reference origin (0, 0). Also, the width of the visual field 52 with respect to the visual field 50 is shown. The field of view 52 has been processed by the image processing unit 44 and is enlarged by the lens 32 and the lens 40, so that the field of view 52 is narrow. The width of the visual field 52 with respect to the visual field 50 can be set as appropriate.

The semiconductor device manufacturing apparatus according to the present embodiment uses the logical coordinate space as shown in FIG. 4 and calculates the coordinates of each semiconductor chip 35 in the logical coordinate space as follows.

FIG. 5 shows a state where a plurality of semiconductor chips are mounted in a wide field of view 50 with a low magnification.

First, the CPU unit 46 determines that the logical coordinates are empty.
Center coordinates (X ₀, Y₀).
Then, the center coordinates (X₀, Y₀Each half
The coordinates of the conductor chip 35 are calculated. By this calculation,
Field center coordinates (X₀, Y₀) For each semiconductor chip 35
Coordinates (S_n, T_n) Is required.

Thereafter, the CPU unit 46 sets the visual field 50
The coordinates (X _n , Y _n ) of each semiconductor chip 35 in the logical coordinate space are calculated from the center coordinates (X ₀ , Y ₀ ) and the coordinates (S _n , T _n ) of each semiconductor chip 35. Thus, as shown in FIG. 6A, the coordinates (X _n , Y _n ) of each semiconductor chip 35 in the logical coordinate space are obtained.

Next, based on the coordinates (X _n , Y _n ) of the semiconductor chip 35 in the logical coordinate space thus obtained, the CP
The U unit 46 controls the stage 12 to position the semiconductor chip 35. The positioning of the semiconductor chip 35 is performed sequentially, and the positioned semiconductor chip 35 is picked up by the chip pick-up hand 14.
It is transported to the characteristic inspection stage 16.

Here, an example will be described in which the semiconductor chip 35 located at the coordinates (X ₇ , Y ₇ ) is positioned. When positioning the semiconductor chip 35 located at the coordinates (X ₇ , Y ₇ ), the CPU unit 46 sets the coordinates (X ₇ , Y ₇ ).
The stage 12 is controlled so that Y ₇ ) is located at a predetermined position. When the coordinates (X ₇ , Y ₇ ) are located at the predetermined positions in this way, when the observation is made in a narrow field of view 52 with a high magnification, the positional relationship between the coordinates (X ₇ , Y ₇ ) and the semiconductor chip 35 is as follows. It is shifted as shown in FIG. That is, since the coordinates (X ₇ , Y ₇ ) are calculated from the wide field of view 50 with low magnification, the center of the semiconductor chip 35 is located at the coordinates (X ₇ , Y ₇ ).
It is out of alignment.

Accordingly, the CPU unit 46 further controls the stage 12 to display the position of the semiconductor chip 35 in the visual field 52.
Is performed to adjust to the center of.

In this manner, the semiconductor chip 35 is positioned at the center of the narrow field of view 52 of high magnification, and the semiconductor chip 35 is positioned. The semiconductor chip 35 positioned as described above is inspected in appearance, picked up by the chip pickup hand 14, and transferred to the characteristic inspection stage 16.

In this manner, when the pickup is completed for all the semiconductor chips 35 in the wide field of view 50 with a low magnification, that is, all the semiconductor chips 35 located at the coordinates (X ₁ , Y ₁ ) to (X ₈ , Y ₈ ). The field of view 50 is, for example, FIG.
It moves rightward along the trajectory A of (b). Thus,
The field of view 50 moves sequentially, and the semiconductor chips 35 are sequentially picked up.

As described above, according to the present embodiment, the semiconductor chip is observed using a wide field of view with a low magnification, and the semiconductor chips within the field of view are positioned using a narrow field of view with a high magnification, so that a residue is generated. The semiconductor chip can be picked up at high speed and with high accuracy without any trouble, and the appearance can be inspected with high accuracy.

[Modified Embodiment] The present invention is not limited to the above-described embodiment, and various modifications are possible.

For example, in the above embodiment, the case of inspecting a semiconductor chip has been described as an example.
It can be used for all applications in the manufacture of semiconductor devices such as assembly.

In the above embodiment, the case of manufacturing a semiconductor device has been described as an example. However, the present invention can be used not only for manufacturing a semiconductor device but also for manufacturing various products that require fine positioning.

[0053]

As described above, according to the present invention, a semiconductor chip is observed using a wide field of view enlarged at a low magnification, and the semiconductor chips within the field of view are positioned using a narrow field of view at a high magnification. The semiconductor chip can be picked up at high speed and with high accuracy without leaving the semiconductor chip, and the appearance can be inspected with high accuracy.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a semiconductor inspection system to which a semiconductor device manufacturing apparatus according to an embodiment of the present invention is applied.

FIG. 2 is a schematic diagram showing a semiconductor device manufacturing apparatus according to an embodiment of the present invention.

FIG. 3 is a conceptual diagram showing a track for picking up a semiconductor chip.

FIG. 4 is a conceptual diagram showing a logical coordinate space.

FIG. 5 is a conceptual diagram showing the coordinates of each semiconductor chip with respect to the center of the field of view.

FIG. 6 is a conceptual diagram showing coordinates of each semiconductor chip in a logical coordinate space.

FIG. 7 is a conceptual diagram showing a conventional alignment optical system.

FIG. 8 is a conceptual diagram showing an optical system for positioning using a high-magnification optical lens.

FIG. 9 is a conceptual diagram (part 1) illustrating a track for picking up a semiconductor chip.

FIG. 10 is a conceptual diagram (part 2) illustrating a track for picking up a semiconductor chip.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Chip pick-up part 12 ... Stage 14 ... Chip pick-up hand 16 ... Characteristic inspection stage 18 ... Chip arrangement hand 20 ... Chip tray part 22 ... Chip tray 24 ... Operator console 26 ... Tip ring 28 ... Optical system mechanism part 30 ... XY stage 32 optical lens 34 CCD camera 35 semiconductor chip 36 image processing unit 38 half mirror 40 optical lens 42 CCD camera 44 image processing unit 46 CPU unit 48 locus 50 visual field 52 visual field 112 stage 126 ... Tip ring 132 ... Optical lens 133 ... Optical lens 134 ... CCD camera 135 ... Semiconductor chip 136 ... Image processing unit 146 ... CPU unit 148 ... Loci 150 ... Field of view 154 ... Point 156 ... Point

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Claims (5)

[Claims] A movable stage; a chip mounting unit mounted on the stage, on which a plurality of semiconductor chips are mounted; and a first area on the chip mounting unit, A first imaging unit for enlarging an image at a magnification, and a second imaging unit for enlarging and imaging a second area in the first area at a second magnification higher than the first magnification. Calculating a position of each of the semiconductor chips in the first area based on the first image picked up by the first image pickup unit, and calculating one of the positions in the first area where the position is calculated; Imaging the semiconductor chip by the second imaging means;
Control means for positioning the position of the one semiconductor chip at a predetermined position by moving the stage based on the second image picked up by the image pickup means. manufacturing device. 2. The semiconductor device manufacturing apparatus according to claim 1, wherein a first lens facing the chip mounting means, and a light from the first lens provided on the first lens. A branching unit for branching; and a second lens coupled to the light branched by the branching unit, wherein the first imaging unit captures an image enlarged by the first lens, An apparatus for manufacturing a semiconductor device, wherein the second imaging means captures an image enlarged by the first lens and the second lens. 3. A first image is magnified at a first magnification on a chip mounting means mounted on a movable stage and having a plurality of semiconductor chips mounted thereon, and a first image is captured. Calculating a position of each of the semiconductor chips in the first area based on the first image; and calculating one of the semiconductor chips in the first area whose position has been calculated by the first magnification. Zooming in at a higher second magnification,
A method of manufacturing a semiconductor device, comprising: capturing an image of a semiconductor chip; and positioning the position of the one semiconductor chip at a predetermined position by moving the stage based on the second image. 4. A first area on a chip mounting means, which is mounted on a movable stage and on which a plurality of semiconductor chips are mounted, is enlarged at a first magnification, so that the first area is enlarged. Calculating the position of each of the semiconductor chips, enlarging the semiconductor chip having the calculated position at a second magnification higher than the first magnification, and positioning the semiconductor chip by moving the stage. A method for manufacturing a semiconductor device. 5. A first image is taken at a first magnification by enlarging a first area on a chip mounting means on a movable stage on which a plurality of semiconductor chips are mounted on the chip mounting means. Calculating a position of each of the semiconductor chips in the first area based on the first image; and calculating one of the semiconductor chips in the first area whose position has been calculated by the first magnification. Zooming in at a higher second magnification,
A method of manufacturing a semiconductor device, comprising: capturing an image of a semiconductor chip; and performing an appearance inspection of the one semiconductor chip using the second image.