JPH04192504A - Manufacture of hybrid ic and resistor - Google Patents

Abstract

PURPOSE:To facilitate the fine adjustment of a resistance value by providing a resistor which is placed in a through hole that is formed in a substrate and a conductor pattern provided at both sides of the resistor. CONSTITUTION:In a hybrid IC comprising a resistor 5 which is packed in a through hole 41 in a substrate 4 and a conductor pattern 6 provided on both sides of the resistor 5, the resistance of the IC is produced across the resistor 5 and the conductor pattern 6 deposited on both sides of the resistor. In this instance, after the resistor 5 has been formed by filling the through hole 41 in the substrate 4 with a paste-like resistor material, the conductor pattern 6 is deposited on both sides of the resistor 5. With this structure, the resistor has a smaller resistance value using typical paste-like resistor materials, and its resistance value can be easily fine adjusted.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a hybrid integrated circuit in which a thick film resistor is formed on a substrate, particularly a method for forming a resistor with a low resistance value and a method for adjusting the resistance value, using an ordinary paste-like resistor material. The purpose of this invention is to provide a resistor formation method that allows a resistor with a low resistance value to be obtained and that allows for easy fine adjustment of the resistance value. A hybrid integrated circuit having at least a resistor filled in a through hole provided in a substrate and a conductor pattern provided on both sides of the resistor is constructed by a resistor forming method in which conductor patterns are formed on both sides of the resistor. The conductor pattern is formed in a comb-like pattern, and the resistance value is adjusted by cutting the comb-like patterns.

[Industrial application field]

The present invention relates to a hybrid integrated circuit in which a thick film resistor is formed on a substrate, and more particularly to a method for forming a resistor with a low resistance value and a method for adjusting the resistance value.

When attempting to form a thick film resistor with a low resistance value on a substrate in a hybrid integrated circuit, the width of the resistor may become extremely large compared to the length of the resistor, making it impossible to form the resistor using ordinary paste-like resistor materials. If a pasty resistance material with a low sheet resistance value is used, it may be possible to form such a resistance, or it may be complicated to use a different resistance material when forming other resistances.

Therefore, there is a need to establish a resistor formation method that allows a resistor with a low resistance value to be obtained using an ordinary paste-like resistor material and that allows fine adjustment of the resistance value.

[Conventional technology]

FIG. 2 is a circuit diagram showing an example of a hybrid integrated circuit, and FIG. 3 is a plan view showing a conventional method of forming a resistor.

For example, in a hybrid integrated circuit that converts a current i of several amperes into voltage as shown in FIG. There is a problem in that as the electric power increases, the potential difference between both ends of the resistor Ra becomes too large. Therefore, the resistance value of the resistor Ra in such a circuit is required to be approximately 0.2Ω.

In the conventional resistor forming method, as shown in FIG. 3, a planar resistor 3 is formed by printing and baking a paste-like resistor material on a conductor pattern 2 formed on a substrate. The characteristics of a resistive material made of glass powder, ruthenium oxide, etc. are usually expressed as sheet resistance, that is, a resistance value when the width and length of a resistor formed to a thickness of about 20 μm are equal.

Assuming that the width of the resistor 3 is W, the length is W, the thickness is t, and the sheet resistance of the resistive material is Rs, the resistance value R is as follows. For example, sheet resistance Rs or 300Ω resistance material with thickness t or 20
When forming a resistor of μm, the ratio of length to width W for the above-mentioned resistor of about 0.2Ω is L/W=0.2/3
00=1/1500 That is, even if the length is 1 mm, the width W will be 1.5 meters, and such a resistor cannot be formed.

If a resistor with a thickness of t or 20 μm is formed using a resistive material with a sheet resistance of Rs or 10Ω, L/W = 0.2.
/IQ=1150 That is, if the length L is 1 mm, the width W must be 50 mm, so it is possible to form the resistor material or the resistor material must be used separately from the resistor material for forming other resistors. Furthermore, as the width W increases, the resistance of the conductor pattern 2 connected to the resistor 3 cannot be ignored. The resistance of the conductor pattern is usually 20
It has a temperature coefficient of about 00 ppm/'C, and the resistance value of the resistor 3 varies depending on the temperature coefficient of the conductor pattern.

[Invention or problem to be solved]

As mentioned above, although there is a desire to form a resistor with a low resistance value in a hybrid integrated circuit, there is a problem in that it is not possible to form a resistor with a low resistance value using conventional resistor forming methods.

An object of the present invention is to provide a resistor forming method that allows a resistor with a low resistance value to be obtained using a normal paste-like resistor material and allows fine adjustment of the resistance value.

[Means to solve the problem]

FIG. 1 is a side sectional view and a plan view showing a hybrid integrated circuit according to the present invention. The same objects are represented by the same symbols throughout the figures.

The above problem is solved by the hybrid integrated circuit of the present invention, which has at least a resistor 5 filled in a through hole 41 provided in a substrate 4, and a conductor pattern 6 provided on both sides of the resistor 5.

and a resistor forming method of the present invention, in which a through hole 41 provided in a substrate 4 is filled with a paste resistive material to form a resistor 5, and then conductor patterns 6 are formed on both sides of the resistor 5. and the conductor pattern 6 is composed of a comb-like pattern,
This is achieved by the resistance forming method of the present invention, which adjusts the resistance value by cutting the comb teeth 61.

[For production]

In FIG. 1, the hybrid integrated circuit of the present invention has a resistor filled in at least a through hole provided in a substrate, and a conductor pattern provided on both sides of the resistor. If the width of the resistor filled in the through hole is W, the length is W, and the thickness is t, then the resistance value R is as follows, which is the standard for the sheet resistance Rs. Since only the length of the resistor becomes extremely large compared to the film thickness of 20 μm, the ratio between the thickness t and the width W of the resistor becomes small, making it easy to form a resistor with a low resistance value.

Further, the resistor forming method of the present invention in which the conductor pattern is formed by combining comb-teeth patterns is equivalent to connecting a plurality of resistors in parallel with conductor patterns, and the comb-teeth can be cut with a laser beam or the like. This allows you to easily fine-tune the resistance value.

That is, a resistor with a low resistance value can be obtained using a normal paste-like resistor material, and a resistor formation method that allows fine adjustment of the resistance value can be realized.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to FIG.

The hybrid integrated circuit according to the present invention is constructed as shown in FIG. After forming the resistor 5, a conductor pattern 6 is provided on both surfaces thereof, and the conductor pattern 6 is composed of a comb-like pattern as shown in FIG. 1(b).

The resistance value of the resistor consisting of the resistor 5 and the conductor patterns 6 formed on both sides thereof is as described above, and when the thickness t of the resistor 5 is 1 mm and the sheet resistance Rs of the resistor material is 300Ω, the resistance value is 0. The length L and width W of the resistor for a resistance of about 2Ω are WL=1000x20x 300/0
．． 2=30X10'μm2=30mm2 That is, if the width W of the resistor is 6 mm, the length is only 5 mm, making it possible to easily form a resistor with a low resistance value.

In this method of forming a resistor, the length and width W of the resistor are determined by the through hole 41 provided in the substrate 4, and the precision thereof is not high. Is it necessary to fine-tune the resistance value after forming the resistor?

A resistor consisting of a resistor 5 and a conductor pattern 6 formed on both sides of the resistor is equivalent to a plurality of resistors connected in parallel with conductor patterns. For example, a rectangular conductor pattern is formed on both sides of the resistor 5, It is possible to finely adjust the resistance value by cutting out the conductor pattern using a laser beam or the like. However, if the conductor pattern on the resistor is cut out using a laser beam or the like, even the resistor will be destroyed.

Therefore, in the hybrid integrated circuit according to the present invention, as shown in FIG. The roots of the comb teeth 61 are on the substrate 4 made of ceramic or the like, and by cutting off the roots of the comb teeth 6I using a laser beam or the like, the conductor pattern can be easily cut out without destroying the resistor 5. I can do it.

In this way, the hybrid integrated circuit of the present invention having at least a resistor filled in a through hole provided in a substrate and a conductor pattern provided on both sides of the resistor has a film thickness that is a standard for sheet resistance. In comparison, the length of the resistor becomes extremely large, so the ratio between the thickness and the width of the resistor becomes small, making it easier to form a resistor with a low resistance value.

Further, the resistor forming method of the present invention in which the conductor pattern is formed by combining comb-teeth patterns is equivalent to connecting a plurality of resistors in parallel with conductor patterns, and the comb-teeth can be cut with a laser beam or the like. This allows you to easily fine-tune the resistance value. That is, a resistor with a low resistance value can be obtained using a normal paste-like resistor material, and a resistor formation method that is easy to finely adjust the resistance value can be realized.

〔Effect of the invention〕

As described above, according to the present invention, a resistor having a low resistance value can be obtained using a normal paste-like resistor material, and a resistor forming method can be provided in which the resistance value can be easily finely adjusted.

[Brief explanation of drawings]

FIG. 1 is a side sectional view and a plan view showing a hybrid integrated circuit according to the present invention, FIG. 2 is a circuit diagram showing an example of the hybrid integrated circuit, and FIG. 3 is a plan view showing a conventional method for forming a resistor. . In the figure, 4 represents a substrate, 5 a resistor, 6 a conductor pattern, 41 a through hole, and 61 a comb tooth. (, 4) , A-AWT plane (I)) , A-law order plane diagram showing the word #gut route for the whole moon (I) Figure 1

Claims (1)

[Claims] 1) A through hole (41) provided in at least the substrate (4)
1. A hybrid integrated circuit comprising a resistor (5) filled with a resistor (5) and a conductor pattern (6) provided on both sides of the resistor (5). 2) After filling the through hole (41) provided in the substrate (4) with a paste-like resistance material to form a resistor (5), conductor patterns (6) are formed on both sides of the resistor (5). A resistance forming method characterized by: 3) A method for forming a resistor, characterized in that the conductor pattern (6) according to claim 1 or 2 is constituted by a comb-like pattern, and the resistance value is adjusted by cutting the comb-teeth (61).