JPH0193193A - Resistance value adjusting method for printed resistor - Google Patents
Resistance value adjusting method for printed resistorInfo
- Publication number
- JPH0193193A JPH0193193A JP25034887A JP25034887A JPH0193193A JP H0193193 A JPH0193193 A JP H0193193A JP 25034887 A JP25034887 A JP 25034887A JP 25034887 A JP25034887 A JP 25034887A JP H0193193 A JPH0193193 A JP H0193193A
- Authority
- JP
- Japan
- Prior art keywords
- resistance value
- resistor
- printed resistor
- value
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract description 10
- 239000004020 conductor Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000010304 firing Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 3
- 239000000523 sample Substances 0.000 abstract description 3
- 238000001354 calcination Methods 0.000 abstract 2
- 238000005520 cutting process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、厚膜回路基板等における印刷抵抗体の抵抗
値調整方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for adjusting the resistance value of a printed resistor in a thick film circuit board or the like.
（従来の技術）
第７図は従来の厚膜回路基板の印刷抵抗体の抵抗値調整
方法を示す平面図で、第８図は印刷抵抗体部分における
断面図である。(Prior Art) FIG. 7 is a plan view showing a conventional method for adjusting the resistance value of a printed resistor of a thick film circuit board, and FIG. 8 is a sectional view of the printed resistor portion.
これら図において、符号１０１はセラミックや樹脂材料
などから成る基板、１０２ａ、１０２ｂは基板！０１上
に形成された導体、１０３はその両端部が上記各導体１
０２ａ、、１０２ｂとほぼ重なるように形成された印刷
抵抗体、１０４はレーザ光などでトリミングすることに
よって形成されたスリット、１０５ａ、１０５ｂは印刷
抵抗体１０３の抵抗値を測定するためのチエツク用端子
である。In these figures, reference numeral 101 is a substrate made of ceramic or resin material, and 102a and 102b are substrates! The conductor 103 formed on 01 has both ends connected to each of the conductors 1 above.
02a, 102b are printed resistors, 104 is a slit formed by trimming with a laser beam, etc. 105a, 105b are check terminals for measuring the resistance value of the printed resistor 103. It is.
このような構成において、導体１０２ａからス＋ｊット
１０４までの距離Ｈおよび、スリット１０４の切込み深
さＶの各々の値を適当に選択することによって印刷抵抗
体１０３の抵抗値を増加させ設定抵抗値に調整するよう
にしている。In such a configuration, by appropriately selecting the distance H from the conductor 102a to the slit 104 and the cutting depth V of the slit 104, the resistance value of the printed resistor 103 can be increased and the set resistance can be adjusted. I am trying to adjust it to the value.
（発明が解決しようとする問題点）
−数的に、印刷抵抗体を印刷する際、マザーペーストの
ブレンド比や印刷膜厚や形状により抵抗値にばらつきが
生じ易く、その抵抗値が設定抵抗値に比べて小さい時は
、上記した抵抗値の調整方法により抵抗値を増加させれ
ばよいが、逆に抵抗値が所定の抵抗値に比べて大きい時
は、従来の抵抗値調整方法では調整ができず、それ故に
印刷抵抗体を含む基板全体が使いものにならなくなると
いう問題点があった。(Problems to be solved by the invention) - Numerically, when printing a printed resistor, variations in resistance value tend to occur depending on the blend ratio of mother paste, printed film thickness, and shape, and the resistance value is the set resistance value. When the resistance value is smaller than the predetermined resistance value, the resistance value can be increased by using the above-mentioned resistance value adjustment method.On the other hand, when the resistance value is larger than the predetermined resistance value, it is not possible to adjust the resistance value using the conventional resistance value adjustment method. Therefore, there was a problem in that the entire board including the printed resistor became unusable.
この発明は上記のような問題点を解消するためになされ
たもので、印刷抵抗体の抵抗値が設定抵抗値に比べて大
きい場合には、抵抗値を減少させ設定抵抗値に調整でき
る印刷抵抗体の抵抗値調整方法を提供することを目的と
する。This invention was made in order to solve the above problems, and when the resistance value of the printed resistor is larger than the set resistance value, the printed resistor can be adjusted to the set resistance value by reducing the resistance value. The purpose of this invention is to provide a method for adjusting body resistance.
（問題点を解決するための手段）
この発明は上記の目的を達成するために、基板上の導体
間を接続するように設けられた印刷抵抗体上に、導体ペ
ーストを塗布焼成して前記導体間方向において所望長さ
の抵抗値調整用導体を付設ようにして、印刷抵抗体の抵
抗値を調整するようにしたものである。(Means for Solving the Problems) In order to achieve the above object, the present invention applies and bakes a conductive paste on a printed resistor provided to connect conductors on a substrate, thereby connecting the conductors. The resistance value of the printed resistor is adjusted by attaching a resistance value adjusting conductor of a desired length in the direction between the printed resistors.
（発明の実施例） 以下、この発明の一実施例を図面に基づいて説明する。(Example of the invention) Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図はこの発明の一実施例に係る印刷抵抗体の抵抗値
調整方法を示す斜視図、第２図は印刷抵抗体部分におけ
る断面図である。FIG. 1 is a perspective view showing a method for adjusting the resistance value of a printed resistor according to an embodiment of the present invention, and FIG. 2 is a sectional view of the printed resistor portion.
これらの図において、符号ｌは基板、２ ａ、 ２ ｂ
は基板ｌ上に形成された導体、３はその抵抗値が調整さ
れる印刷抵抗体である。In these figures, the symbol l is the substrate, 2 a, 2 b
3 is a conductor formed on the substrate l, and 3 is a printed resistor whose resistance value is adjusted.
抵抗値調整装置Ｘは、第３図にも示すように、導体ペー
スト塗布装置４と導体ペースト焼成装置５と抵抗計６と
、さらに各装置４．５および抵抗計６に接続され、抵抗
計６からの抵抗値信号に基づいて各装置４．５に作動信
号を与えるコントローラ７とから構成されている。As shown in FIG. 3, the resistance value adjusting device and a controller 7 which provides an activation signal to each device 4.5 based on the resistance value signal from the controller 7.
上記導体ペースト塗布装置４は、第１図に示すノズル８
と、図示しないノズル８の接続されるペーストタンク、
ペースト送り出し用のポンプ、ノズルの移動機構等から
構成されている。導体ペースト焼成装置５は抵抗体３の
切断装置にも兼用されるもので、第１図に示すレーザー
光の集光レンズ９と、図示しないレーザー光発光部、レ
ーザー光の照射位置移動機構等から構成されている。抵
抗計６は、リード線１０を介して接続されるプローブ１
１を一体に備えている。コントローラ７は、ＣＰＵＳＲ
ＯＭ、ＲＡＭから構成されており、抵抗計６からの抵抗
値信号に基づいて、導体ペースト塗布装置４のポンプ、
ノズルの移動機構、さらにはペースト焼成装置５のレー
ザー光発光部、照射位置移動機構に、動作プログラムに
基づいて駆動信号を出力するようになっている。The conductive paste application device 4 has a nozzle 8 shown in FIG.
and a paste tank to which a nozzle 8 (not shown) is connected,
It consists of a pump for feeding paste, a nozzle moving mechanism, etc. The conductor paste baking device 5 is also used as a cutting device for the resistor 3, and includes a laser beam condensing lens 9 shown in FIG. 1, a laser beam emitting section (not shown), a laser beam irradiation position moving mechanism, etc. It is configured. The resistance meter 6 is connected to the probe 1 via a lead wire 10.
1 is integrated. Controller 7 is CPUSR
It is composed of OM and RAM, and based on the resistance value signal from the resistance meter 6, the pump of the conductor paste application device 4,
A drive signal is output to the nozzle moving mechanism, further to the laser light emitting section of the paste baking device 5, and to the irradiation position moving mechanism based on the operation program.
以下、抵抗値の調整動作について、第４図のコントロー
ラの動作を示すフローチャートを参照して説明する。The resistance value adjustment operation will be described below with reference to the flowchart shown in FIG. 4 showing the operation of the controller.
まず、抵抗値調整装置位置に印刷抵抗体３が所定の位置
に設けられた回路基板が供給されると、導体２ａ 、２
ｂそれぞれの端部に形成されたチエツク用端子１２それ
ぞれに抵抗計６のプローブ１１それぞれを接続する。First, when a circuit board with a printed resistor 3 provided at a predetermined position is supplied to the resistance value adjusting device position, the conductors 2a, 2
(b) Connect the probes 11 of the resistance meter 6 to the check terminals 12 formed at each end.
そして抵抗計６により計測される抵抗値が設定値と等し
いかどうかを判別しくステップり、等しい場合には何も
動作を行うことなく動作を終了する。等しくない場合は
、さらに抵抗値が設定値より大きいかどうかを判別しく
ステップ２）、大きい場合には導体ペースト塗布装置４
、導体ペースト焼成装置５に塗布焼成開始信号が出力さ
れる（ステップ３）。この信号により導体ペースト塗布
装置４、導体ペースト焼成装置５は作動を開始し、移動
するノズル８から連続状態に導体ペースト１３が抵抗体
３上に塗布され、その塗布された導体ペース）１３は移
動状態で照射されるレーザー光により逐次焼成されて抵
抗体３上に抵抗値調整用導体！３が付設されていく（ス
テップ４）。Then, a step is performed to determine whether the resistance value measured by the resistance meter 6 is equal to the set value, and if the resistance value is equal to the set value, the operation is ended without performing any operation. If they are not equal, it is further determined whether the resistance value is greater than the set value (Step 2), and if it is greater, the conductor paste application device 4
A coating and firing start signal is output to the conductor paste firing device 5 (step 3). In response to this signal, the conductor paste application device 4 and the conductor paste baking device 5 start operating, and the conductor paste 13 is continuously applied onto the resistor 3 from the moving nozzle 8, and the applied conductor paste 13 is moved. A conductor for adjusting the resistance value is formed on the resistor 3 by successively firing the laser beam irradiated in the state! 3 is added (step 4).
この塗布、焼成動作を行なっている際にも抵抗計６での
抵抗値測定は行っており、抵抗値調整用導体１３が付設
されて抵抗値が減少していき設定値と等しくなったと判
断すると（ステップ５）、導体ペースト塗布装置４およ
び導体ペースト焼成装置５に停止信号を出力しくステッ
プ６）、この停止信号により両装置４，５は停止される
（ステップ７）。During this coating and firing operation, the resistance value is also measured using the resistance meter 6, and when the resistance value is determined to be equal to the set value as the resistance value decreases by attaching the resistance value adjustment conductor 13, the resistance value is measured. (Step 5), a stop signal is output to the conductor paste application device 4 and the conductor paste baking device 5 (Step 6), and both devices 4 and 5 are stopped by this stop signal (Step 7).
ステップ２で抵抗値が設定値より小さいと判断すると、
導体ペースト焼成装置５に切断開始信号を出力しくステ
ップ８）、これにより導体ペースト焼成装置５からのレ
ーザー光により抵抗体３の所定位置が従来例で示したよ
うに切断されてスリットが形成されていき（ステップ９
）、この場合も抵抗計６において抵抗値が継続して測定
され、抵抗値が増大して設定値に等しくなったと判断す
ると（ステップｌＯ）、停止信号を出力して（ステッブ
１１）導体ペースト焼成装置５の切断動作が停止される
（ステップ１２）。If it is determined in step 2 that the resistance value is smaller than the set value,
A cutting start signal is outputted to the conductive paste firing device 5 (step 8), whereby a predetermined position of the resistor 3 is cut by the laser beam from the conductive paste firing device 5, as shown in the conventional example, and a slit is formed. Iki (Step 9)
), in this case as well, the resistance value is continuously measured by the resistance meter 6, and when it is determined that the resistance value increases and becomes equal to the set value (step lO), a stop signal is output (step 11) and the conductor paste is fired. The cutting operation of the device 5 is stopped (step 12).
上記のようにして、設けられた抵抗体３の抵抗値が設定
値より大きい場合には抵抗値調整用導体１３を付設して
抵抗値を減少し、設定値より小さい場合はスリットを設
けて抵抗値を増大し、抵抗値を自動的に設定値に調整す
るものである。As described above, if the resistance value of the provided resistor 3 is larger than the set value, the resistance value adjustment conductor 13 is attached to reduce the resistance value, and if it is smaller than the set value, a slit is provided to resist the resistance value. The resistance value is automatically adjusted to the set value.
抵抗体３上への抵抗値調整用導体１３の付設形態は、第
５図、第６図に示すように適宜であってよいが、抵抗体
３の抵抗値の大小は両導体２ａ。The resistance value adjusting conductor 13 may be attached to the resistor 3 in any suitable manner as shown in FIGS. 5 and 6, but the resistance value of the resistor 3 is determined by both conductors 2a.
２ｂ間方向における抵抗値調整用導体１３の長さ（両導
体２ａ 、２ｂ間方向における抵抗体３の抵抗値調整用
導体の設けられない部分の長さ）に由来するので、第１
図に示すように抵抗値調整用導体１３が近接して設けら
れるものではその長さが徐々に増加していって抵抗値も
徐々に減少していくので、抵抗値の微調整が可能となり
、第５図、第６図に示すものでは微調整は行われないも
のの、順次調整スピードが高められる構成となっている
。Because it originates from the length of the resistance value adjustment conductor 13 in the direction between both conductors 2a and 2b (the length of the portion of the resistor 3 where the resistance value adjustment conductor is not provided in the direction between both conductors 2a and 2b), the first
As shown in the figure, when the resistance value adjustment conductor 13 is provided close to each other, the length thereof gradually increases and the resistance value gradually decreases, so that fine adjustment of the resistance value is possible. Although fine adjustment is not performed in the configurations shown in FIGS. 5 and 6, the adjustment speed is gradually increased.
（発明の効果）
以上のように、この発明によれば、印刷抵抗体上に導体
ペーストを塗布して焼成することにより抵抗調整用導体
を設けて印刷抵抗体の抵抗値を減少できるようにしたの
で、マザーペーストのブレンド比や印刷時の印刷膜厚や
形状誤差により印刷抵抗体の抵抗値が所定の抵抗値に比
べて大きく仕上がった場合も、その抵抗値の低減調整が
容易にできるようになった。(Effects of the Invention) As described above, according to the present invention, the resistance value of the printed resistor can be reduced by applying a conductor paste on the printed resistor and baking it to provide a resistance adjustment conductor. Therefore, even if the resistance value of the printed resistor is higher than the specified resistance value due to the blend ratio of the mother paste, printing film thickness or shape error during printing, the resistance value can be easily adjusted to reduce it. became.
第１図ないし第６図は本発明の実施例に係り、第１図は
印刷抵抗体の抵抗値調整方法を示す斜視図、第２図は印
刷抵抗体部分における断面図、第３図は抵抗値調整装置
の構成を示すブロック図、第４図はコントローラＣＰＵ
の動作を示すフローチャート、第５図、第６図は抵抗値
調整用導体の異なる付設形、態を示す平面図である。
第７図、第８図は従来例に係り、第７図は抵抗値調整方
法を示す平面図、第８図は印刷抵抗体部分における断面
図である。
ｌは基板、
２ａ 、２ｂは導体、
３は印刷抵抗体、
１３は導体ペースト。1 to 6 relate to embodiments of the present invention, FIG. 1 is a perspective view showing a method for adjusting the resistance value of a printed resistor, FIG. 2 is a sectional view of the printed resistor, and FIG. 3 is a resistor. A block diagram showing the configuration of the value adjustment device, Fig. 4 shows the controller CPU
FIGS. 5 and 6 are plan views showing different attachment forms and configurations of the resistance value adjusting conductor. 7 and 8 relate to a conventional example, FIG. 7 is a plan view showing a resistance value adjustment method, and FIG. 8 is a sectional view of a printed resistor portion. 1 is a substrate, 2a and 2b are conductors, 3 is a printed resistor, and 13 is a conductor paste.
Claims (1)
抵抗体上に、導体ペーストを塗布焼成して前記導体間方
向において所望長さの抵抗値調整用導体を付設して行う
印刷抵抗体の抵抗値調整方法。(1) Printed resistance made by applying and firing a conductive paste onto a printed resistor provided to connect between conductors on a substrate, and attaching a resistance value adjusting conductor of a desired length in the direction between the conductors. How to adjust body resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25034887A JPH0193193A (en) | 1987-10-02 | 1987-10-02 | Resistance value adjusting method for printed resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25034887A JPH0193193A (en) | 1987-10-02 | 1987-10-02 | Resistance value adjusting method for printed resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193193A true JPH0193193A (en) | 1989-04-12 |
Family
ID=17206577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25034887A Pending JPH0193193A (en) | 1987-10-02 | 1987-10-02 | Resistance value adjusting method for printed resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193193A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8220529B2 (en) | 2005-12-14 | 2012-07-17 | Kyungdong Navien Co., Ltd. | Heat exchanger of condensing boiler for heating and hot-water supply |
| JP2016066743A (en) * | 2014-09-25 | 2016-04-28 | Koa株式会社 | Chip resistor |
| JP2016072298A (en) * | 2014-09-26 | 2016-05-09 | Koa株式会社 | Manufacturing method of chip resistor |
| US10109398B2 (en) | 2014-09-25 | 2018-10-23 | Koa Corporation | Chip resistor and method for producing same |
-
1987
- 1987-10-02 JP JP25034887A patent/JPH0193193A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8220529B2 (en) | 2005-12-14 | 2012-07-17 | Kyungdong Navien Co., Ltd. | Heat exchanger of condensing boiler for heating and hot-water supply |
| JP2016066743A (en) * | 2014-09-25 | 2016-04-28 | Koa株式会社 | Chip resistor |
| US10109398B2 (en) | 2014-09-25 | 2018-10-23 | Koa Corporation | Chip resistor and method for producing same |
| JP2016072298A (en) * | 2014-09-26 | 2016-05-09 | Koa株式会社 | Manufacturing method of chip resistor |
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