JPS6055480A - Pattern position recognizing method - Google Patents

Pattern position recognizing method

Info

Publication number
JPS6055480A
JPS6055480A JP58163175A JP16317583A JPS6055480A JP S6055480 A JPS6055480 A JP S6055480A JP 58163175 A JP58163175 A JP 58163175A JP 16317583 A JP16317583 A JP 16317583A JP S6055480 A JPS6055480 A JP S6055480A
Authority
JP
Japan
Prior art keywords
pattern
recognition
substrate
mark
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58163175A
Other languages
Japanese (ja)
Other versions
JPH0347550B2 (en
Inventor
Masao Ikehata
池端 昌夫
Yasuo Iguchi
泰男 井口
Yoshiro Takahashi
高橋 良郎
Isao Shibata
柴田 勲夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58163175A priority Critical patent/JPS6055480A/en
Publication of JPS6055480A publication Critical patent/JPS6055480A/en
Publication of JPH0347550B2 publication Critical patent/JPH0347550B2/ja
Granted legal-status Critical Current

Links

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  • Image Input (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To perform pattern position recognition with good identification by using transmitted light to recognize the position of a conductive pattern directly, and using it to form a pattern for recognition in correct position relation with the pattern. CONSTITUTION:A mark 23a larger than the target recognition mark is formed on the surface of a substrate 21 by using paste, etc., which is identified easily from the conductor pattern 22 and has a low reflection factor. Then the substrate 21 is placed on a transparent stage 17 and irradiated with light by a transmission illuminating device 16b from the reverse surface of the substrate to photograph the image by a television camera for pattern recognition supported on a prop 15 on the surface side of the substrate 21, recognizing the position of the pattern 22 from the black shade of the pattern 22. The recognition result is used to shape the mark 23a with a laser and the target mark 23b for recognition is formed.

Description

【発明の詳細な説明】 (技術分野) 本発明は高精度なパターン位置認識の方法に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a highly accurate pattern position recognition method.

(従来技術) 従来のパターン認識方法を第1図によって説明する。第
1図において1は可動ステージ、2は基板、3はパター
ン、4はパターン認識用テレビカメラ、5は支柱、6は
落射照明装置を示している。
(Prior Art) A conventional pattern recognition method will be explained with reference to FIG. In FIG. 1, 1 is a movable stage, 2 is a substrate, 3 is a pattern, 4 is a television camera for pattern recognition, 5 is a column, and 6 is an epi-illumination device.

基板2の表面に形成されたパターン3は、落射照明装置
6によって、基板2の表面側から照明され、i4ターン
認識用テレビカメラで撮影され電気信号に変換され認識
装置(図示せず)へ送られる。
The pattern 3 formed on the surface of the substrate 2 is illuminated from the surface side of the substrate 2 by an epi-illumination device 6, photographed by an i4 turn recognition television camera, converted into an electrical signal, and sent to a recognition device (not shown). It will be done.

しかし、アルミナ基板上に形成された金厚膜などの導体
パターンは、照明を反射して光シ、認識用テレビカメラ
を用いてパターン位置認識を行なう際に、アルミナ基板
と導体・母ターンとを識別することが困難であった。
However, conductor patterns such as thick gold films formed on alumina substrates reflect illumination and cause light rays, making it difficult to identify the alumina substrate and the conductor/mother turn when recognizing the pattern position using a recognition television camera. It was difficult to identify.

他の方法として、基板との識別が容易なインク等で基板
表面に・ぐターン位置認識用のマークを形成する方法も
考えられるが、この方法では、ノ4ターン形成と認識マ
ーク形成が個別の工程で行なわれるので、認識用マーク
と29ターンとの位置関係が正確に得られない欠点があ
った。
Another method is to form a mark for recognizing the turn position on the surface of the board using ink or the like that can be easily distinguished from the board, but in this method, the formation of the four turns and the formation of the recognition mark are done separately. Since this is done in a process, there is a drawback that the positional relationship between the recognition mark and the 29th turn cannot be accurately obtained.

(発明の目的及び構成) 本発明の目的は識別性の良い・ぞターン位置認識方法を
提供するにあシ、その特徴は、透過光を用いて直接導体
・やターンの位置を認識し、位置を認識した導体パター
ンを用いてパターンとの位置を正しく保った位置に認識
用の・ぐターンを形成するものであり以下詳細に説明す
る。
(Object and Structure of the Invention) An object of the present invention is to provide a method for recognizing the position of a conductor or a turn with good discrimination. This method uses the recognized conductor pattern to form a recognition pattern at a position that maintains the correct position with the pattern, and will be described in detail below.

(実施例) 第2図は、本発明の一実施例であって、11は可動ステ
ージ、14はパターン認識用テレビカメラ、15は支柱
、16aは落射照射装置、16bは透過照明装置、ノア
は透明ステージ板、2ノはアルミナ基板、22は導体パ
ターンである。これを動作するには、基板2ノを透明ス
テージ板17の上へ乗せ、透過照明装置で基板裏面から
光を当て、基板2ノの表面側に支柱15で支えである・
ぞターン認識用テレビカメラで撮影する。厚膜印刷に用
いられるアルミナ基板は、光を透過するが、導体パター
ンは光を透過しないので黒く見え容易にパターンを識別
することができる。
(Embodiment) FIG. 2 shows an embodiment of the present invention, in which 11 is a movable stage, 14 is a television camera for pattern recognition, 15 is a column, 16a is an epi-illumination device, 16b is a transmitted illumination device, and Noah is a A transparent stage plate, 2 is an alumina substrate, and 22 is a conductor pattern. To operate this, the substrate 2 is placed on the transparent stage plate 17, light is shined from the back side of the substrate using a transmitted illumination device, and the front side of the substrate 2 is supported by a support 15.
Take a picture with a TV camera for turn recognition. The alumina substrate used for thick film printing transmits light, but the conductor pattern does not transmit light, so it appears black and the pattern can be easily identified.

また、第3図に示すように、基板2ノの表面には導体パ
ターン22と容易に識別できる低反射率であるペースト
等で目的とする認識マークよりも大きなマーク23aを
形成しでおく。ついで第4図に示すよう−に基板裏面よ
シ光を当て、パターン22を黒色の影として導体パター
ン22の位置認識を行なう。この認識結果を用い第3図
に示すマーク23aをレーザーで整形し目的とする認識
用マーク23bを形成する。第5図には落射照明を用い
て実際に・リーン認識を行なっている様子を示した。パ
ターン22が光を反射して、基板21と識別することが
困難な場合にも、レーザーで整形し、ieターンとの位
置関係を正しく保った・ぐターン認識用マークを用いて
容易かつ正確にパターン位置を認識することが可能であ
る。
Further, as shown in FIG. 3, a mark 23a larger than the intended recognition mark is formed on the surface of the substrate 2 using a paste or the like having a low reflectance and easily distinguishable from the conductor pattern 22. Next, as shown in FIG. 4, light is applied to the back side of the substrate, and the position of the conductor pattern 22 is recognized by using the pattern 22 as a black shadow. Using this recognition result, the mark 23a shown in FIG. 3 is shaped with a laser to form the intended recognition mark 23b. Figure 5 shows how lean recognition is actually performed using epi-illumination. Even if the pattern 22 reflects light and is difficult to distinguish from the substrate 21, it can be easily and accurately identified by using a laser-shaped mark for recognizing the pattern and maintaining the correct positional relationship with the IE turn. It is possible to recognize the pattern position.

レーザーでパターン認識用マークを整形する時に、基板
裏面からの光で・す〜ンを認識する必要があるが、−直
線で並んでいない少なくとも3箇所の・母ターンを基板
裏面からの光を利用してパターン認識を行なうことにょ
シ縦、横方向および回転方向のズレを少なくすることが
できる。
When forming pattern recognition marks with a laser, it is necessary to recognize the marks using light from the back of the board, but it is necessary to use light from the back of the board to identify at least three mother turns that are not lined up in a straight line. By performing pattern recognition, it is possible to reduce deviations in the vertical, horizontal, and rotational directions.

(発明の効果) 本発明は・ぐターンまたはパターンとの位置関係を正確
に出した認識マークを用いてi4ターン認識を行なうの
で厚膜多層印刷やパターンとの位置関係を正確にする必
要のあるディスプレイ素子の搭載やワイヤーポンド、レ
ーザートリミングなどの位置合わせに応用できる。
(Effects of the Invention) The present invention performs i4 turn recognition using a recognition mark that accurately shows the positional relationship with the turn or pattern, so there is no need for thick film multilayer printing or accurate positional relationship with the pattern. It can be applied to positioning display elements, wire ponding, laser trimming, etc.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の・ぐターン認識方法、第2図は本発明の
第1の実施例、第3図及び第4図、第5図は本発明の第
2の実施例を示した図である。 11・・・可動ステージ、21・・・基板、22・・・
ノ9 p−ノ、14・・・パターン認識用テレビカメラ
、15・・支柱、16a・・・落射照明装置、16b・
・・透過照明装置、17・・・透明ステージ板、23a
・・・容易に識別できるインクで形成した認識用マーク
(整形前)、23b・・・23aをレーザー等で整形し
た認識マーク。 第3図 22 第4図 2 第5図 2 手続補正書輸発) 58、に二、1 昭和 年 月 日 特許庁長官 殿 1、事件の表示 昭和58年 特 許 願第163175号2、発明の名
称 ノやターン位置認識方法 3 補正をする者 事件との関係 特許出願人 第2図
FIG. 1 shows a conventional pattern recognition method, FIG. 2 shows a first embodiment of the present invention, and FIGS. 3, 4, and 5 show a second embodiment of the present invention. be. 11...Movable stage, 21...Substrate, 22...
9 p-ノ, 14... TV camera for pattern recognition, 15... Post, 16a... Epi-illumination device, 16b...
... Transmitted illumination device, 17... Transparent stage plate, 23a
. . . Recognition mark formed with ink for easy identification (before shaping), 23b . . . Recognition mark formed by shaping 23a with a laser or the like. Figure 3 22 Figure 4 2 Figure 5 2 Procedural Amendment (Import) 58, 2, 1 Showa Year Month Date Director General of the Patent Office 1. Indication of the Case 1988 Patent Application No. 163175 2. Invention Name and turn position recognition method 3 Relationship with the case of the person making the amendment Patent applicant Figure 2

Claims (1)

【特許請求の範囲】 金厚膜などの反射率の高い材質の導体・ぐターンと反射
率の低い材質の認識マークとが形成されたアルミナ基板
を可動ステージに搭載する第1過程と、前記アルミナ基
板の裏面側から当該アルミナ基板を照射し且つ表面側か
ら前記導体ノ4ターンを読み取シその導体・ぐターン位
置の認識結果に従って前記認識マークを整形する第2過
程とを備え。 前記アルミナ基板の表面側から照射することによって、
整形された認識マークを位置基準として用いることを特
徴としたノeターン位置認識方法。
[Claims] A first step of mounting an alumina substrate on a movable stage on which a conductor pattern made of a material with high reflectance such as a thick gold film and a recognition mark made of a material with low reflectance are formed; and a second step of irradiating the alumina substrate from the back side of the board, reading the four turns of the conductor from the front side, and shaping the recognition mark according to the recognition result of the position of the conductor. By irradiating from the surface side of the alumina substrate,
A no-e turn position recognition method characterized by using a shaped recognition mark as a position reference.
JP58163175A 1983-09-07 1983-09-07 Pattern position recognizing method Granted JPS6055480A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58163175A JPS6055480A (en) 1983-09-07 1983-09-07 Pattern position recognizing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58163175A JPS6055480A (en) 1983-09-07 1983-09-07 Pattern position recognizing method

Publications (2)

Publication Number Publication Date
JPS6055480A true JPS6055480A (en) 1985-03-30
JPH0347550B2 JPH0347550B2 (en) 1991-07-19

Family

ID=15768666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58163175A Granted JPS6055480A (en) 1983-09-07 1983-09-07 Pattern position recognizing method

Country Status (1)

Country Link
JP (1) JPS6055480A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246115A (en) * 1988-03-26 1989-10-02 Semiconductor Energy Lab Co Ltd Method for forming coating film of carbon or material composed mainly of carbon
JPH01276730A (en) * 1988-04-28 1989-11-07 Matsushita Electric Ind Co Ltd Substrate recognition and device therefor
US5094878A (en) * 1989-06-21 1992-03-10 Nippon Soken, Inc. Process for forming diamond film

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155802A (en) * 1980-05-06 1981-12-02 Fujitsu Ltd Recognition device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155802A (en) * 1980-05-06 1981-12-02 Fujitsu Ltd Recognition device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246115A (en) * 1988-03-26 1989-10-02 Semiconductor Energy Lab Co Ltd Method for forming coating film of carbon or material composed mainly of carbon
JPH01276730A (en) * 1988-04-28 1989-11-07 Matsushita Electric Ind Co Ltd Substrate recognition and device therefor
US5094878A (en) * 1989-06-21 1992-03-10 Nippon Soken, Inc. Process for forming diamond film

Also Published As

Publication number Publication date
JPH0347550B2 (en) 1991-07-19

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