JPS6167242A - Wafer accommodating jig - Google Patents

Abstract

PURPOSE:To obtain a wafer accommodating jig which has no fear of contaminating a wafer by dust or the like, by notching each of the side plate ridges which define the side walls of each of the water accommodating grooves. CONSTITUTION:Accommodating grooves 2 are formed in the opposing surfaces of two side plates of a box-like frame structure so that the grooves 2 face each other. Side plate ridges are respectively formed between each pair of adjacent grooves 2 and at each side of the groove 2 forming portion. Each of the ridges which define the side walls of each wafer accommodating groove 2 is notched as illustrated to form a notched side plate ridge 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer storage jig used for manufacturing semiconductor devices.

[Conventional technology]

To facilitate the handling of semiconductor thin plates (wafers) used in the manufacture of semiconductor devices, cleaning, etching, storage, etc. are handled using storage jigs. This storage jig is generally made of different materials depending on the process of use. Conventionally, this is the second jig of this type.
Figure 3 shows a plan view, and Figure 3 shows its front view. In the figure, (1) is a storage jig, (2) is a storage groove, and a wafer is stored in a lever item. In other words, Figure 4 is
In the cross-sectional view taken along the line ■-■ in the figure, the Waeno (3) indicated by the dashed line is accommodated as shown.

This housing jig (1) is used to clean and dry the nine wafers (3) housed in it.During the drying work after cleaning, the entire housing jig (1) is heated to an angle of 100 degrees, for example. , p, m, to dry the wafer 1 (3) in the storage jig (1).

[Problem that the invention seeks to solve]

Since such a housing jig (1) is made of a resin-based insulator, static electricity is generated due to friction with air during high-speed rotation, and the jig is charged. As a result, foreign matter such as dust floating around the bow 1 is attached and adheres to the entire storage jig (1).

By the way, both side walls of the accommodation groove (2) provided in the above-mentioned conventional accommodation jig (1) are continuously opposed to the outer circumference of the ueno (3), and there are many opportunities for contact with the outer periphery of the Ueno (3). (2)
There is a problem in that foreign matter and dust attached to the side walls of the wafer (3) adhere to the wafer (3) and cause defects in semiconductor elements formed on the wafer (3).

This invention was made to solve the above-mentioned problems, and there is little chance of contact between the side walls of the storage groove and the outer periphery of the wafer accommodated in the groove, and there is no possibility of contamination with foreign substances such as dust. The purpose is to obtain a jig that accommodates weight/%.

[Failure to solve the problem]

In the waeno storage groove device according to the present invention, the side plate protrusions constituting both side walls of each storage groove are notched to form notch-shaped side plate protrusions. Cut 9 into the wall plates on both sides of the storage groove.
The notch is provided to reduce the contact area with the outer circumference of the ueno 1 accommodated in the groove.

〔Example〕

FIG. 1 is a sectional view showing the structure of an embodiment of the present invention, in which parts such as beams are shown with the same reference numerals as those of the conventional example shown in FIGS. 2 to 4 described above.

Like the conventional example, this embodiment also has a box-shaped frame structure, and the wicks are centered on each other on the opposing surfaces of both side plates.
2) are formed, and of course side plate protrusions are formed between these adjacent grooves (2) and on both sides of the forming portion of fn (2). The feature of this embodiment is that the side plate protrusions constituting both side walls of the wafer storage groove (2) are notched as shown in the figure to form cutout-shaped side plate protrusions (4). At the point. The degree of processing is such that the wafers (3) housed in adjacent housing grooves (2) are held in an orderly manner, and the wafers (3) can be transferred between the housing jigs (1). It may be within a range that does not interfere with loading and unloading operations performed with the wafer (3) in a horizontal state.

With this configuration, the chances of contact between the side wall of the storage groove (2) and the wafer (3) during wafer storage, wafer transfer, loading, and unloading are reduced.

In addition, in the above embodiment, the notch-shaped convex strip (4) is a case in which a conventional convex strip is simply cut out,
As shown by broken lines in FIG. 1, the height and width of the protruding stripes may be changed appropriately.

〔Effect of the invention〕

As explained above, in the wafer/accommodating jig according to the present invention, the protruding portions of the side plates between adjacent wafer/accommodating grooves and on both sides of the forming portion of the accommodating groove are cut out, so that the wafers to be accommodated are The chance of contact with the periphery is reduced, reducing contamination of foreign substances on the wafer, and improving the manufacturing yield of semiconductor devices.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing the configuration of one embodiment of the present invention;
The figure is a plan view of the conventional one, FIG. 3 is a front view thereof, and FIG. 4 is a sectional view taken along the F/-M line in FIG. 2. In the figures, (1) is a storage jig, (2) is the accommodation groove, (3
) is a wafer, and (4) is a notch-shaped side plate protrusion. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] (1) A plurality of accommodating grooves are formed in opposing surfaces of both side plates in correspondence with each other, and the wafer is accommodated by inserting the peripheral edge of the wafer into each of the corresponding accommodating grooves of the both side plates. A wafer storage jig, characterized in that the protruding stripes of the side plate between the adjacent accommodation grooves and the protruding stripes of the side plate on both sides of the forming portion of the accommodation groove are cut out.