JPS6166946U - - Google Patents

Info

Publication number
JPS6166946U
JPS6166946U JP15150884U JP15150884U JPS6166946U JP S6166946 U JPS6166946 U JP S6166946U JP 15150884 U JP15150884 U JP 15150884U JP 15150884 U JP15150884 U JP 15150884U JP S6166946 U JPS6166946 U JP S6166946U
Authority
JP
Japan
Prior art keywords
semiconductor device
package
lead legs
adhered
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15150884U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15150884U priority Critical patent/JPS6166946U/ja
Publication of JPS6166946U publication Critical patent/JPS6166946U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案の一実施例による半
導体装置の側面図及びその斜視図、第3図、第4
図及び第5図はそれぞれ従来例の説明図である。 1…半導体装置、11…パツケージ、12…リ
ード足、6…導電シール、61…取手部、7…接
着剤。
1 and 2 are a side view and a perspective view of a semiconductor device according to an embodiment of the present invention, and FIGS.
5 and 5 are explanatory diagrams of conventional examples, respectively. DESCRIPTION OF SYMBOLS 1...Semiconductor device, 11...Package, 12...Lead leg, 6...Conductive seal, 61...Handle part, 7...Adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パツケージからリード足が突出された半導体装
置において、前記パツケージ下面に、該パツケー
ジの一部に接着して前記リード足のすべてに電気
的に接触してなるサージ破壊防止用の導電シール
を着脱自在に装着したことを特徴とする半導体装
置。
In a semiconductor device in which lead legs protrude from a package, a conductive seal for preventing surge damage, which is adhered to a part of the package and electrically contacts all of the lead legs, is removably attached to the bottom surface of the package. A semiconductor device characterized by being equipped with a semiconductor device.
JP15150884U 1984-10-05 1984-10-05 Pending JPS6166946U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15150884U JPS6166946U (en) 1984-10-05 1984-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15150884U JPS6166946U (en) 1984-10-05 1984-10-05

Publications (1)

Publication Number Publication Date
JPS6166946U true JPS6166946U (en) 1986-05-08

Family

ID=30709618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15150884U Pending JPS6166946U (en) 1984-10-05 1984-10-05

Country Status (1)

Country Link
JP (1) JPS6166946U (en)

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