JPS6167904A - Laser trimming device - Google Patents
Laser trimming deviceInfo
- Publication number
- JPS6167904A JPS6167904A JP59191254A JP19125484A JPS6167904A JP S6167904 A JPS6167904 A JP S6167904A JP 59191254 A JP59191254 A JP 59191254A JP 19125484 A JP19125484 A JP 19125484A JP S6167904 A JPS6167904 A JP S6167904A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- laser beam
- resistor
- substrate
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は、マイクロチップレジスタ（ＭＣＲ）や抵抗モ
ジュール（ＲＭ）等をレーザ光によりトリミングを行う
レーザトリミング装置に関する。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a laser trimming device for trimming microchip registers (MCR), resistance modules (RM), etc. with laser light.
（ロ）従来技術
従来のレーザトリミング装置に置いて、トリミング工程
にある基板の抵抗体の切り出し口を設定するのに人が手
動操作により行なっている。例えば、１つの基板のトリ
ミング工程が終わり、次のトリミングを行うとき毎回人
が基板の配置、基板の寸法のばらつき、基板の印刷パタ
ーンのずれなどをチェックしている。このようなチェッ
クは、人によるものなので正確に行うことができない。(B) Prior Art In a conventional laser trimming apparatus, a person manually operates to set the cutting opening of the resistor on the substrate during the trimming process. For example, each time a trimming process for one board is completed and the next trimming is to be performed, a person checks the arrangement of the board, variations in the dimensions of the board, deviations in the printed pattern on the board, etc. Such checks cannot be performed accurately because they are performed by humans.
従って、基板の寸法のばらつきや印刷パターンのずれな
どにより不良品となるものが出てくる。また、抵抗モジ
ュールの場合、抵抗体の印刷パターンの形状が数１０種
類あり、各印刷パターンにより抵抗体の切断の方法が異
なるため、装置のハードウェアやソフトウェアの切り換
えを行わなければならなかった。Therefore, some products become defective due to variations in substrate dimensions, misalignment of printed patterns, etc. In addition, in the case of a resistor module, there are several dozen shapes of resistor print patterns, and the method for cutting the resistor differs depending on each print pattern, so it was necessary to change the hardware and software of the device.
（ハ）目的
本発明の目的は、前述の技術的課題を解決し、し−ザト
リミングを行う基板の配置、ばらつき、印刷パターンの
ずれなどを自動的にチェックし、生産効率を向上させる
レーザトリミング装置を提供することである。(c) Purpose The purpose of the present invention is to solve the above-mentioned technical problems and to improve production efficiency by automatically checking the arrangement, variation, and misalignment of the printed pattern of the substrate to be laser trimmed. The purpose is to provide equipment.
（ニ）構成
本発明は、レーザ光により、トリミングを行う基板の抵
抗体の配置を見るために設置されたカメラと、前記カメ
ラの出力により前記抵抗体の配置を認識する認識手段と
、前記認識手段の出力により前記抵抗体をレーザ光によ
り切り出す位置を演算し、レーザ光を制御するレーザ位
置制御手段と、前記レーザ光により、切断された前記抵
抗体の抵抗値を測定する測定手段と、前記測定手段の出
力が予め設定された値になったとき前記レーザ位置制御
手段に信号を与え、前記レーザ光を停止させる主制御手
段とを含むことを特徴とするレーザトリミング装置であ
る。(D) Configuration The present invention includes a camera installed to view the arrangement of resistors on a substrate to be trimmed using a laser beam, a recognition means for recognizing the arrangement of the resistors based on the output of the camera, and a recognition means for recognizing the arrangement of the resistors on the substrate to be trimmed. a laser position control means for calculating a position at which the resistor is cut out by a laser beam based on the output of the means and controlling the laser beam; a measuring means for measuring a resistance value of the cut resistor by the laser beam; The laser trimming apparatus is characterized in that it includes main control means for giving a signal to the laser position control means to stop the laser beam when the output of the measurement means reaches a preset value.
（ホ）実施例
図面は、本発明の一実施例の全体の構成を示すブロック
図である。レーザ光によりトリミングを行う基板１３は
、抵抗体８と、その抵抗体８の両側に電気的に導通され
た電極９．１０とを有する。カメラ１は、基板１３のト
リミング工程における配置状態、寸法、印刷パターンの
ずれなどを見るために設置されている。認識回路２は、
カメラ１からの出力により基板１３の配置状態、寸法の
ばらつき、“印刷パターンのずれなどを認識し、これら
に関する情報を主制御装置４に与える。抵抗測定器３は
、電極９、ｌＯに接触移動する探針１１．１２により基
板１３の電極９と電極１０間の抵抗値、つまり抵抗体８
の抵抗値を測定する。(e) Embodiment The drawing is a block diagram showing the overall configuration of an embodiment of the present invention. The substrate 13 to be trimmed by laser light has a resistor 8 and electrodes 9 and 10 electrically connected to both sides of the resistor 8. The camera 1 is installed to view the arrangement, dimensions, deviations of printed patterns, etc. during the trimming process of the substrate 13. The recognition circuit 2 is
The output from the camera 1 recognizes the arrangement state of the substrate 13, variations in dimensions, deviations in the printed pattern, etc., and provides information regarding these to the main controller 4.The resistance measuring device 3 moves in contact with the electrode 9, lO The resistance value between the electrode 9 and the electrode 10 on the substrate 13, that is, the resistor 8, is detected by the probes 11 and 12.
Measure the resistance value.
レーザ発生装置６からのレーザ光は、反射鏡７により反
射され、抵抗体８を例えば、図面に示すようにＬ字状に
切断する。レーザ位置制御装置５は、レーザ発生装置６
からのレーザ光を発射させたり、停止させたり、あるい
は反射鏡７の設定角度を変化させたりする。主制御装置
４は、抵抗測定器３からの抵抗値に対する信号を受信し
、その信号が予め定めた値になったときレーザ位置制御
装置５にレーザ制御信号を与え、レーザ発生装置６から
のレーザ光を停止させる。また、主制御装置４は、認識
回路からの信号により、基板１３の抵抗体８の切り出し
口にレーザ光が照射するようにレーザ位置制御装置５を
制御する。The laser beam from the laser generator 6 is reflected by a reflecting mirror 7 and cuts the resistor 8 into, for example, an L-shape as shown in the drawing. The laser position control device 5 includes a laser generator 6
emit or stop the laser beam from the mirror 7, or change the set angle of the reflecting mirror 7. The main control device 4 receives a signal for the resistance value from the resistance measuring device 3, and when the signal reaches a predetermined value, it gives a laser control signal to the laser position control device 5, and outputs a laser control signal from the laser generator 6. Stop the light. In addition, the main controller 4 controls the laser position controller 5 so that the laser beam irradiates the cutout of the resistor 8 of the substrate 13 based on the signal from the recognition circuit.
ここで、図面に示すように基板１３の抵抗体８をＬ字状
に切断する場合の動作を説明する。認識回路２は、カメ
ラ１により抵抗体８の切り出し口１４の位置を認識し、
主制御装置４にその認識信号を与える。主制御装置４は
、前記認識信号を受信し、レーザ位置制御装置５を動作
させる。レーザ位置制御装置５は、主制御装置４からの
信号によりレーザ発生装置６を動作させると共に、レー
ザ発生装置６からのレーザ光が抵抗体８の切り出し口１
４に照射するように反射鏡７の設定角度を変化させる。Here, the operation when cutting the resistor 8 of the substrate 13 into an L-shape as shown in the drawings will be described. The recognition circuit 2 recognizes the position of the cutout 14 of the resistor 8 using the camera 1,
The recognition signal is given to the main controller 4. The main controller 4 receives the recognition signal and operates the laser position controller 5. The laser position control device 5 operates the laser generator 6 based on a signal from the main controller 4, and the laser beam from the laser generator 6 is directed to the cutout 1 of the resistor 8.
The setting angle of the reflecting mirror 7 is changed so that the light is irradiated onto the rays.
従って、レーザ光は主制御装置４およびレーザ位置制御
装置５の制御により抵抗体８の上をＬ字状に走査し、抵
抗体８を切断して電極９と電極１０間の抵抗値が予め定
めた値になったとき、レーザ光は停止する。このように
して、基板１３はレーザ光によりトリミングされる。Therefore, the laser beam scans the resistor 8 in an L-shape under the control of the main controller 4 and the laser position controller 5, cuts the resistor 8, and sets the resistance value between the electrodes 9 and 10 in advance. When the value is reached, the laser beam will stop. In this way, the substrate 13 is trimmed by laser light.
（へ）効果
本発明によれば、トリミング工程において基板を配置す
るだけでその基板、の種類を判別しミ切断の方式を選択
し、また切断位置を割り出すことができるので、従来の
ように基板の寸法のばらつきや印刷パターンのずれによ
る基板の不良品の発生がなくなり、基板の品質が向上す
る。(f) Effects According to the present invention, by simply placing the substrate in the trimming process, it is possible to determine the type of the substrate, select the cutting method, and determine the cutting position. This eliminates the occurrence of defective substrates due to variations in dimensions and misalignment of printed patterns, and improves the quality of substrates.
図面は、本発明の一実施例の全体の構成を示すブロック
図である。
ｌ・・・カメラ、２・・・認識回路、３・・・抵抗測定
器、４・・・主制御装置、５・・・レーザ位置制御装置
、６ レーザ発生装置、７・・・反射鏡、８・・・抵
抗体、９．１０・・・電極、１１．１２・・・探針、
１３・・・基板、１４・・・切り出し口。The drawing is a block diagram showing the overall configuration of an embodiment of the present invention. l... Camera, 2... Recognition circuit, 3... Resistance measuring device, 4... Main controller, 5... Laser position control device, 6 Laser generator, 7... Reflector, 8...Resistance
Antibody, 9.10... Electrode, 11.12... Probe,
13...Substrate, 14...Cutting opening.
Claims (1)
状態を見るために設置されたカメラと、前記カメラの出
力により前記抵抗体の配置を認識する認識手段と、前記
認識手段の出力により前記抵抗体をレーザ光により切り
出す位置を演算し、レーザ光を制御するレーザ位置制御
手段と、前記レーザ光により切断された前記抵抗体の抵
抗値を測定する測定手段と、前記測定手段の出力が予め
設定された値になったとき前記レーザ位置制御手段に信
号を与え、前記レーザ光を停止させる主制御手段とを含
むことを特徴とするレーザトリミング装置。a camera installed to view the arrangement of the resistors on the substrate to be trimmed with a laser beam; a recognition means for recognizing the arrangement of the resistors by the output of the camera; and a recognition means for recognizing the arrangement of the resistors by the output of the recognition means. a laser position control means for calculating a cutting position with a laser beam and controlling the laser beam; a measuring means for measuring a resistance value of the resistor cut by the laser beam; and an output of the measuring means is set in advance. 1. A laser trimming device comprising main control means for giving a signal to the laser position control means to stop the laser beam when the laser position control means reaches a certain value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59191254A JPS6167904A (en) | 1984-09-11 | 1984-09-11 | Laser trimming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59191254A JPS6167904A (en) | 1984-09-11 | 1984-09-11 | Laser trimming device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6167904A true JPS6167904A (en) | 1986-04-08 |
Family
ID=16271473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59191254A Pending JPS6167904A (en) | 1984-09-11 | 1984-09-11 | Laser trimming device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6167904A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04320008A (en) * | 1991-04-18 | 1992-11-10 | Rohm Co Ltd | Chip resistor recognition method |
| JP2010050373A (en) * | 2008-08-25 | 2010-03-04 | Seiko Instruments Inc | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
-
1984
- 1984-09-11 JP JP59191254A patent/JPS6167904A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04320008A (en) * | 1991-04-18 | 1992-11-10 | Rohm Co Ltd | Chip resistor recognition method |
| JP2010050373A (en) * | 2008-08-25 | 2010-03-04 | Seiko Instruments Inc | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
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