JPS62174902A - Trimming of thick film resistance element - Google Patents
Trimming of thick film resistance elementInfo
- Publication number
- JPS62174902A JPS62174902A JP61016568A JP1656886A JPS62174902A JP S62174902 A JPS62174902 A JP S62174902A JP 61016568 A JP61016568 A JP 61016568A JP 1656886 A JP1656886 A JP 1656886A JP S62174902 A JPS62174902 A JP S62174902A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- trimming
- film resistor
- resistance value
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009966 trimming Methods 0.000 title claims description 26
- 238000000034 method Methods 0.000 claims description 18
- 238000005259 measurement Methods 0.000 claims description 10
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は２厚膜抵抗体を所定の抵抗値に調整す乙ため
のトリミング方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a trimming method for adjusting a two-thick film resistor to a predetermined resistance value.
絶縁基板の上の厚膜抵抗体の抵抗値調整法として、第３
図〜第５図で示すような、いゆるトリミング法が従来か
ら実施されている。即ち。The third method for adjusting the resistance value of a thick film resistor on an insulating substrate is
A so-called trimming method as shown in FIGS. 5 to 5 has been practiced in the past. That is.
予め端子電極３．４間の抵抗値が目標値より低めになる
よう厚膜抵抗体ｌを形成しておき、上記端子電極３．４
で抵抗値を測定しながら、厚膜抵抗体１にレーザビーム
等で切溝２ａ、 ２ｂ・・・・を入れる。これによって
、端子電極３，４間の抵抗値を高め、抵抗値を目標の範
囲に収める調整法である。The thick film resistor l is formed in advance so that the resistance value between the terminal electrodes 3.4 is lower than the target value, and the
While measuring the resistance value, cut grooves 2a, 2b, etc. are made in the thick film resistor 1 using a laser beam or the like. This is an adjustment method that increases the resistance value between the terminal electrodes 3 and 4 and keeps the resistance value within a target range.
このトリミング法では、抵抗値の精度を高めるため、切
溝２ａ、 ２ｂ・・・−のパターンに様々な工夫がなさ
れている。特に、調整量が比校的小さい場合には、高い
精度を得るため、粗調整と微調整手段とを含むものが使
用される。In this trimming method, various improvements are made to the patterns of the kerfs 2a, 2b, . . . in order to improve the accuracy of the resistance value. In particular, when the amount of adjustment is relatively small, a device that includes coarse adjustment and fine adjustment means is used in order to obtain high accuracy.
例えば、第３図は、厚膜抵抗体１を幡断するよう同じ方
向から２本の切溝２ａ、 ２ｂを入れる。For example, in FIG. 3, two grooves 2a and 2b are cut from the same direction to cut through the thick film resistor 1.
いわゆるダブルカットであり、また、第４図は。This is a so-called double cut, and Figure 4 shows it.
厚膜抵抗体１を縦断するよう切溝２ａを入れた後。After cutting grooves 2a are cut vertically through the thick film resistor 1.
これと直角に切溝２ｃを入れる。いわゆるＬカソトであ
る。これらの場合、最初の切溝２ａによって粗調整が行
われ、これに続く切溝２ｂ、２ｃによって微調整が行わ
れる。Cut groove 2c is made perpendicular to this. This is the so-called L Kasoto. In these cases, coarse adjustment is performed by the first kerf 2a, and fine adjustment is performed by the subsequent kerfs 2b and 2c.
さらに、第５図で示すように、粗調整用の抵抗膜１ａと
、これよりシート抵抗の低い微調整用の抵抗１ｆｆｌ
１ ｂとを直列（または並列）に接続して厚膜抵抗体１
を構成し、それぞれの抵抗膜１ａ＋１ｂについて上記の
ようなトリミングを行う方法も提案されている。Furthermore, as shown in FIG.
1 b in series (or in parallel) to form a thick film resistor 1
A method has also been proposed in which the above-mentioned trimming is performed for each of the resistive films 1a+1b.
なお、トリミングにより調整する抵抗値に成る程度の幅
があるときは、大きな調整量を得るため、対向する２辺
から厚膜抵抗体１を縦断するよう、それぞれ切溝２ａ、
２ｂをいれる。いわゆるサーペンタインカットが採用
される。Note that when there is a width that can reach the resistance value to be adjusted by trimming, in order to obtain a large amount of adjustment, cut grooves 2a,
Add 2b. A so-called serpentine cut is used.
Ｃ発明が解決しようとする問題点〕
混成！Ｊ積回路の小型化の要請に伴い、ｉ膜抵抗体の抵
抗値について高い精度が要請されている。しかし、従来
のトリミング法では、カット時に生じる微細なりランク
等に起因する抵抗値のドリフトによって、ｉｍｍ後後抵
抗値が成る程度ばらつく。例えば、第３図や第４図で示
すよ・うに、端子電極３．４の間の厚膜抵抗体１にダブ
ルカットやＬカット等の切溝２ａ、 ２ｂ・−を入れる
従来のトリミング法によって調整可能な抵抗値の精度は
、上０゜５％が限度である。さらに。Problems that invention C attempts to solve] Hybrid! With the demand for downsizing of J-product circuits, high accuracy is required for the resistance value of the i-film resistor. However, in the conventional trimming method, the resistance value after immming varies to a certain degree due to a drift in the resistance value due to minuteness, rank, etc. that occurs during cutting. For example, as shown in FIGS. 3 and 4, the conventional trimming method involves cutting grooves 2a, 2b, etc., such as double cuts or L cuts, in the thick film resistor 1 between the terminal electrodes 3.4. The accuracy of the adjustable resistance value is limited to 0.5% above. moreover.
サーペンタインカットによる切？１１２ａ、１２ｂ ・
・・を入れたものでは、上２゜０％が限度である。Cut by serpentine cut? 112a, 12b ・
For those that include ..., the upper limit is 2°0%.
他方、第５図で示すトリミング法では、ダブルカットや
Ｌカットによる切溝２ａ、 ２ｂ・・・を使用した場合
に上０゜３５％と、高い精度が得られる。On the other hand, in the trimming method shown in FIG. 5, high accuracy of 0°35% can be obtained when double cuts or L cuts are used to cut the grooves 2a, 2b, . . . .
しかし、シート抵抗の異なる２つの抵抗膜１ａ＋１５を
設けなければならないため、２回に分けて抵抗ペースト
を印刷する必要がある等、工数の増加を招くという欠点
があった。However, since it is necessary to provide two resistive films 1a+15 with different sheet resistances, there is a drawback that the number of man-hours increases, such as the need to print the resistive paste twice.
この発明は、上記従来の問題を解決するためなされたも
ので１第３図や第４図のトリミング方法を実施する場合
とは一′同等の工数で厚膜抵抗体を形成することができ
、しかも第５図で示したトリミング方法と同等或いはそ
れ以上の高い精度が得られるトリミング方法を提供する
ことを目的とする。This invention has been made to solve the above-mentioned conventional problems. 1. It is possible to form a thick film resistor in the same number of steps as in the case of implementing the trimming method shown in FIGS. 3 and 4. Moreover, it is an object of the present invention to provide a trimming method that can obtain a precision equal to or higher than that of the trimming method shown in FIG.
この発明によるトリミング方法を第１図と第２図の符号
を引用しながら説明すると、まず予め端子電極１３．１
４の間に１つ以上の測定用電極１５ａ、１５ｈ・−が設
けられた厚膜抵抗体を作る。そして、上記端子電極１３
．１４と測定用電極１５ａ、１５ｂ・・とで分割された
各区間１６ａ、１６ｂ・・・−の抵抗値を測定しながら
、当該区間１６ａ、１６ｂ ・・・に屈する厚膜抵抗体
１１に切溝１２ａ、１．２ｂ・・・−を入れ、その抵抗
値をそれぞれ目標値に調整する。これによって。The trimming method according to the present invention will be explained with reference to the reference numerals in FIGS. 1 and 2. First, the terminal electrode 13.1 is
A thick film resistor is fabricated in which one or more measurement electrodes 15a, 15h, - are provided between the electrodes 15a, 15h. Then, the terminal electrode 13
．． While measuring the resistance value of each section 16a, 16b...- divided by the measurement electrode 14 and the measurement electrodes 15a, 15b..., cut grooves are cut into the thick film resistor 11 that bends to the section 16a, 16b... 12a, 1.2b...- and adjust their resistance values to their respective target values. by this.
総体的に端子電極１３．１４間の抵抗値を目標値に近づ
ける。Overall, the resistance value between the terminal electrodes 13 and 14 is brought closer to the target value.
（作 用〕
この発明によるトリミング方法では、各区間１６ａ、
Ｌ６ｂ・・・−で生じる抵抗値のばらつきが、互いに相
殺されるため、何れのカットパターンを使用した場合で
も、第３図や第４図で示すように。(Function) In the trimming method according to the present invention, each section 16a,
Since the variations in resistance values occurring in L6b...- cancel each other out, no matter which cut pattern is used, as shown in FIGS. 3 and 4.
端子電極１３．１４間のみでトリミングを行う場合に比
べて高精度の抵抗値が得られる。A more accurate resistance value can be obtained than when trimming is performed only between the terminal electrodes 13 and 14.
しかも、上記厚膜抵抗体１１は、シート抵抗の等しい単
一の抵抗膜からなっているため、端子電極１３．１．４
や測定用電極１．５ａ、１５ｂ・・・−を印刷した上に
抵抗ペーストを一度印刷するだけで形成することができ
る。Moreover, since the thick film resistor 11 is composed of a single resistive film having an equal sheet resistance, the terminal electrodes 13.1.4
The electrodes 1.5a, 15b, . . . for measurement can be formed by simply printing the resistance paste once.
次に２図面を参照しながら、この発明の実施例と望まし
い実施態様について説明する。Next, examples and preferred embodiments of the present invention will be described with reference to two drawings.
まず、絶縁基板の上に端子電極１３．１４と測定用電極
１５ａ、 １５ｂ・・・−を印刷した後、この上にＲｕ
Ｏ２等を主体とする抵抗ペーストを印刷し、これを焼き
付けて厚膜抵抗体１１を形成する。First, after printing terminal electrodes 13, 14 and measurement electrodes 15a, 15b...- on an insulating substrate, Ru
The thick film resistor 11 is formed by printing a resistor paste mainly composed of O2 or the like and baking it.
上記測定用電極１５ａ、 １５ｂ−は、厚膜抵抗体１１
を横断するよう端子電極１３．１４の間に設けられ。The measurement electrodes 15a, 15b- are the thick film resistor 11
is provided between the terminal electrodes 13 and 14 so as to cross the terminal electrodes 13 and 14.
端子電極１３．１４の間の厚膜抵抗体１１を複数の区間
１６ａ、１６ｂ・−に分割する。第１図と第２図の実施
例では、何れも２本の測定用電極１５ａ、１５ｂが設け
られ、端子電極１３．１４間が３つの区間１６ａ。The thick film resistor 11 between the terminal electrodes 13, 14 is divided into a plurality of sections 16a, 16b, -. In the embodiments shown in FIGS. 1 and 2, two measurement electrodes 15a and 15b are provided, and three sections 16a are provided between the terminal electrodes 13 and 14.
１６ｂ・・・に分割されている。なお、各区間１．６ａ
、１６ｂ・・・の長さは、それぞれ任意に設定できるが
１等間隔であれば後述するように、目標値ｒ１．ｒ２・
・・を何れも等しく設定することができる。It is divided into 16b... In addition, each section 1.6a
, 16b, . . . can be set arbitrarily, but if they are at equal intervals, the target value r1. r2・
. . . can be set equally.
次に、各区間１６ａ、１６ｂ ・・・についてそれぞれ
抵抗の目標値ｒＩ＋ ｒ２・・−を定め、これにでき
るだけ近づくように、端子電極１３．１４または測定用
電極１５ａ、１５ｂ ・・・の間で抵抗値を測定しなが
ら。Next, a target value rI+r2...- of resistance is determined for each section 16a, 16b..., respectively, and between the terminal electrodes 13.14 or the measurement electrodes 15a, 15b... While measuring the resistance value.
各区間１６ａ、 １６ｂ−でトリミングを行う。各区間
１６ａ、 １６ｂ−の抵抗の目標値ｒｌ＋ ｒ２””
は、端子電極１３．１４の間の目標値Ｒをもとに、Ｒ＝
Σｒｎ （ｎは区間の数）となるよう設定する。例えば
、第１図と第２図の実施例の場合は、ｎ＝３であり１区
間１６ａ、１６ｂ−の距離が何れも等しいことから、ｒ
ｌ ：ｒ２ ：ｒ３ ＝Ｒ／３とする。Trimming is performed in each section 16a, 16b-. Target value of resistance rl+r2'' for each section 16a, 16b-
is based on the target value R between the terminal electrodes 13 and 14, R=
Set so that Σrn (n is the number of sections). For example, in the case of the embodiments shown in FIGS. 1 and 2, since n=3 and the distances of one section 16a and 16b- are equal, r
Let l:r2:r3=R/3.
なお、各区間１６ａ、１６ｂ・・・・の抵抗値の測定は
。Note that the resistance values of each section 16a, 16b, . . . are measured.
必ずしも隣接する電極１３．１４．１５・・・・毎に行
う必要はない。例えば１区間１６ａをトリミングした後
１区間１６ｂについては、端子電極１３と測定用電極１
５ｂ間で抵抗値を測定しながらｒｒｌ ＋ｒ２の目標値
に近づくようトリミングを実施することも可能である。It is not necessarily necessary to perform this for each adjacent electrode 13, 14, 15, . . . . For example, after trimming one section 16a, for one section 16b, the terminal electrode 13 and the measurement electrode 1
It is also possible to perform trimming to approach the target value of rrl + r2 while measuring the resistance value between 5b.
トリミングによる切＞１１２ａ、１２ｂ・・・のパター
ンは、一般のダブルカット、Ｌカットサーペンタインカ
ット等、必要に応じて適宜のものを選択することができ
る。例えば、第１図の実施例では、いわゆるダブルカッ
トが、また、第２図の実施例では、いわゆるサーペンタ
インカットが採用されている。As for the trimming pattern >112a, 12b, etc., an appropriate pattern such as a general double cut, an L-cut serpentine cut, etc. can be selected as necessary. For example, the embodiment shown in FIG. 1 uses a so-called double cut, and the embodiment shown in FIG. 2 uses a so-called serpentine cut.
本件発明者が目標値Ｒ＝ｒ１＋ｒ２ ＋ｒ３−９にΩの
厚膜抵抗体１１について２本件発明のトリミング法を実
際に実施した結果、第１図のいわゆるダブルカットでは
、上記目標値Ｒに対して、厚膜抵抗体１１の抵抗値を全
て誤差±０．３％以内に収めることができた。また、第
２図のサーペンタインカットでは、上記目標値Ｒに対し
て、厚膜抵抗体１１の抵抗値を全て誤差±１．２％以内
に収めることができた。As a result of actually carrying out the trimming method of the present invention on two thick film resistors 11 with a target value R=r1+r2 +r3-9 and Ω, the inventor of the present invention found that in the so-called double cut shown in FIG. The resistance values of the thick film resistor 11 could all be kept within an error of ±0.3%. Further, in the serpentine cut shown in FIG. 2, all the resistance values of the thick film resistor 11 could be kept within an error of ±1.2% with respect to the target value R.
以上説明した通り、この発明によれば、トリミングによ
って精度の高い抵抗値が得られる。As explained above, according to the present invention, a highly accurate resistance value can be obtained by trimming.
しかも、ｉ１！子電極１３．１４と同時に測定用電極１
５ａ１１５ｂ−を印刷し、その上から厚膜抵抗体１１を
１回印刷するだけで厚膜抵抗体１１を形成することがで
きる。このため、第５図で示すような従来のトリミング
方法のように、厚膜抵抗体の印刷工数の増加を伴わない
。Moreover, i1! Measuring electrode 1 at the same time as child electrodes 13 and 14
The thick film resistor 11 can be formed by simply printing 5a115b- and printing the thick film resistor 11 on top of it once. Therefore, unlike the conventional trimming method shown in FIG. 5, the number of printing steps for thick film resistors does not increase.
第１図と第２図は、この発明の各実施例を示すトリミン
グ後の厚膜抵抗体の平面図、第３図〜第５図は、トリミ
ング方法の従来例を示すトリミング後の厚膜抵抗体の平
面図である。
１１・・・・厚膜抵抗体 １２ａ、 １２ｂ −
切溝１３、１４・・・・端子電極 １５ａ、 １５
ｂ・・−測定用電極１６ａ、１６ｂ −厚膜抵抗体の分
割された区間発明者 寄木 敬史1 and 2 are plan views of thick film resistors after trimming showing each embodiment of the present invention, and FIGS. 3 to 5 are plan views of thick film resistors after trimming showing conventional examples of trimming methods. It is a top view of a body. 11... Thick film resistor 12a, 12b -
Cut grooves 13, 14...terminal electrodes 15a, 15
b... - Measuring electrodes 16a, 16b - Divided sections of thick film resistor Inventor: Takashi Yoriki
Claims (1)
同抵抗体１１の端子電極１３、１４の間の抵抗値を目標
値に調整する厚膜抵抗体のトリミング方法において、端
子電極１３、１４の間に１つ以上の測定用電極１５ａ、
１５ｂ・・・を設け、上記端子電極１３、１４と測定用
電極１５ａ、１５ｂ・・・とで分割された各区間１６ａ
、１６ｂ・・・の抵抗値を測定しながら、当該区間１６
ａ、１６ｂ・・・に属する厚膜抵抗体１１に切溝１２ａ
、１２ｂ・・・を入れ、各区間毎の抵抗値をそれぞれ目
標値に調整することを特徴とする厚膜抵抗体のトリミン
グ方法。Cut grooves 12a, 12b... are placed in the thick film resistor 11,
In the thick film resistor trimming method for adjusting the resistance value between the terminal electrodes 13 and 14 of the resistor 11 to a target value, one or more measurement electrodes 15a are provided between the terminal electrodes 13 and 14,
15b... are provided, and each section 16a is divided by the terminal electrodes 13, 14 and the measuring electrodes 15a, 15b...
, 16b... while measuring the resistance value of the section 16.
A kerf 12a is formed in the thick film resistor 11 belonging to a, 16b...
, 12b, . . . and adjusting the resistance value of each section to a target value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61016568A JPS62174902A (en) | 1986-01-28 | 1986-01-28 | Trimming of thick film resistance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61016568A JPS62174902A (en) | 1986-01-28 | 1986-01-28 | Trimming of thick film resistance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62174902A true JPS62174902A (en) | 1987-07-31 |
Family
ID=11919891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61016568A Pending JPS62174902A (en) | 1986-01-28 | 1986-01-28 | Trimming of thick film resistance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174902A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01106793U (en) * | 1988-01-08 | 1989-07-18 | ||
| JPH02122687A (en) * | 1988-11-01 | 1990-05-10 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPH02148801A (en) * | 1988-11-30 | 1990-06-07 | Taiyo Yuden Co Ltd | 3-terminal type thick film resistor and trimming method therefor |
| JP2011096814A (en) * | 2009-10-29 | 2011-05-12 | Koa Corp | Method of manufacturing chip resistor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119608A (en) * | 1982-01-11 | 1983-07-16 | 株式会社日立製作所 | Method of trimming thick film resistor |
-
1986
- 1986-01-28 JP JP61016568A patent/JPS62174902A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119608A (en) * | 1982-01-11 | 1983-07-16 | 株式会社日立製作所 | Method of trimming thick film resistor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01106793U (en) * | 1988-01-08 | 1989-07-18 | ||
| JPH02122687A (en) * | 1988-11-01 | 1990-05-10 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPH02148801A (en) * | 1988-11-30 | 1990-06-07 | Taiyo Yuden Co Ltd | 3-terminal type thick film resistor and trimming method therefor |
| JP2011096814A (en) * | 2009-10-29 | 2011-05-12 | Koa Corp | Method of manufacturing chip resistor |
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