JPH04320008A - Chip resistor recognition method - Google Patents

Abstract

PURPOSE:To provide a chip resistor recognition method wherein any effect of halation is prevented to the utmost to reduce the rate of production of mistaken recognition as well as to simplify illumination setting. CONSTITUTION:Outside an area just above a chip resistor 1 a recognition CCD camera (optical recognition device) 20 is disposed on a straight line Z' slanted at an angle theta from a vertical straight line Z with respect to the resistor 1. Further, opposite side surfaces of the resistor 1 including an electrode 2 formed thereon are illuminated with a light ray 10 and various pieces of information on the resistor 1 are recognized with use of a camera 20. Reflected light ray from a glass layer 3 of the chip resistor 1 is substantially not incident on the camera 20.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip resistor recognition method for optically recognizing various information on a chip resistor.

0002

2. Description of the Related Art Chip resistors are generally manufactured by forming a large number of elements each having a resistor and an electrode (conductor) on a substrate, and then cutting the elements into individual pieces. The manufactured chip resistor undergoes optical recognition processing as shown in FIG. 2 in the manufacturing process. That is, both sides of the chip resistor 1 where the electrodes 2 are located are illuminated with a light beam 10 almost perpendicularly to the sides, and a recognition CCD as an optical recognition device is placed directly above the resistor 1.
The camera 20 recognizes information such as the surface state of the glass layer 3 (for example, the size and shape of the glass coat, or the state of markings of characters on the glass coat).

0003

By the way, as shown in FIG. 3, since the chip resistor 1 is generally provided with a glass layer 3 as a protective exterior, when the side surface on which the electrode 2 is located is illuminated with a light beam 10, A portion of the light beam 10 reaches both ends 3a of the glass layer 3
, 3b and is reflected upward to where the device 20 is located. These reflected light rays 10a and 10b cause an excessive amount of light required for recognition, causing halation. For this reason, the probability of misrecognizing the various types of information described above increases, resulting in a problem that accurate recognition is not performed.

On the other hand, in order to reduce the probability of misidentification due to halation as low as possible, it is necessary to fine-tune the position of the lighting, the angle of the lighting, the illuminance of the chip resistor, etc., and this adjustment work is extremely complicated and time-consuming. It takes. Therefore, in view of the above-mentioned problems, an object of the present invention is to provide a chip resistor recognition method that reduces the incidence of misidentification by minimizing the influence of halation and simplifies lighting settings. It's about doing.

[0005]

[Means for Solving the Problems] In order to achieve the above object, the chip resistor recognition method of the present invention differs from the conventional recognition method in that an optical recognition device is placed outside the area directly above the chip resistor. It is characterized by With this configuration,
Even if the light beam is reflected by the glass layer of the chip resistor,
The reflected light beam does not enter the optical recognition device and no halation occurs. Furthermore, since the recognition process is not affected by halation, it is not necessary to set the illumination as strictly as in the past.

In the recognition method of the present invention, if the optical recognition device is placed outside the area directly above the chip resistor, the reflected light from the chip resistor will hardly reach the device. There are basically no restrictions on placement. but,
If the device is moved far outside the directly overhead area, it will become difficult to recognize, so it is actually preferable to arrange it near the periphery of the directly overhead area. If the device is placed outside the immediate area, the device must be tilted toward the resistor so that the chip resistor is within the field of view of the device. This inclination angle is about 10 to 30 degrees, preferably about 15 to 20 degrees, when expressed as an angle θ (see FIG. 1) from a perpendicular line to the chip resistor.

[0007]

[Embodiments] The chip resistor recognition method of the present invention will be explained below based on embodiments. An example is shown in FIG. However, since the constituent elements are the same as in the prior art, they are given the same reference numerals as in the prior art. A recognition CCD camera 20 as an optical recognition device is placed outside the area directly above the chip resistor 1, and the camera 20 is tilted so as to capture the resistor 1 in its field of view. In this embodiment, the camera 20 is placed on a straight line Z' that is at an angle θ (for example, 20 degrees) from a vertical line Z to approximately the center of the chip resistor 1. The position of the camera 20 is on a perpendicular line Z'' to a horizontal line X passing through approximately the center of the chip resistor 1.

When both sides of the chip resistor 1 on which the electrodes 2 are formed are illuminated with a light beam 10, a portion of the light beam 10 illuminates both ends 3a of the glass layer 3 of the resistor 1, as shown in FIG. ,
3b, the reflected beams 10a, 10b travel above the resistor 1. However, since the camera 20 is placed outside the area directly above the resistor 1, the reflected light beams 10a and 10b hardly enter the camera 20. Therefore, no halation occurs, and information on the chip resistor 1 can be accurately recognized.

[0009]

Effects of the Invention As explained above, the chip resistor recognition method of the present invention has the following effects because the optical recognition device is disposed outside the region immediately above the chip resistor. (1) Since no halation occurs due to reflected light from the chip resistor, the possibility of misidentifying various information about the resistor is minimized. (2) There is no need to strictly set the position of the illumination, the angle of the illumination, the illuminance of the chip resistor, etc., and these settings become easy.

[Brief explanation of drawings]

FIG. 1 is a diagram for explaining the recognition method of the present invention.

FIG. 2 is a diagram for explaining a conventional recognition method.

FIG. 3 is an explanatory diagram showing a state where the side surface of the chip resistor is illuminated.

[Explanation of symbols]

1 Chip resistor 2 Electrode 3 Glass layer 10 Ray of light

Claims (1)

[Claims] Claims: 1. A recognition method in which an optical recognition device is disposed in a region directly above a chip resistor, the chip resistor is illuminated, and various information of the chip resistor is recognized by the optical recognition device. A method for recognizing a chip resistor, characterized by arranging an optical recognition device outside.